TWI841527B - 用於形成有機薄膜的組成物和技術 - Google Patents

用於形成有機薄膜的組成物和技術 Download PDF

Info

Publication number
TWI841527B
TWI841527B TW107113054A TW107113054A TWI841527B TW I841527 B TWI841527 B TW I841527B TW 107113054 A TW107113054 A TW 107113054A TW 107113054 A TW107113054 A TW 107113054A TW I841527 B TWI841527 B TW I841527B
Authority
TW
Taiwan
Prior art keywords
meth
mol
ink composition
curable ink
electronic device
Prior art date
Application number
TW107113054A
Other languages
English (en)
Chinese (zh)
Other versions
TW201839070A (zh
Inventor
伊雷娜 羅格吉那
泰瑞莎Ａ 拉摩斯
斯特拉 優渥諾
羅紋娜 摩洛
Original Assignee
美商凱特伊夫公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商凱特伊夫公司 filed Critical 美商凱特伊夫公司
Publication of TW201839070A publication Critical patent/TW201839070A/zh
Application granted granted Critical
Publication of TWI841527B publication Critical patent/TWI841527B/zh

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/102—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • H10K85/141—Organic polymers or oligomers comprising aliphatic or olefinic chains, e.g. poly N-vinylcarbazol, PVC or PTFE
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • H10K85/151—Copolymers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Laminated Bodies (AREA)
  • Plasma & Fusion (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
TW107113054A 2017-04-21 2018-04-17 用於形成有機薄膜的組成物和技術 TWI841527B (zh)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
US201762488401P 2017-04-21 2017-04-21
US62/488,401 2017-04-21
US201862653035P 2018-04-05 2018-04-05
US62/653,035 2018-04-05
PCT/US2018/027954 WO2018195066A2 (en) 2017-04-21 2018-04-17 Compositions and techniques for forming organic thin films
WOPCT/US18/27954 2018-04-17
US15/955,303 2018-04-17
US15/955,303 US20180309089A1 (en) 2017-04-21 2018-04-17 Compositions and Techniques for Forming Organic Thin Films
??PCT/US18/27954 2018-04-17

Publications (2)

Publication Number Publication Date
TW201839070A TW201839070A (zh) 2018-11-01
TWI841527B true TWI841527B (zh) 2024-05-11

Family

ID=63854158

Family Applications (3)

Application Number Title Priority Date Filing Date
TW107113054A TWI841527B (zh) 2017-04-21 2018-04-17 用於形成有機薄膜的組成物和技術
TW113127365A TW202521641A (zh) 2017-04-21 2018-04-17 用於形成有機薄膜的組成物和技術
TW112149036A TWI866699B (zh) 2017-04-21 2018-04-17 聚合物膜、包含聚合物膜之囊封電子裝置、及形成囊封電子裝置之方法

Family Applications After (2)

Application Number Title Priority Date Filing Date
TW113127365A TW202521641A (zh) 2017-04-21 2018-04-17 用於形成有機薄膜的組成物和技術
TW112149036A TWI866699B (zh) 2017-04-21 2018-04-17 聚合物膜、包含聚合物膜之囊封電子裝置、及形成囊封電子裝置之方法

Country Status (7)

Country Link
US (3) US20180309089A1 (enExample)
EP (1) EP3613091A4 (enExample)
JP (2) JP7144864B2 (enExample)
KR (2) KR102607711B1 (enExample)
CN (2) CN118510305A (enExample)
TW (3) TWI841527B (enExample)
WO (1) WO2018195066A2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7332470B2 (ja) * 2018-04-20 2023-08-23 積水化学工業株式会社 有機ｅｌ表示素子用封止剤
KR102725592B1 (ko) 2019-11-22 2024-11-06 삼성디스플레이 주식회사 표시 장치 제조 방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104704035A (zh) * 2012-07-19 2015-06-10 罗利克有限公司 用于水清除层的可辐射固化的组合物及其制备方法
TW201627433A (zh) * 2014-07-25 2016-08-01 凱特伊夫公司 有機薄膜墨水組成物及方法
US20170062762A1 (en) * 2015-08-31 2017-03-02 Kateeva, Inc. Di- and Mono(Meth)Acrylate Based Organic Thin Film Ink Compositions

