TWI842914B - 陶瓷生胚製造用離型膜、陶瓷生胚之製造方法、陶瓷電容器之製造方法 - Google Patents

陶瓷生胚製造用離型膜、陶瓷生胚之製造方法、陶瓷電容器之製造方法 Download PDF

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Publication number
TWI842914B
TWI842914B TW109121025A TW109121025A TWI842914B TW I842914 B TWI842914 B TW I842914B TW 109121025 A TW109121025 A TW 109121025A TW 109121025 A TW109121025 A TW 109121025A TW I842914 B TWI842914 B TW I842914B
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Taiwan
Prior art keywords
layer
release
ceramic green
green body
film
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TW109121025A
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English (en)
Chinese (zh)
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TW202108378A (zh
Inventor
重野健斗
柴田悠介
中谷充晴
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日商東洋紡股份有限公司
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04Coating
    • C08J7/044Forming conductive coatings; Forming coatings having anti-static properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28BSHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28B1/00Producing shaped prefabricated articles from the material
    • B28B1/30Producing shaped prefabricated articles from the material by applying the material on to a core or other moulding surface to form a layer thereon
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28BSHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28B13/00Feeding the unshaped material to moulds or apparatus for producing shaped articles; Discharging shaped articles from such moulds or apparatus
    • B28B13/04Discharging the shaped articles
    • B28B13/06Removing the shaped articles from moulds
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/06Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/36Layered products comprising a layer of synthetic resin comprising polyesters
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04Coating
    • C08J7/042Coating with two or more layers, where at least one layer of a composition contains a polymer binder
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • H01G4/06Solid dielectrics
    • H01G4/08Inorganic dielectrics
    • H01G4/12Ceramic dielectrics
    • H01G4/1209Ceramic dielectrics characterised by the ceramic dielectric material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/30Stacked capacitors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00Layers arrangement
    • B32B2250/24All layers being polymeric
    • B32B2250/244All polymers belonging to those covered by group B32B27/36
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00Coating on the layer surface
    • B32B2255/10Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00Coating on the layer surface
    • B32B2255/26Polymeric coating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00Coating on the layer surface
    • B32B2255/28Multiple coating on one surface
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/70Other properties
    • B32B2307/746Slipping, anti-blocking, low friction
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/16Capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Producing Shaped Articles From Materials (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
TW109121025A 2019-06-28 2020-06-22 陶瓷生胚製造用離型膜、陶瓷生胚之製造方法、陶瓷電容器之製造方法 TWI842914B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-120950 2019-06-28
JP2019120950 2019-06-28

Publications (2)

Publication Number Publication Date
TW202108378A TW202108378A (zh) 2021-03-01
TWI842914B true TWI842914B (zh) 2024-05-21

Family

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TW109121025A TWI842914B (zh) 2019-06-28 2020-06-22 陶瓷生胚製造用離型膜、陶瓷生胚之製造方法、陶瓷電容器之製造方法

Country Status (7)

Country Link
JP (5) JP7095741B2 (https=)
KR (1) KR20220031910A (https=)
CN (6) CN117325533B (https=)
MY (1) MY208999A (https=)
PH (1) PH12021553234A1 (https=)
TW (1) TWI842914B (https=)
WO (1) WO2020261910A1 (https=)

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MY208999A (en) * 2019-06-28 2025-06-16 Toyo Boseki Release film for manufacturing ceramic green sheet
WO2022246681A1 (en) 2021-05-26 2022-12-01 Dow Silicones Corporation Silicone pressure sensitive adhesive composition containing a fluorosilicone additive and methods for the preparation and use thereof
US12466982B2 (en) 2021-06-16 2025-11-11 Dow Silicones Corporation Silicone pressure sensitive adhesive composition containing a polyfluoropolyether silane additive and methods for the preparation and use of said composition
CN117321160A (zh) 2021-06-16 2023-12-29 美国陶氏有机硅公司 包含含氟聚有机氢硅氧烷交联剂的有机硅压敏粘合剂组合物以及所述组合物的制备方法和用途
JP7811167B2 (ja) * 2021-10-11 2026-02-04 大阪ガスケミカル株式会社 剥離コーティング剤、剥離フィルムおよび剥離フィルムの製造方法
KR102912059B1 (ko) * 2022-01-19 2026-01-15 마이크로웍스 주식회사 폴리에스테르계 이형필름
JP2024000615A (ja) * 2022-06-21 2024-01-09 三菱ケミカル株式会社 ポリエステルフィルムロール
JPWO2024004832A1 (https=) * 2022-06-27 2024-01-04
CN120835920A (zh) * 2023-03-10 2025-10-24 信越化学工业株式会社 剥离片用轻剥离添加剂、剥离片用树脂组合物和剥离片
TW202541978A (zh) * 2024-03-21 2025-11-01 日商東洋紡股份有限公司 離型膜
WO2025204694A1 (ja) * 2024-03-27 2025-10-02 東洋紡株式会社 離型フィルムのリサイクル方法、リサイクル樹脂組成物及びその製造方法
WO2026028589A1 (ja) * 2024-07-30 2026-02-05 東洋紡株式会社 積層フィルム、樹脂組成物、及びその製造方法

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US20070017091A1 (en) * 2003-03-31 2007-01-25 Tdk Corporation Method for Manufacturing Multi-Layered Ceramic Electronic Component
US20100151141A1 (en) * 2003-09-26 2010-06-17 Lintec Corporation Process film for use in producing ceramic green sheet and method for production thereof
US20140050887A1 (en) * 2011-04-21 2014-02-20 Lintec Corporation Releasing film for ceramic green sheet production processes

Also Published As

Publication number Publication date
PH12021553234A1 (en) 2022-09-19
KR20220031910A (ko) 2022-03-14
JP7318693B2 (ja) 2023-08-01
JP7385817B2 (ja) 2023-11-24
JP7318694B2 (ja) 2023-08-01
JPWO2020261910A1 (https=) 2020-12-30
CN114025960B (zh) 2024-05-24
TW202108378A (zh) 2021-03-01
CN118418559A (zh) 2024-08-02
CN118418557A (zh) 2024-08-02
CN118418560A (zh) 2024-08-02
JP7095741B2 (ja) 2022-07-05
CN114025960A (zh) 2022-02-08
JP2022028771A (ja) 2022-02-16
MY208999A (en) 2025-06-16
JP2022016503A (ja) 2022-01-21
JP2022016504A (ja) 2022-01-21
CN117325533A (zh) 2024-01-02
JP2022031701A (ja) 2022-02-22
WO2020261910A1 (ja) 2020-12-30
CN117325533B (zh) 2026-01-23
CN118418558A (zh) 2024-08-02
JP7318695B2 (ja) 2023-08-01

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