KR20180096717A - 테스트 시스템 - Google Patents
테스트 시스템 Download PDFInfo
- Publication number
- KR20180096717A KR20180096717A KR1020187020701A KR20187020701A KR20180096717A KR 20180096717 A KR20180096717 A KR 20180096717A KR 1020187020701 A KR1020187020701 A KR 1020187020701A KR 20187020701 A KR20187020701 A KR 20187020701A KR 20180096717 A KR20180096717 A KR 20180096717A
- Authority
- KR
- South Korea
- Prior art keywords
- radiation
- probe
- pulse
- signal
- under test
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/31728—Optical aspects, e.g. opto-electronics used for testing, optical signal transmission for testing electronic circuits, electro-optic components to be tested in combination with electronic circuits, measuring light emission of digital circuits
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R35/00—Testing or calibrating of apparatus covered by the other groups of this subclass
- G01R35/005—Calibrating; Standards or reference devices, e.g. voltage or resistance standards, "golden" references
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Health & Medical Sciences (AREA)
- Tests Of Electronic Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB1522432.2A GB2545496B (en) | 2015-12-18 | 2015-12-18 | A Test System |
| GB1522432.2 | 2015-12-18 | ||
| PCT/GB2016/053976 WO2017103619A1 (en) | 2015-12-18 | 2016-12-16 | A test system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20180096717A true KR20180096717A (ko) | 2018-08-29 |
Family
ID=55311263
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020187020701A Pending KR20180096717A (ko) | 2015-12-18 | 2016-12-16 | 테스트 시스템 |
Country Status (8)
| Country | Link |
|---|---|
| US (3) | US11366158B2 (enExample) |
| EP (1) | EP3391065B1 (enExample) |
| JP (3) | JP2019505776A (enExample) |
| KR (1) | KR20180096717A (enExample) |
| CN (1) | CN108474821B (enExample) |
| GB (1) | GB2545496B (enExample) |
| TW (3) | TWI794151B (enExample) |
| WO (1) | WO2017103619A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20230122670A (ko) * | 2021-01-27 | 2023-08-22 | 폼팩터, 인크. | 피시험 디바이스를 테스트하도록 구성된 프로브 시스템및 프로브 시스템 동작 방법 |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10473719B2 (en) * | 2017-10-12 | 2019-11-12 | Keysight Technologies, Inc. | System and method for separating and measuring two signals simultaneously present on a signal line |
| US10910786B2 (en) * | 2018-07-23 | 2021-02-02 | University Of Maryland, College Park | Laser cavity optical alignment |
| US11454665B2 (en) * | 2018-07-26 | 2022-09-27 | Texas Instruments Incorporated | Integrated circuit spike check test point identification apparatus and method |
| US11061099B2 (en) * | 2018-09-18 | 2021-07-13 | Keysight Technologies, Inc. | Systems and methods for calibrating a wafer inspection apparatus |