Family Cites Families (97)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4303924A (en) * 1978-12-26 1981-12-01 The Mead Corporation Jet drop printing process utilizing a radiation curable ink
JPS61278577A (ja) * 1985-06-05 1986-12-09 Mitsubishi Rayon Co Ltd 紫外線硬化型インキ組成物
JPH07169567A (ja) 1993-12-16 1995-07-04 Idemitsu Kosan Co Ltd 有機ｅｌ素子
US5607789A (en) 1995-01-23 1997-03-04 Duracell Inc. Light transparent multilayer moisture barrier for electrochemical cell tester and cell employing same
DE19603746A1 (de) 1995-10-20 1997-04-24 Bosch Gmbh Robert Elektrolumineszierendes Schichtsystem
US5690722A (en) 1996-10-28 1997-11-25 Hewlett-Packard Company Use of tetrafluoropropanol as co-solvent in ink-jet ink vehicles
US5952778A (en) 1997-03-18 1999-09-14 International Business Machines Corporation Encapsulated organic light emitting device
JP3290375B2 (ja) 1997-05-12 2002-06-10 松下電器産業株式会社 有機電界発光素子
JP3747127B2 (ja) 1997-07-28 2006-02-22 キヤノン株式会社 カラーフィルタの製造方法及び表示装置の製造方法及び表示装置を備えた情報処理装置の製造方法
US6146225A (en) 1998-07-30 2000-11-14 Agilent Technologies, Inc. Transparent, flexible permeability barrier for organic electroluminescent devices
EP1145338B1 (en) 1998-12-16 2012-12-05 Samsung Display Co., Ltd. Environmental barrier material for organic light emitting device and method of making
US6268695B1 (en) 1998-12-16 2001-07-31 Battelle Memorial Institute Environmental barrier material for organic light emitting device and method of making
IL145317A0 (en) 1999-04-28 2002-06-30 Du Pont Flexible organic electronic device with improved resistance to oxygen and moisture degradation
US6413645B1 (en) 2000-04-20 2002-07-02 Battelle Memorial Institute Ultrabarrier substrates
US6623861B2 (en) 2001-04-16 2003-09-23 Battelle Memorial Institute Multilayer plastic substrates
US20090191342A1 (en) 1999-10-25 2009-07-30 Vitex Systems, Inc. Method for edge sealing barrier films
US7198832B2 (en) 1999-10-25 2007-04-03 Vitex Systems, Inc. Method for edge sealing barrier films
US6866901B2 (en) 1999-10-25 2005-03-15 Vitex Systems, Inc. Method for edge sealing barrier films
US6492026B1 (en) 2000-04-20 2002-12-10 Battelle Memorial Institute Smoothing and barrier layers on high Tg substrates
US6550906B2 (en) 2001-01-02 2003-04-22 3M Innovative Properties Company Method and apparatus for inkjet printing using UV radiation curable ink
US6664137B2 (en) 2001-03-29 2003-12-16 Universal Display Corporation Methods and structures for reducing lateral diffusion through cooperative barrier layers
KR100413450B1 (ko) 2001-07-20 2003-12-31 엘지전자 주식회사 표시소자의 보호막 구조
US7074501B2 (en) 2001-08-20 2006-07-11 Nova-Plasma Inc. Coatings with low permeation of gases and vapors
US6597111B2 (en) 2001-11-27 2003-07-22 Universal Display Corporation Protected organic optoelectronic devices
US7307119B2 (en) 2002-08-01 2007-12-11 Electronics And Telecommunications Research Institute Thin film material using pentaerythritol acrylate for encapsulation of organic or polymeric light emitting device, and encapsulation method for LED using the same
US7012363B2 (en) 2002-01-10 2006-03-14 Universal Display Corporation OLEDs having increased external electroluminescence quantum efficiencies
US7109653B2 (en) 2002-01-15 2006-09-19 Seiko Epson Corporation Sealing structure with barrier membrane for electronic element, display device, electronic apparatus, and fabrication method for electronic element
KR100475849B1 (ko) 2002-04-17 2005-03-10 한국전자통신연구원 습식 공정에 의하여 형성된 엔캡슐레이션 박막을 갖춘유기 전기발광 소자 및 그 제조 방법
