TWI870491B - 連接體之製造方法、異向性導電接合膜、及連接體 - Google Patents
連接體之製造方法、異向性導電接合膜、及連接體 Download PDFInfo
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- TWI870491B TWI870491B TW109136910A TW109136910A TWI870491B TW I870491 B TWI870491 B TW I870491B TW 109136910 A TW109136910 A TW 109136910A TW 109136910 A TW109136910 A TW 109136910A TW I870491 B TWI870491 B TW I870491B
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- Prior art keywords
- anisotropic conductive
- solder particles
- conductive bonding
- electrode
- electronic component
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Inorganic Chemistry (AREA)
- Wire Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Non-Insulated Conductors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019194428A JP7032367B2 (ja) | 2019-10-25 | 2019-10-25 | 接続体の製造方法、異方性導電接合材料、及び接続体 |
| JPJP2019-194428 | 2019-10-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202122535A TW202122535A (zh) | 2021-06-16 |
| TWI870491B true TWI870491B (zh) | 2025-01-21 |
Family
ID=75620520
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW109136910A TWI870491B (zh) | 2019-10-25 | 2020-10-23 | 連接體之製造方法、異向性導電接合膜、及連接體 |
Country Status (5)
| Country | Link |
|---|---|
| JP (2) | JP7032367B2 (enExample) |
| KR (1) | KR102707134B1 (enExample) |
| CN (1) | CN114502685B (enExample) |
| TW (1) | TWI870491B (enExample) |
| WO (1) | WO2021079812A1 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023092710A (ja) * | 2021-12-22 | 2023-07-04 | デクセリアルズ株式会社 | 接続構造体及び接続構造体の製造方法 |
| KR102677735B1 (ko) * | 2021-12-28 | 2024-06-24 | 주식회사 노피온 | 이방성 도전접착제 및 이의 조성물 |
| WO2023189416A1 (ja) | 2022-03-31 | 2023-10-05 | デクセリアルズ株式会社 | 導電フィルム、接続構造体及びその製造方法 |
| WO2024071265A1 (ja) | 2022-09-30 | 2024-04-04 | 日東電工株式会社 | 接合シート |
| WO2025211339A1 (ja) * | 2024-04-03 | 2025-10-09 | 日東電工株式会社 | 導電組成物、導電シート、接続構造体、接続構造体の製造方法、積層体、及び、積層体の製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1820361A (zh) * | 2003-02-05 | 2006-08-16 | 千住金属工业株式会社 | 端子间的连接方法及半导体装置的安装方法 |
| TW201629988A (zh) * | 2014-12-26 | 2016-08-16 | Sekisui Chemical Co Ltd | 導電糊、連接構造體及連接構造體之製造方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3769688B2 (ja) * | 2003-02-05 | 2006-04-26 | 独立行政法人科学技術振興機構 | 端子間の接続方法及び半導体装置の実装方法 |
| JP5032938B2 (ja) | 2007-10-24 | 2012-09-26 | パナソニック株式会社 | 熱硬化性樹脂組成物及びその製造方法 |
| JP2009147231A (ja) * | 2007-12-17 | 2009-07-02 | Hitachi Chem Co Ltd | 実装方法、半導体チップ、及び半導体ウエハ |
| JP2010040893A (ja) * | 2008-08-07 | 2010-02-18 | Sumitomo Bakelite Co Ltd | 端子間の接続方法、それを用いた半導体装置の製造方法、および導電性粒子の凝集方法 |
| JP5728803B2 (ja) * | 2008-09-30 | 2015-06-03 | デクセリアルズ株式会社 | 異方性導電接着剤及びそれを用いた接続構造体の製造方法 |
| JP6114627B2 (ja) | 2012-05-18 | 2017-04-12 | 積水化学工業株式会社 | 導電材料、接続構造体及び接続構造体の製造方法 |
| JP6114557B2 (ja) * | 2013-01-10 | 2017-04-12 | 積水化学工業株式会社 | 導電材料及び接続構造体の製造方法 |
| WO2015056754A1 (ja) * | 2013-10-17 | 2015-04-23 | デクセリアルズ株式会社 | 異方性導電接着剤及び接続構造体 |
| JP2015193683A (ja) * | 2014-03-31 | 2015-11-05 | デクセリアルズ株式会社 | 熱硬化性接着組成物、及び熱硬化性接着シート |
| JP6557591B2 (ja) | 2014-12-26 | 2019-08-07 | 積水化学工業株式会社 | 導電フィルム、接続構造体及び接続構造体の製造方法 |
| KR101820214B1 (ko) * | 2015-11-27 | 2018-01-18 | 이경섭 | 미세피치용 이방성 도전 접착제 제조방법 및 이 방법에 의해 제조된 미세피치용 이방성 도전 접착제 |
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| CN1820361A (zh) * | 2003-02-05 | 2006-08-16 | 千住金属工业株式会社 | 端子间的连接方法及半导体装置的安装方法 |
| TW201629988A (zh) * | 2014-12-26 | 2016-08-16 | Sekisui Chemical Co Ltd | 導電糊、連接構造體及連接構造體之製造方法 |
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| JP7432633B2 (ja) | 2024-02-16 |
| JP7032367B2 (ja) | 2022-03-08 |
| WO2021079812A1 (ja) | 2021-04-29 |
| TW202122535A (zh) | 2021-06-16 |
| JP2021068842A (ja) | 2021-04-30 |
| CN114502685A (zh) | 2022-05-13 |
| KR20220062055A (ko) | 2022-05-13 |
| KR102707134B1 (ko) | 2024-09-13 |
| CN114502685B (zh) | 2024-04-12 |
| JP2022060494A (ja) | 2022-04-14 |
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