| US11454799B2 (en) * | 2019-01-29 | 2022-09-27 | Formfactor, Inc. | Microscopes with objective assembly crash detection and methods of utiliizing the same |
| CN113742034B (zh) * | 2020-05-29 | 2025-01-14 | 北京沃东天骏信息技术有限公司 | 事件处理方法与装置、计算机可读存储介质、电子设备 |
| CN113567829B (zh) * | 2021-06-18 | 2024-08-27 | 合肥联宝信息技术有限公司 | 一种电路板的测试方法及装置 |
| TWI785801B (zh) * | 2021-09-15 | 2022-12-01 | 英業達股份有限公司 | 測試輻射敏感度之方法及系統 |
| CN116233638B (zh) * | 2021-12-02 | 2025-11-11 | 电连技术股份有限公司 | 电子接触件射频测试装置 |
| CN114460446B (zh) * | 2022-03-02 | 2024-06-14 | 本源量子计算科技(合肥)股份有限公司 | 一种量子芯片检测系统及检测方法 |
| CN114942376B (zh) * | 2022-05-20 | 2025-03-11 | 国汽智控(北京)科技有限公司 | 电路板信号检测装置及检测方法 |
| TWI850888B (zh) * | 2022-12-02 | 2024-08-01 | 國立高雄科技大學 | 量測輔助系統及方法 |
| CN117388544B (zh) * | 2023-12-12 | 2024-03-15 | 扬州奕丞科技有限公司 | 一种半导体检测用探针台 |
Family Cites Families (52)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3169292D1 (en) * | 1980-11-17 | 1985-04-18 | Hitachi Ltd | Assembling or processing system |
| US4507605A (en) * | 1982-05-17 | 1985-03-26 | Testamatic, Incorporated | Method and apparatus for electrical and optical inspection and testing of unpopulated printed circuit boards and other like items |
| JPH05288516A (ja) | 1992-04-07 | 1993-11-02 | Honda Motor Co Ltd | 非接触式位置検出装置 |
| JP3219844B2 (ja) * | 1992-06-01 | 2001-10-15 | 東京エレクトロン株式会社 | プローブ装置 |
| JPH06102287A (ja) * | 1992-09-22 | 1994-04-15 | Matsushita Electric Ind Co Ltd | 微小電気信号測定用プローブ |
| JPH0792227A (ja) | 1993-09-24 | 1995-04-07 | Toyota Motor Corp | 回路基板の検査装置及び検査方法 |
| KR100248569B1 (ko) * | 1993-12-22 | 2000-03-15 | 히가시 데쓰로 | 프로우브장치 |
| US5778016A (en) | 1994-04-01 | 1998-07-07 | Imra America, Inc. | Scanning temporal ultrafast delay methods and apparatuses therefor |
| WO1996029607A1 (en) | 1995-03-18 | 1996-09-26 | Tokyo Electron Limited | Method and apparatus for inspecting substrate |
| JP3376731B2 (ja) * | 1994-11-09 | 2003-02-10 | 東京エレクトロン株式会社 | 高周波用のプリント基板及びこれを用いたプローブカード |
| KR0176627B1 (ko) | 1995-12-30 | 1999-05-15 | 김광호 | 인쇄회로기판의 통전검사용 프로브 장치 |
| JP2870496B2 (ja) * | 1996-07-29 | 1999-03-17 | 日本電気株式会社 | 回路基板プロービング装置及び方法 |
| DE19700505A1 (de) | 1997-01-09 | 1998-07-16 | Atg Test Systems Gmbh | Verfahren zum Prüfen von Leiterplatten |
| JPH11304419A (ja) | 1998-04-17 | 1999-11-05 | Advantest Corp | 試料検査装置の調整方法 |
| US6239590B1 (en) | 1998-05-26 | 2001-05-29 | Micron Technology, Inc. | Calibration target for calibrating semiconductor wafer test systems |
| JP4713763B2 (ja) * | 2000-05-18 | 2011-06-29 | 株式会社アドバンテスト | プローブの位置ずれ検出方法・プローブの位置決定方法・プローブの位置ずれ検出装置・プローブの位置決定装置 |
| JP2002005959A (ja) * | 2000-06-22 | 2002-01-09 | Nidec-Read Corp | 同軸型コンタクトプローブ及び多点測定用コンタクトプローブ |
| US6627254B1 (en) * | 2000-09-20 | 2003-09-30 | Seagate Technology Llc | Method of manufacturing a recording media with mechanically patterned landing zone |
| US6734681B2 (en) | 2001-08-10 | 2004-05-11 | James Sabey | Apparatus and methods for testing circuit boards |