US20030203210A1 (en) 2002-04-30 2003-10-30 Vitex Systems, Inc. Barrier coatings and methods of making same
US6949389B2 (en) 2002-05-02 2005-09-27 Osram Opto Semiconductors Gmbh Encapsulation for organic light emitting diodes devices
GB0221894D0 (en) * 2002-09-20 2002-10-30 Avecia Ltd Compositions
CN1176565C (zh) 2002-11-25 2004-11-17 清华大学 一种有机电致发光器件的封装层及其制备方法和应用
US6945647B2 (en) 2002-12-20 2005-09-20 Eastman Kodak Company Method for increasing the diameter of an ink jet ink dot
US7297460B2 (en) * 2003-02-26 2007-11-20 Agfa-Gevaert Radiation curable ink compositions suitable for ink-jet printing
US7018713B2 (en) 2003-04-02 2006-03-28 3M Innovative Properties Company Flexible high-temperature ultrabarrier
US7510913B2 (en) 2003-04-11 2009-03-31 Vitex Systems, Inc. Method of making an encapsulated plasma sensitive device
KR101035850B1 (ko) 2003-11-17 2011-05-19 삼성전자주식회사 박막 형성용 프린팅 설비
US20050137282A1 (en) 2003-12-19 2005-06-23 Cagle Phillip C. Liquid vehicle systems for improving latex ink-jet ink frequency response
US20050197419A1 (en) * 2004-03-03 2005-09-08 Graziano Louis C. Radiation curable aqueous binders for ink jet inks
US20050238846A1 (en) 2004-03-10 2005-10-27 Fuji Photo Film Co., Ltd. Gas barrier laminate film, method for producing the same and image display device utilizing the film
US7279506B2 (en) 2004-05-05 2007-10-09 Xerox Corporation Ink jettable overprint compositions
JP4159525B2 (ja) * 2004-08-23 2008-10-01 株式会社石井表記 配向膜形成方法およびインクジェット式プリントヘッド噴出検査装置
CN101706629B (zh) 2004-08-23 2012-02-29 株式会社石井表记 定向膜形成方法和喷墨类型打印头排出检查设备
KR100736531B1 (ko) 2005-03-16 2007-07-06 주식회사 엘지화학 단차 조절이 가능한 잉크
US7687119B2 (en) 2005-04-04 2010-03-30 Henkel Ag & Co. Kgaa Radiation-curable desiccant-filled adhesive/sealant
US20060223937A1 (en) 2005-04-04 2006-10-05 Herr Donald E Radiation curable cycloaliphatic barrier sealants
CN100368490C (zh) 2005-07-28 2008-02-13 中国印钞造币总公司 Uv固化隐形荧光变频油墨
US7767498B2 (en) 2005-08-25 2010-08-03 Vitex Systems, Inc. Encapsulated devices and method of making
US7621794B2 (en) 2005-11-09 2009-11-24 International Display Systems, Inc. Method of encapsulating an organic light-emitting device
KR101356298B1 (ko) 2006-03-29 2014-01-28 후지필름 가부시키가이샤 기체-차단 적층 필름, 이의 제조 방법, 및 화상표시소자
JP2007277467A (ja) 2006-04-10 2007-10-25 Sony Chemical & Information Device Corp 硬化性樹脂組成物
US8039739B1 (en) 2006-05-05 2011-10-18 Nanosolar, Inc. Individually encapsulated solar cells and solar cell strings
US20080045618A1 (en) * 2006-06-27 2008-02-21 Nagvekar Devdatt S Low viscosity UV curable ink formulations
JP5315629B2 (ja) * 2006-08-11 2013-10-16 Ｊｎｃ株式会社 光硬化性インクジェットインク
JP2008087163A (ja) 2006-09-29 2008-04-17 Fujifilm Corp ガスバリア性積層フィルム、およびそれを用いた画像表示素子
JP2008106165A (ja) * 2006-10-26 2008-05-08 Chisso Corp インクジェット用インクおよび当該インクにより得られる硬化膜
US8101288B2 (en) 2007-06-11 2012-01-24 Fujifilm Corporation Gas barrier film and organic device using the same
JP5296343B2 (ja) 2007-07-31 2013-09-25 住友化学株式会社 バリア層つき基板、表示素子および表示素子の製造方法
JP4932758B2 (ja) 2008-02-06 2012-05-16 富士フイルム株式会社 発光デバイス及びその製造方法
KR100934752B1 (ko) 2008-04-10 2009-12-30 주식회사 잉크테크 광전자 소자용 잉크 조성물
JP5320167B2 (ja) 2008-05-30 2013-10-23 富士フイルム株式会社 バリア性積層体、ガスバリアフィルム、デバイスおよび積層体の製造方法
US8899171B2 (en) 2008-06-13 2014-12-02 Kateeva, Inc. Gas enclosure assembly and system
JP5281964B2 (ja) 2008-06-26 2013-09-04 富士フイルム株式会社 バリア性積層体、ガスバリアフィルム、デバイスおよび積層体の製造方法
JP5270469B2 (ja) * 2008-06-30 2013-08-21 富士フイルム株式会社 バリア性積層体、ガスバリアフィルムおよびこれらを用いたデバイス、ならびに、バリア性積層体の製造方法
