JP7032367B2 - 接続体の製造方法、異方性導電接合材料、及び接続体 - Google Patents

接続体の製造方法、異方性導電接合材料、及び接続体 Download PDF

Info

Publication number
JP7032367B2
JP7032367B2 JP2019194428A JP2019194428A JP7032367B2 JP 7032367 B2 JP7032367 B2 JP 7032367B2 JP 2019194428 A JP2019194428 A JP 2019194428A JP 2019194428 A JP2019194428 A JP 2019194428A JP 7032367 B2 JP7032367 B2 JP 7032367B2
Authority
JP
Japan
Prior art keywords
solder particles
anisotropic conductive
conductive bonding
less
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019194428A
Other languages
English (en)
Japanese (ja)
Other versions
JP2021068842A (ja
Inventor
智幸 阿部
朋之 石松
正治 青木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Priority to JP2019194428A priority Critical patent/JP7032367B2/ja
Priority to PCT/JP2020/038842 priority patent/WO2021079812A1/ja
Priority to KR1020227011856A priority patent/KR102707134B1/ko
Priority to CN202080071245.7A priority patent/CN114502685B/zh
Priority to TW109136910A priority patent/TWI870491B/zh
Publication of JP2021068842A publication Critical patent/JP2021068842A/ja
Priority to JP2022026731A priority patent/JP7432633B2/ja
Application granted granted Critical
Publication of JP7032367B2 publication Critical patent/JP7032367B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Non-Insulated Conductors (AREA)
JP2019194428A 2019-10-25 2019-10-25 接続体の製造方法、異方性導電接合材料、及び接続体 Active JP7032367B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2019194428A JP7032367B2 (ja) 2019-10-25 2019-10-25 接続体の製造方法、異方性導電接合材料、及び接続体
PCT/JP2020/038842 WO2021079812A1 (ja) 2019-10-25 2020-10-14 接続体の製造方法、異方性導電接合材料、及び接続体
KR1020227011856A KR102707134B1 (ko) 2019-10-25 2020-10-14 접속체의 제조 방법, 이방성 도전 접합 재료, 및 접속체
CN202080071245.7A CN114502685B (zh) 2019-10-25 2020-10-14 连接体的制备方法、各向异性导电接合材料及连接体
TW109136910A TWI870491B (zh) 2019-10-25 2020-10-23 連接體之製造方法、異向性導電接合膜、及連接體
JP2022026731A JP7432633B2 (ja) 2019-10-25 2022-02-24 接続体の製造方法、異方性導電接合材料、及び接続体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019194428A JP7032367B2 (ja) 2019-10-25 2019-10-25 接続体の製造方法、異方性導電接合材料、及び接続体

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2022026731A Division JP7432633B2 (ja) 2019-10-25 2022-02-24 接続体の製造方法、異方性導電接合材料、及び接続体

Publications (2)

Publication Number Publication Date
JP2021068842A JP2021068842A (ja) 2021-04-30
JP7032367B2 true JP7032367B2 (ja) 2022-03-08

Family

ID=75620520

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2019194428A Active JP7032367B2 (ja) 2019-10-25 2019-10-25 接続体の製造方法、異方性導電接合材料、及び接続体
JP2022026731A Active JP7432633B2 (ja) 2019-10-25 2022-02-24 接続体の製造方法、異方性導電接合材料、及び接続体

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2022026731A Active JP7432633B2 (ja) 2019-10-25 2022-02-24 接続体の製造方法、異方性導電接合材料、及び接続体

Country Status (5)