| DE60107881T2 (de) | 2001-08-10 | 2005-12-22 | Mania Entwicklungsgesellschaft Mbh | Vorrichtung und verfahren zur prüfung von unbestückten gedruckten schaltungen |
| DE10160119A1 (de) * | 2001-12-07 | 2003-10-02 | Atg Test Systems Gmbh | Prüfsonde für einen Fingertester |
| JP3945638B2 (ja) * | 2002-04-19 | 2007-07-18 | 富士通株式会社 | 検査方法及び検査装置 |
| JP4043339B2 (ja) * | 2002-10-22 | 2008-02-06 | 川崎マイクロエレクトロニクス株式会社 | 試験方法および試験装置 |
| US8466703B2 (en) | 2003-03-14 | 2013-06-18 | Rudolph Technologies, Inc. | Probe card analysis system and method |
| DE10320925B4 (de) | 2003-05-09 | 2007-07-05 | Atg Test Systems Gmbh & Co.Kg | Verfahren zum Testen von unbestückten Leiterplatten |
| JP4339631B2 (ja) | 2003-06-20 | 2009-10-07 | 東京エレクトロン株式会社 | 検査方法及び検査装置 |
| EP1715377A4 (en) * | 2004-01-29 | 2011-04-27 | Nishizawa Junichi | DEVICE FOR GENERATING ELECTROMAGNETIC WAVES |
| JP2006049599A (ja) * | 2004-08-05 | 2006-02-16 | Seiko Epson Corp | ウェハプローバ及び半導体装置の製造方法、半導体試験装置 |
| JP2006135129A (ja) | 2004-11-08 | 2006-05-25 | Seiko Epson Corp | 半導体検査装置及び半導体装置の製造方法 |
| US7323897B2 (en) * | 2004-12-16 | 2008-01-29 | Verigy (Singapore) Pte. Ltd. | Mock wafer, system calibrated using mock wafer, and method for calibrating automated test equipment |
| US7342644B2 (en) * | 2004-12-29 | 2008-03-11 | Asml Netherlands B.V. | Methods and systems for lithographic beam generation |
| US7281181B2 (en) | 2005-06-27 | 2007-10-09 | Verigy (Singapore) Pte. Ltd. | Systems, methods and computer programs for calibrating an automated circuit test system |
| TWI362717B (en) * | 2005-10-18 | 2012-04-21 | Gsi Group Corp | Methods for alignment utilizing an optical reference |
| US7280190B1 (en) | 2006-06-21 | 2007-10-09 | Intel Corporation | Electro-optic time domain reflectometry |
| JP2008082912A (ja) | 2006-09-28 | 2008-04-10 | Micronics Japan Co Ltd | 電気的接続装置 |
| CN102017147B (zh) * | 2007-04-18 | 2014-01-29 | 因维萨热技术公司 | 用于光电装置的材料、系统和方法 |
| US7808259B2 (en) * | 2007-09-26 | 2010-10-05 | Formfactor, Inc. | Component assembly and alignment |
| US8320711B2 (en) * | 2007-12-05 | 2012-11-27 | Biosense Webster, Inc. | Anatomical modeling from a 3-D image and a surface mapping |
| US20130002285A1 (en) * | 2010-03-10 | 2013-01-03 | Johnstech International Corporation | Electrically Conductive Pins For Microcircuit Tester |
| JP5421763B2 (ja) * | 2009-12-24 | 2014-02-19 | ヤマハ発動機株式会社 | 検査装置および検査方法 |
| JP5397817B2 (ja) * | 2010-02-05 | 2014-01-22 | 国立大学法人名古屋大学 | 干渉測定装置および測定方法 |
| JP5461268B2 (ja) * | 2010-03-29 | 2014-04-02 | 日置電機株式会社 | 基板検査システム |
| WO2011156810A2 (en) * | 2010-06-11 | 2011-12-15 | The Florida International University Board Of Trustees | Second generation hand-held optical imager |
| GB2488515B (en) * | 2011-02-11 | 2015-05-20 | Teraview Ltd | A test system |
| US20120274338A1 (en) * | 2011-04-29 | 2012-11-01 | International Business Machines Corporation | High performance time domain reflectometry |
