JP7553468B2 - ガス送給用のモジュール式構成要素システム - Google Patents

ガス送給用のモジュール式構成要素システム Download PDF

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Publication number
JP7553468B2
JP7553468B2 JP2021560971A JP2021560971A JP7553468B2 JP 7553468 B2 JP7553468 B2 JP 7553468B2 JP 2021560971 A JP2021560971 A JP 2021560971A JP 2021560971 A JP2021560971 A JP 2021560971A JP 7553468 B2 JP7553468 B2 JP 7553468B2
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gas
primitive
port
substrate
primitive substrate
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JP2022529263A5 (https=
JP2022529263A (ja
JPWO2020214616A5 (https=
Inventor
スタンフ・ジョン・フォールデン
ロング・ダミアン
ナカシマ・ノーマン
リーサー・カール・フレデリック
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Lam Research Corp
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Lam Research Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K27/00—Construction of housing; Use of materials therefor
    • F16K27/003—Housing formed from a plurality of the same valve elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Valve Housings (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Pipeline Systems (AREA)
  • Compressor (AREA)
JP2021560971A 2019-04-15 2020-04-14 ガス送給用のモジュール式構成要素システム Active JP7553468B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024152794A JP2024174940A (ja) 2019-04-15 2024-09-05 ガス送給用のモジュール式構成要素システム

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201962834241P 2019-04-15 2019-04-15
US62/834,241 2019-04-15
PCT/US2020/028158 WO2020214616A1 (en) 2019-04-15 2020-04-14 Modular-component system for gas delivery

Related Child Applications (1)

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JP2024152794A Division JP2024174940A (ja) 2019-04-15 2024-09-05 ガス送給用のモジュール式構成要素システム

Publications (4)

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JP2022529263A JP2022529263A (ja) 2022-06-20
JP2022529263A5 JP2022529263A5 (https=) 2023-04-12
JPWO2020214616A5 JPWO2020214616A5 (https=) 2023-04-12
JP7553468B2 true JP7553468B2 (ja) 2024-09-18

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JP2021560971A Active JP7553468B2 (ja) 2019-04-15 2020-04-14 ガス送給用のモジュール式構成要素システム
JP2024152794A Pending JP2024174940A (ja) 2019-04-15 2024-09-05 ガス送給用のモジュール式構成要素システム

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Country Status (6)

Country Link
US (2) US11996301B2 (https=)
JP (2) JP7553468B2 (https=)
KR (2) KR20250057125A (https=)
CN (2) CN113994460B (https=)
TW (1) TWI860346B (https=)
WO (1) WO2020214616A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102822934B1 (ko) 2018-05-07 2025-06-18 램 리써치 코포레이션 설정가능한 (configurable) 분산 인터록킹 시스템
CN113994460B (zh) 2019-04-15 2025-05-20 朗姆研究公司 用于气体输送的模块部件系统
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US11899477B2 (en) 2021-03-03 2024-02-13 Ichor Systems, Inc. Fluid flow control system comprising a manifold assembly
US20230139688A1 (en) * 2021-10-29 2023-05-04 Applied Materials, Inc. Modular multi-directional gas mixing block
JP2025509450A (ja) 2022-03-10 2025-04-11 アプライド マテリアルズ インコーポレイテッド モジュール式多方向ガス混合ブロック
CN116293440A (zh) * 2023-03-16 2023-06-23 鸿舸半导体设备(上海)有限公司 一种集成安装座及输送设备与装置

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JP2001503840A (ja) 1996-10-30 2001-03-21 ユニット インスツルメンツ インコーポレイテッド ガスパネル

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Patent Citations (1)

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Also Published As

Publication number Publication date
TWI860346B (zh) 2024-11-01
US11996301B2 (en) 2024-05-28
CN113994460B (zh) 2025-05-20
KR20210140779A (ko) 2021-11-23
WO2020214616A1 (en) 2020-10-22
KR20250057125A (ko) 2025-04-28
JP2024174940A (ja) 2024-12-17
JP2022529263A (ja) 2022-06-20
TW202120861A (zh) 2021-06-01
TW202516126A (zh) 2025-04-16
US20220199431A1 (en) 2022-06-23
US20240347349A1 (en) 2024-10-17
CN113994460A (zh) 2022-01-28
KR102798978B1 (ko) 2025-04-21
CN120473408A (zh) 2025-08-12

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