TWI837305B - 電解金電鍍液、其製造方法及金電鍍方法、金錯合物 - Google Patents

電解金電鍍液、其製造方法及金電鍍方法、金錯合物 Download PDF

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Publication number
TWI837305B
TWI837305B TW109105000A TW109105000A TWI837305B TW I837305 B TWI837305 B TW I837305B TW 109105000 A TW109105000 A TW 109105000A TW 109105000 A TW109105000 A TW 109105000A TW I837305 B TWI837305 B TW I837305B
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TW
Taiwan
Prior art keywords
gold
plating solution
complex
electrolytic
gold plating
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TW109105000A
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English (en)
Chinese (zh)
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TW202035799A (zh
Inventor
佐々木晴子
朝川隆信
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日商Eeja股份有限公司
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Publication of TW202035799A publication Critical patent/TW202035799A/zh
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Publication of TWI837305B publication Critical patent/TWI837305B/zh

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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/48Electroplating: Baths therefor from solutions of gold
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07FACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F1/00Compounds containing elements of Groups 1 or 11 of the Periodic Table
    • C07F1/005Compounds containing elements of Groups 1 or 11 of the Periodic Table without C-Metal linkages
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07FACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F1/00Compounds containing elements of Groups 1 or 11 of the Periodic Table
    • C07F1/12Gold compounds

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
TW109105000A 2019-03-04 2020-02-17 電解金電鍍液、其製造方法及金電鍍方法、金錯合物 TWI837305B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-038442 2019-03-04
JP2019038442A JP7219120B2 (ja) 2019-03-04 2019-03-04 電解金めっき液及びその製造方法、並びに金めっき方法及び金錯体

Publications (2)

Publication Number Publication Date
TW202035799A TW202035799A (zh) 2020-10-01
TWI837305B true TWI837305B (zh) 2024-04-01

Family

ID=72341946

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109105000A TWI837305B (zh) 2019-03-04 2020-02-17 電解金電鍍液、其製造方法及金電鍍方法、金錯合物

Country Status (4)

Country Link
JP (1) JP7219120B2 (ko)
KR (1) KR20200106453A (ko)
CN (1) CN111647918A (ko)
TW (1) TWI837305B (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7219120B2 (ja) * 2019-03-04 2023-02-07 Eeja株式会社 電解金めっき液及びその製造方法、並びに金めっき方法及び金錯体
JP6945050B1 (ja) * 2020-12-01 2021-10-06 日本エレクトロプレイテイング・エンジニヤース株式会社 非シアン系の置換金めっき液及び置換金めっき方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000355792A (ja) * 2000-01-27 2000-12-26 Electroplating Eng Of Japan Co 金メッキ液及びそれを用いた金メッキ方法
JP2005256072A (ja) * 2004-03-11 2005-09-22 Tanaka Kikinzoku Kogyo Kk 金錯体
CN106676595A (zh) * 2017-01-18 2017-05-17 哈尔滨工业大学 一种包含配位剂和添加剂的离子液体镀金液及利用该离子液体镀金液进行镀金的方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6511589B1 (en) * 2001-08-17 2003-01-28 Electroplating Engineers Of Japan Limited Gold plating solution and gold plating method using thereof
JP2003183258A (ja) 2001-12-19 2003-07-03 Tanaka Kikinzoku Kogyo Kk 金錯体
JP2004190075A (ja) * 2002-12-10 2004-07-08 Kanto Chem Co Inc 無電解金めっき液
WO2008102580A1 (ja) * 2007-02-23 2008-08-28 Japan Pure Chemical Co., Ltd. 電解金めっき液及びそれを用いて得られた金皮膜
JP2011122192A (ja) * 2009-12-09 2011-06-23 Ne Chemcat Corp 電解硬質金めっき液及びこれを用いるめっき方法
TW201631222A (zh) * 2014-12-17 2016-09-01 Jcu Corp 無氰電解鍍金溶液及鍍金方法
JP6594077B2 (ja) * 2015-07-28 2019-10-23 上村工業株式会社 ノンシアン無電解金めっき浴および無電解金めっき方法
JP7219120B2 (ja) * 2019-03-04 2023-02-07 Eeja株式会社 電解金めっき液及びその製造方法、並びに金めっき方法及び金錯体
JP7352515B2 (ja) * 2020-05-19 2023-09-28 Eeja株式会社 電解金合金めっき浴及び電解金合金めっき方法
JP7219847B1 (ja) * 2022-09-26 2023-02-08 Eeja株式会社 金電気めっき液および金電気めっき方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000355792A (ja) * 2000-01-27 2000-12-26 Electroplating Eng Of Japan Co 金メッキ液及びそれを用いた金メッキ方法
JP2005256072A (ja) * 2004-03-11 2005-09-22 Tanaka Kikinzoku Kogyo Kk 金錯体
CN106676595A (zh) * 2017-01-18 2017-05-17 哈尔滨工业大学 一种包含配位剂和添加剂的离子液体镀金液及利用该离子液体镀金液进行镀金的方法

Also Published As

Publication number Publication date
CN111647918A (zh) 2020-09-11
JP7219120B2 (ja) 2023-02-07
KR20200106453A (ko) 2020-09-14
TW202035799A (zh) 2020-10-01
JP2020143308A (ja) 2020-09-10

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