US20100055407A1 (en) 2008-09-04 2010-03-04 Xerox Corporation Ultra-Violet Curable Gellant Inks For Creating Tactile Text And Images For Packaging Applications
FR2936651B1 (fr) 2008-09-30 2011-04-08 Commissariat Energie Atomique Dispositif optoelectronique organique et son procede d'encapsulation.
KR20110106287A (ko) * 2008-12-05 2011-09-28 아사히 가라스 가부시키가이샤 광경화성 조성물 및 표면에 미세 패턴을 갖는 성형체의 제조 방법
US9184410B2 (en) 2008-12-22 2015-11-10 Samsung Display Co., Ltd. Encapsulated white OLEDs having enhanced optical output
US9337446B2 (en) 2008-12-22 2016-05-10 Samsung Display Co., Ltd. Encapsulated RGB OLEDs having enhanced optical output
US8405233B2 (en) 2009-01-14 2013-03-26 Dow Corning Corporation Flexible barrier film, method of forming same, and organic electronic device including same
JP2010198735A (ja) 2009-02-20 2010-09-09 Fujifilm Corp 光学部材及び該光学部材を備えた有機エレクトロルミネッセンス表示装置
JP5498202B2 (ja) 2009-03-03 2014-05-21 富士フイルム株式会社 バリア性積層体、ガスバリアフィルムおよびこれらを用いたデバイス
DE102009001966A1 (de) * 2009-03-30 2010-10-07 Evonik Röhm Gmbh Beschichtungszusammensetzung,(Meth)acryl-Polymer und Monomermischung zur Herstellung des(Meth)acryl-Polymers
DE102009024452A1 (de) * 2009-06-10 2010-12-16 Kunststoff- Und Farben-Gesellschaft Mbh Polymerisierbare Masse
US8342669B2 (en) 2009-09-18 2013-01-01 Xerox Corporation Reactive ink components and methods for forming images using reactive inks
KR102045196B1 (ko) 2010-04-12 2019-11-15 메르크 파텐트 게엠베하 개선된 성능을 갖는 조성물
CN103079816B (zh) 2010-07-02 2018-01-02 3M创新有限公司 具有包封剂和光伏电池的阻挡组件
US9221252B2 (en) 2010-10-21 2015-12-29 Hewlett-Packard Development Company, L.P. Controlling ink deposition during printing
KR101199064B1 (ko) 2011-01-21 2012-11-07 엘지이노텍 주식회사 광 변환 부재, 이를 포함하는 표시장치 및 이의 제조방법
US8851649B2 (en) * 2011-05-13 2014-10-07 Eckart Gmbh UV ink jet printing ink composition
KR20130055541A (ko) 2011-11-18 2013-05-28 주식회사 엘지화학 유기전자장치 봉지용 광경화형 점접착 필름, 유기전자장치 및 그의 봉지 방법
KR101424346B1 (ko) 2011-11-18 2014-08-01 주식회사 엘지화학 유기전자장치 봉지용 광경화형 점접착 필름, 유기전자장치 및 그의 봉지 방법
TWI477824B (zh) 2011-12-27 2015-03-21 Asahi Kasei E Materials Corp Optical substrate and light emitting device
JP5803746B2 (ja) 2012-03-02 2015-11-04 株式会社リコー 光重合性インクジェットインク、インクカートリッジ
US8771787B2 (en) 2012-05-17 2014-07-08 Xerox Corporation Ink for digital offset printing applications
WO2014021941A1 (en) 2012-07-30 2014-02-06 Unipixel Displays, Inc. Ink formulations for flexographic printing of high-resolution conducting patterns
TWI610806B (zh) 2012-08-08 2018-01-11 ３Ｍ新設資產公司 障壁膜，製造該障壁膜之方法，及包含該障壁膜之物件
KR101549726B1 (ko) * 2012-12-20 2015-09-02 제일모직주식회사 봉지용 조성물, 이를 포함하는 장벽층 및 이를 포함하는 봉지화된 장치
KR101847229B1 (ko) * 2013-09-27 2018-05-29 주식회사 엘지화학 도너 필름용 광경화성 수지 조성물 및 도너 필름
KR101402355B1 (ko) * 2014-01-16 2014-06-02 (주)휴넷플러스 유기 전자 소자 및 이의 제조방법
KR101802574B1 (ko) * 2014-03-28 2017-12-01 삼성에스디아이 주식회사 유기발광소자 봉지용 조성물 및 이로부터 제조된 유기발광소자 표시장치
GB201408467D0 (en) * 2014-05-13 2014-06-25 Sericol Ltd Inks
KR101712700B1 (ko) 2014-06-12 2017-03-07 제일모직주식회사 유기발광소자 봉지용 조성물 및 이를 사용한 유기발광소자 표시장치
KR20160053750A (ko) * 2014-10-29 2016-05-13 삼성에스디아이 주식회사 디스플레이 밀봉재용 조성물, 이를 포함하는 유기보호층, 및 이를 포함하는 디스플레이 장치
WO2016096937A1 (en) * 2014-12-18 2016-06-23 Rolic Ag Radiation curable composition comprising hydrophilic nanoparticles
WO2017031031A1 (en) 2015-08-17 2017-02-23 3M Innovative Properties Company Barrier film constructions
AU2016378200B2 (en) * 2015-12-22 2019-08-15 3M Innovative Properties Company Acrylic polyvinyl acetal graphic films

