TWI866050B - 平板顯示器用光罩、平板顯示器用光罩的位置測量用標記的形成方法及平板顯示器用光罩的製造方法 - Google Patents

平板顯示器用光罩、平板顯示器用光罩的位置測量用標記的形成方法及平板顯示器用光罩的製造方法 Download PDF

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TWI866050B
TWI866050B TW112103767A TW112103767A TWI866050B TW I866050 B TWI866050 B TW I866050B TW 112103767 A TW112103767 A TW 112103767A TW 112103767 A TW112103767 A TW 112103767A TW I866050 B TWI866050 B TW I866050B
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Taiwan
Prior art keywords
position measurement
film
flat panel
panel display
mask
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TW112103767A
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English (en)
Chinese (zh)
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TW202332984A (zh
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橋本昌典
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日商Ｓｋ電子股份有限公司
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
    • G03F1/42—Alignment or registration features, e.g. alignment marks on the mask substrates
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/50—Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
TW112103767A 2022-02-08 2023-02-03 平板顯示器用光罩、平板顯示器用光罩的位置測量用標記的形成方法及平板顯示器用光罩的製造方法 TWI866050B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022018326A JP7802562B2 (ja) 2022-02-08 2022-02-08 Ｆｐｄ用のフォトマスク、ｆｐｄ用のフォトマスクにおける位置計測用マークの形成方法及びｆｐｄ用のフォトマスクの製造方法
JP2022-018326 2022-02-08

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TW202332984A TW202332984A (zh) 2023-08-16
TWI866050B true TWI866050B (zh) 2024-12-11

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TW112103767A TWI866050B (zh) 2022-02-08 2023-02-03 平板顯示器用光罩、平板顯示器用光罩的位置測量用標記的形成方法及平板顯示器用光罩的製造方法

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JP (1) JP7802562B2 (https=)
KR (1) KR102923641B1 (https=)
CN (1) CN116577961A (https=)
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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117452778B (zh) * 2023-11-08 2024-12-13 深圳清溢微电子有限公司 掩膜版二次曝光自动对位方法、装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001201844A (ja) * 2000-01-21 2001-07-27 Hitachi Ltd 半導体集積回路装置の製造方法およびフォトマスクの製造方法
TW519701B (en) * 2001-12-28 2003-02-01 United Microelectronics Corp Overlay mark structure and its measurement application
TWI271811B (en) * 2005-01-13 2007-01-21 Ind Tech Res Inst Overlay measurement target
TWI374248B (https=) * 2004-05-28 2012-10-11 Nikon Corp
US20210225900A1 (en) * 2018-12-04 2021-07-22 Ordos Yuansheng Optoelectronics Co., Ltd. Method for Preparing Array Substrate, Display Panel and Evaporation Apparatus
TW202205005A (zh) * 2016-03-31 2022-02-01 日商Ｈｏｙａ股份有限公司 反射型光罩基底之製造方法、反射型光罩之製造方法、及半導體裝置之製造方法

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JP3372685B2 (ja) * 1994-12-15 2003-02-04 キヤノン株式会社 半導体露光装置
JPH11288076A (ja) * 1998-04-02 1999-10-19 Toshiba Corp 位相シフトマスク及びその製造方法並びに重ね合わせ精度測定用マークを用いた測定方法
JP2000077308A (ja) * 1998-08-31 2000-03-14 Mitsubishi Electric Corp 半導体装置の製造方法
JP3035297B1 (ja) * 1999-05-27 2000-04-24 株式会社ケムテックジャパン プリント基板の製造装置および製造方法
JP4604443B2 (ja) * 2002-12-19 2011-01-05 株式会社ニコン 繋ぎ合わせ測定装置および分割露光用マスク
JP2007248802A (ja) * 2006-03-16 2007-09-27 Hoya Corp パターン形成方法及びグレートーンマスクの製造方法
JP5326282B2 (ja) * 2008-01-10 2013-10-30 富士通セミコンダクター株式会社 半導体装置とその製造方法、及び露光用マスク
JP2009282386A (ja) * 2008-05-23 2009-12-03 Toyota Motor Corp フォトマスクと半導体チップの製造方法
JP5182029B2 (ja) * 2008-11-18 2013-04-10 大日本印刷株式会社 階調マスク
CN102096328B (zh) * 2010-12-03 2012-11-21 深圳市华星光电技术有限公司 液晶面板的曝光工序及其掩膜
JP5306391B2 (ja) * 2011-03-02 2013-10-02 株式会社東芝 フォトマスク
JP6718225B2 (ja) * 2015-12-02 2020-07-08 株式会社エスケーエレクトロニクス フォトマスクおよびその製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001201844A (ja) * 2000-01-21 2001-07-27 Hitachi Ltd 半導体集積回路装置の製造方法およびフォトマスクの製造方法
TW519701B (en) * 2001-12-28 2003-02-01 United Microelectronics Corp Overlay mark structure and its measurement application
TWI374248B (https=) * 2004-05-28 2012-10-11 Nikon Corp
TWI271811B (en) * 2005-01-13 2007-01-21 Ind Tech Res Inst Overlay measurement target
TW202205005A (zh) * 2016-03-31 2022-02-01 日商Ｈｏｙａ股份有限公司 反射型光罩基底之製造方法、反射型光罩之製造方法、及半導體裝置之製造方法
US20210225900A1 (en) * 2018-12-04 2021-07-22 Ordos Yuansheng Optoelectronics Co., Ltd. Method for Preparing Array Substrate, Display Panel and Evaporation Apparatus

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Publication number Publication date
JP2023115863A (ja) 2023-08-21
KR20230120090A (ko) 2023-08-16
KR102923641B1 (ko) 2026-02-05
CN116577961A (zh) 2023-08-11
TW202332984A (zh) 2023-08-16
JP7802562B2 (ja) 2026-01-20

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