| US20130015871A1 (en) * | 2011-07-11 | 2013-01-17 | Cascade Microtech, Inc. | Systems, devices, and methods for two-sided testing of electronic devices |
| US8860456B2 (en) * | 2011-08-02 | 2014-10-14 | Medtronic, Inc. | Non-destructive tilt data measurement to detect defective bumps |
| TW201341756A (zh) | 2011-11-30 | 2013-10-16 | 尼康股份有限公司 | 形狀測定裝置、形狀測定方法、及記錄有其程式之記錄媒體 |
| CN104204818B (zh) * | 2012-03-23 | 2017-05-24 | 爱德万测试公司 | 用于半导体测试的横向驱动探针 |
| US10281518B2 (en) | 2014-02-25 | 2019-05-07 | Formfactor Beaverton, Inc. | Systems and methods for on-wafer dynamic testing of electronic devices |
| CN107004554B (zh) * | 2014-06-25 | 2019-06-04 | Fei埃法有限公司 | 使用在线纳米探测的贯穿工艺流程的芯片内和芯片间的电分析和过程控制 |
| TWI568571B (zh) * | 2015-08-28 | 2017-02-01 | 東友科技股份有限公司 | 列印平台調校系統及其調校方法 |
-
2015
- 2015-12-18 GB GB1522432.2A patent/GB2545496B/en active Active
-
2016
- 2016-12-16 US US16/061,375 patent/US11366158B2/en active Active
- 2016-12-16 CN CN201680073842.7A patent/CN108474821B/zh active Active
- 2016-12-16 KR KR1020187020701A patent/KR20180096717A/ko active Pending
- 2016-12-16 WO PCT/GB2016/053976 patent/WO2017103619A1/en not_active Ceased
- 2016-12-16 EP EP16828960.1A patent/EP3391065B1/en active Active
- 2016-12-16 JP JP2018531514A patent/JP2019505776A/ja active Pending
- 2016-12-19 TW TW105142033A patent/TWI794151B/zh active
- 2016-12-19 TW TW113108773A patent/TWI871934B/zh active
- 2016-12-19 TW TW111142692A patent/TWI838948B/zh active
-
2021
- 2021-08-04 JP JP2021128013A patent/JP2021170040A/ja active Pending
-
2022
- 2022-05-16 US US17/745,054 patent/US11921154B2/en active Active
-
2024
- 2024-02-23 US US18/585,589 patent/US12392820B2/en active Active
- 2024-02-29 JP JP2024029454A patent/JP2024051131A/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20230122670A (ko) * | 2021-01-27 | 2023-08-22 | 폼팩터, 인크. | 피시험 디바이스를 테스트하도록 구성된 프로브 시스템및 프로브 시스템 동작 방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| GB2545496B (en) | 2020-06-03 |
| CN108474821A (zh) | 2018-08-31 |
| TWI871934B (zh) | 2025-02-01 |
| US11366158B2 (en) | 2022-06-21 |
| EP3391065B1 (en) | 2024-04-10 |
| JP2019505776A (ja) | 2019-02-28 |
| US11921154B2 (en) | 2024-03-05 |
| US20240192270A1 (en) | 2024-06-13 |
| US12392820B2 (en) | 2025-08-19 |
| TW202426954A (zh) | 2024-07-01 |
| JP2021170040A (ja) | 2021-10-28 |
| US20220268833A1 (en) | 2022-08-25 |
| GB2545496A (en) | 2017-06-21 |
| TW201800769A (zh) | 2018-01-01 |
| TWI794151B (zh) | 2023-03-01 |
| WO2017103619A1 (en) | 2017-06-22 |
| US20180364301A1 (en) | 2018-12-20 |
| GB201522432D0 (en) | 2016-02-03 |
| EP3391065A1 (en) | 2018-10-24 |
| TWI838948B (zh) | 2024-04-11 |
| TW202309542A (zh) | 2023-03-01 |
| CN108474821B (zh) | 2024-10-29 |
| JP2024051131A (ja) | 2024-04-10 |
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