Country Link
JP (2) JP7032367B2 (enExample)
KR (1) KR102707134B1 (enExample)
CN (1) CN114502685B (enExample)
TW (1) TWI870491B (enExample)
WO (1) WO2021079812A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023092710A (ja) * 2021-12-22 2023-07-04 デクセリアルズ株式会社 接続構造体及び接続構造体の製造方法
KR102677735B1 (ko) * 2021-12-28 2024-06-24 주식회사 노피온 이방성 도전접착제 및 이의 조성물
WO2023189416A1 (ja) 2022-03-31 2023-10-05 デクセリアルズ株式会社 導電フィルム、接続構造体及びその製造方法
WO2024071265A1 (ja) 2022-09-30 2024-04-04 日東電工株式会社 接合シート
WO2025211339A1 (ja) * 2024-04-03 2025-10-09 日東電工株式会社 導電組成物、導電シート、接続構造体、接続構造体の製造方法、積層体、及び、積層体の製造方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004260131A (ja) 2003-02-05 2004-09-16 Japan Science & Technology Agency 端子間の接続方法及び半導体装置の実装方法
JP2009147231A (ja) 2007-12-17 2009-07-02 Hitachi Chem Co Ltd 実装方法、半導体チップ、及び半導体ウエハ
WO2010038753A1 (ja) 2008-09-30 2010-04-08 ソニーケミカル＆インフォメーションデバイス株式会社 異方性導電接着剤及びそれを用いた接続構造体の製造方法
JP2014135207A (ja) 2013-01-10 2014-07-24 Sekisui Chem Co Ltd 導電材料、接続構造体及び接続構造体の製造方法
WO2015056754A1 (ja) 2013-10-17 2015-04-23 デクセリアルズ株式会社 異方性導電接着剤及び接続構造体
WO2015152164A1 (ja) 2014-03-31 2015-10-08 デクセリアルズ株式会社 熱硬化性接着組成物、及び熱硬化性接着シート
WO2016104276A1 (ja) 2014-12-26 2016-06-30 積水化学工業株式会社 導電ペースト、接続構造体及び接続構造体の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100409423C (zh) * 2003-02-05 2008-08-06 千住金属工业株式会社 端子间的连接方法及半导体装置的安装方法
JP5032938B2 (ja) 2007-10-24 2012-09-26 パナソニック株式会社 熱硬化性樹脂組成物及びその製造方法
JP2010040893A (ja) * 2008-08-07 2010-02-18 Sumitomo Bakelite Co Ltd 端子間の接続方法、それを用いた半導体装置の製造方法、および導電性粒子の凝集方法
JP6114627B2 (ja) * 2012-05-18 2017-04-12 積水化学工業株式会社 導電材料、接続構造体及び接続構造体の製造方法
JP6557591B2 (ja) * 2014-12-26 2019-08-07 積水化学工業株式会社 導電フィルム、接続構造体及び接続構造体の製造方法
KR101820214B1 (ko) * 2015-11-27 2018-01-18 이경섭 미세피치용 이방성 도전 접착제 제조방법 및 이 방법에 의해 제조된 미세피치용 이방성 도전 접착제

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004260131A (ja) 2003-02-05 2004-09-16 Japan Science & Technology Agency 端子間の接続方法及び半導体装置の実装方法
JP2009147231A (ja) 2007-12-17 2009-07-02 Hitachi Chem Co Ltd 実装方法、半導体チップ、及び半導体ウエハ
WO2010038753A1 (ja) 2008-09-30 2010-04-08 ソニーケミカル＆インフォメーションデバイス株式会社 異方性導電接着剤及びそれを用いた接続構造体の製造方法
JP2014135207A (ja) 2013-01-10 2014-07-24 Sekisui Chem Co Ltd 導電材料、接続構造体及び接続構造体の製造方法
WO2015056754A1 (ja) 2013-10-17 2015-04-23 デクセリアルズ株式会社 異方性導電接着剤及び接続構造体
WO2015152164A1 (ja) 2014-03-31 2015-10-08 デクセリアルズ株式会社 熱硬化性接着組成物、及び熱硬化性接着シート
WO2016104276A1 (ja) 2014-12-26 2016-06-30 積水化学工業株式会社 導電ペースト、接続構造体及び接続構造体の製造方法

Also Published As

Publication number Publication date
KR20220062055A (ko) 2022-05-13
KR102707134B1 (ko) 2024-09-13
WO2021079812A1 (ja) 2021-04-29
JP7432633B2 (ja) 2024-02-16
TW202122535A (zh) 2021-06-16
JP2022060494A (ja) 2022-04-14
JP2021068842A (ja) 2021-04-30
TWI870491B (zh) 2025-01-21
CN114502685A (zh) 2022-05-13
CN114502685B (zh) 2024-04-12

Similar Documents

Publication Publication Date Title
JP6898413B2 (ja) 接続体の製造方法、異方性接合フィルム、接続体
JP7032367B2 (ja) 接続体の製造方法、異方性導電接合材料、及び接続体
JP6949258B2 (ja) 接続体の製造方法及び接続体
JP2025143523A (ja) 接続体の製造方法及び接続体
TW202428831A (zh) 異向性接合材料、異向性接合膜、及連接體
JPWO2018225800A1 (ja) 半導体用フィルム状接着剤、半導体装置の製造方法及び半導体装置
JP2022074048A (ja) 導電性接着剤、異方性導電フィルム、接続構造体、及び接続構造体の製造方法
JP6430148B2 (ja) 接着剤及び接続構造体
WO2023162666A1 (ja) 接続構造体の製造方法、フィルム構造体、及びフィルム構造体の製造方法
TWI902241B (zh) 連接體之製造方法
TW202223031A (zh) 導電性接著劑、異向性導電膜、連接結構體、及連接結構體之製造方法
JP7790938B2 (ja) 接続構造体の製造方法及び接続構造体
JP2023092710A (ja) 接続構造体及び接続構造体の製造方法
JP2023079632A (ja) 接続構造体、及び接続構造体の製造方法
TW202508387A (zh) 連接構造體之製造方法、及連接構造體
TW202349521A (zh) 電路連接結構體的製造方法及電路連接裝置

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20210311

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20210311

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20210330

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20210511

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20210712

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20211005

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20211202

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20220201

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20220224

R150 Certificate of patent or registration of utility model

Ref document number: 7032367

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250