TWI871934B - 用於積體電路的自動化測試系統 - Google Patents

用於積體電路的自動化測試系統 Download PDF

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Publication number
TWI871934B
TWI871934B TW113108773A TW113108773A TWI871934B TW I871934 B TWI871934 B TW I871934B TW 113108773 A TW113108773 A TW 113108773A TW 113108773 A TW113108773 A TW 113108773A TW I871934 B TWI871934 B TW I871934B
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Taiwan
Prior art keywords
radiation beam
pulse
radiation
signal
signal conversion
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TW113108773A
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English (en)
Chinese (zh)
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TW202426954A (zh
Inventor
布萊恩愛德華 科爾
達瑞斯 蘇利文
賽門 山德勒
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英商塔拉檢視有限公司
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Publication of TW202426954A publication Critical patent/TW202426954A/zh
Application granted granted Critical
Publication of TWI871934B publication Critical patent/TWI871934B/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/31728—Optical aspects, e.g. opto-electronics used for testing, optical signal transmission for testing electronic circuits, electro-optic components to be tested in combination with electronic circuits, measuring light emission of digital circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R35/00—Testing or calibrating of apparatus covered by the other groups of this subclass
    • G01R35/005—Calibrating; Standards or reference devices, e.g. voltage or resistance standards, "golden" references

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Health & Medical Sciences (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
TW113108773A 2015-12-18 2016-12-19 用於積體電路的自動化測試系統 TWI871934B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB1522432.2A GB2545496B (en) 2015-12-18 2015-12-18 A Test System
GB1522432.2 2015-12-18

Publications (2)

Publication Number Publication Date
TW202426954A TW202426954A (zh) 2024-07-01
TWI871934B true TWI871934B (zh) 2025-02-01

Family

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Family Applications (3)

Application Number Title Priority Date Filing Date
TW105142033A TWI794151B (zh) 2015-12-18 2016-12-19 用於積體電路的自動化測試系統
TW113108773A TWI871934B (zh) 2015-12-18 2016-12-19 用於積體電路的自動化測試系統
TW111142692A TWI838948B (zh) 2015-12-18 2016-12-19 用於積體電路的自動化測試系統

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TW105142033A TWI794151B (zh) 2015-12-18 2016-12-19 用於積體電路的自動化測試系統

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TW111142692A TWI838948B (zh) 2015-12-18 2016-12-19 用於積體電路的自動化測試系統

Country Status (8)

Country Link
US (3) US11366158B2 (enExample)
EP (1) EP3391065B1 (enExample)
JP (3) JP2019505776A (enExample)
KR (1) KR20180096717A (enExample)
CN (1) CN108474821B (enExample)
GB (1) GB2545496B (enExample)
TW (3) TWI794151B (enExample)
WO (1) WO2017103619A1 (enExample)

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CN113742034B (zh) * 2020-05-29 2025-01-14 北京沃东天骏信息技术有限公司 事件处理方法与装置、计算机可读存储介质、电子设备
US11598789B2 (en) * 2021-01-27 2023-03-07 Formfactor, Inc. Probe systems configured to test a device under test and methods of operating the probe systems
CN113567829B (zh) * 2021-06-18 2024-08-27 合肥联宝信息技术有限公司 一种电路板的测试方法及装置
TWI785801B (zh) * 2021-09-15 2022-12-01 英業達股份有限公司 測試輻射敏感度之方法及系統
CN116233638B (zh) * 2021-12-02 2025-11-11 电连技术股份有限公司 电子接触件射频测试装置
CN114460446B (zh) * 2022-03-02 2024-06-14 本源量子计算科技（合肥）股份有限公司 一种量子芯片检测系统及检测方法
CN114942376B (zh) * 2022-05-20 2025-03-11 国汽智控(北京)科技有限公司 电路板信号检测装置及检测方法
TWI850888B (zh) * 2022-12-02 2024-08-01 國立高雄科技大學 量測輔助系統及方法
CN117388544B (zh) * 2023-12-12 2024-03-15 扬州奕丞科技有限公司 一种半导体检测用探针台

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Also Published As

Publication number Publication date
GB2545496B (en) 2020-06-03
CN108474821A (zh) 2018-08-31
KR20180096717A (ko) 2018-08-29
US11366158B2 (en) 2022-06-21
EP3391065B1 (en) 2024-04-10
JP2019505776A (ja) 2019-02-28
US11921154B2 (en) 2024-03-05
US20240192270A1 (en) 2024-06-13
US12392820B2 (en) 2025-08-19
TW202426954A (zh) 2024-07-01
JP2021170040A (ja) 2021-10-28
US20220268833A1 (en) 2022-08-25
GB2545496A (en) 2017-06-21
TW201800769A (zh) 2018-01-01
TWI794151B (zh) 2023-03-01
WO2017103619A1 (en) 2017-06-22
US20180364301A1 (en) 2018-12-20
GB201522432D0 (en) 2016-02-03
EP3391065A1 (en) 2018-10-24
TWI838948B (zh) 2024-04-11
TW202309542A (zh) 2023-03-01
CN108474821B (zh) 2024-10-29
JP2024051131A (ja) 2024-04-10

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