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104704035A (zh) * 2012-07-19 2015-06-10 罗利克有限公司 用于水清除层的可辐射固化的组合物及其制备方法
TW201627433A (zh) * 2014-07-25 2016-08-01 凱特伊夫公司 有機薄膜墨水組成物及方法
US20170062762A1 (en) * 2015-08-31 2017-03-02 Kateeva, Inc. Di- and Mono(Meth)Acrylate Based Organic Thin Film Ink Compositions

Also Published As

Publication number Publication date
WO2018195066A2 (en) 2018-10-25
US11844234B2 (en) 2023-12-12
KR20190141149A (ko) 2019-12-23
WO2018195066A3 (en) 2020-03-26
KR102607711B1 (ko) 2023-11-28
CN111788265A (zh) 2020-10-16
KR102890273B1 (ko) 2025-11-21
TW202417582A (zh) 2024-05-01
TW202521641A (zh) 2025-06-01
US20220328788A1 (en) 2022-10-13
US20180309089A1 (en) 2018-10-25
TWI866699B (zh) 2024-12-11
JP7546945B2 (ja) 2024-09-09
EP3613091A2 (en) 2020-02-26
EP3613091A4 (en) 2021-08-04
CN118510305A (zh) 2024-08-16
US20240081096A1 (en) 2024-03-07
JP2020520043A (ja) 2020-07-02
JP7144864B2 (ja) 2022-09-30
TW201839070A (zh) 2018-11-01
CN111788265B (zh) 2024-04-23
KR20230167139A (ko) 2023-12-07
JP2022191227A (ja) 2022-12-27

Similar Documents

Publication Publication Date Title
JP5441406B2 (ja) カプセル化されたデバイスおよび製造方法
US10190018B2 (en) Di- and mono(meth)acrylate based organic thin film ink compositions
US20240081096A1 (en) Curable compositions and techniques for forming organic thin films
CN117016043A (zh) 光固化性树脂组合物、光学部件、光学部件的制造方法和发光装置
CN115411209A (zh) 用于具有增强的光输出耦合的发光器件的喷墨印刷系统和技术
US20180026234A1 (en) Methods of forming a polymeric thin film layer on an organic light-emitting diode substrate
US11732074B2 (en) Compositions and techniques for forming organic thin films
US10533104B2 (en) Two-step process for forming cured polymeric films for electronic device encapsulation
JP7710188B2 (ja) 紫外線硬化性樹脂組成物、発光装置の製造方法及び発光装置