TWI860346B - 氣體輸送用的模組元件系統 - Google Patents

氣體輸送用的模組元件系統 Download PDF

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Publication number
TWI860346B
TWI860346B TW109112670A TW109112670A TWI860346B TW I860346 B TWI860346 B TW I860346B TW 109112670 A TW109112670 A TW 109112670A TW 109112670 A TW109112670 A TW 109112670A TW I860346 B TWI860346 B TW I860346B
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TW
Taiwan
Prior art keywords
gas
port
substrate
valve
bores
Prior art date
Application number
TW109112670A
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English (en)
Chinese (zh)
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TW202120861A (zh
Inventor
約翰 福爾登 斯圖姆夫
達米恩 龍
諾曼 中島
卡爾 費德瑞克 李瑟
Original Assignee
美商蘭姆研究公司
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Publication of TW202120861A publication Critical patent/TW202120861A/zh
Application granted granted Critical
Publication of TWI860346B publication Critical patent/TWI860346B/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K27/00—Construction of housing; Use of materials therefor
    • F16K27/003—Housing formed from a plurality of the same valve elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Valve Housings (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Pipeline Systems (AREA)
  • Compressor (AREA)
TW109112670A 2019-04-15 2020-04-15 氣體輸送用的模組元件系統 TWI860346B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201962834241P 2019-04-15 2019-04-15
US62/834,241 2019-04-15

Publications (2)

Publication Number Publication Date
TW202120861A TW202120861A (zh) 2021-06-01
TWI860346B true TWI860346B (zh) 2024-11-01

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW109112670A TWI860346B (zh) 2019-04-15 2020-04-15 氣體輸送用的模組元件系統

Country Status (6)

Country Link
US (2) US11996301B2 (https=)
JP (2) JP7553468B2 (https=)
KR (2) KR20250057125A (https=)
CN (2) CN113994460B (https=)
TW (1) TWI860346B (https=)
WO (1) WO2020214616A1 (https=)

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KR102822934B1 (ko) 2018-05-07 2025-06-18 램 리써치 코포레이션 설정가능한 (configurable) 분산 인터록킹 시스템
CN113994460B (zh) 2019-04-15 2025-05-20 朗姆研究公司 用于气体输送的模块部件系统
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CN116293440A (zh) * 2023-03-16 2023-06-23 鸿舸半导体设备(上海)有限公司 一种集成安装座及输送设备与装置

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Also Published As

Publication number Publication date
US11996301B2 (en) 2024-05-28
CN113994460B (zh) 2025-05-20
KR20210140779A (ko) 2021-11-23
JP7553468B2 (ja) 2024-09-18
WO2020214616A1 (en) 2020-10-22
KR20250057125A (ko) 2025-04-28
JP2024174940A (ja) 2024-12-17
JP2022529263A (ja) 2022-06-20
TW202120861A (zh) 2021-06-01
TW202516126A (zh) 2025-04-16
US20220199431A1 (en) 2022-06-23
US20240347349A1 (en) 2024-10-17
CN113994460A (zh) 2022-01-28
KR102798978B1 (ko) 2025-04-21
CN120473408A (zh) 2025-08-12

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