TWI832910B - 硬化性樹脂組成物用添加劑、硬化性樹脂組成物及電子零件裝置 - Google Patents

硬化性樹脂組成物用添加劑、硬化性樹脂組成物及電子零件裝置 Download PDF

Info

Publication number
TWI832910B
TWI832910B TW108136907A TW108136907A TWI832910B TW I832910 B TWI832910 B TW I832910B TW 108136907 A TW108136907 A TW 108136907A TW 108136907 A TW108136907 A TW 108136907A TW I832910 B TWI832910 B TW I832910B
Authority
TW
Taiwan
Prior art keywords
group
curable resin
epoxy resin
carbon atoms
resin composition
Prior art date
Application number
TW108136907A
Other languages
English (en)
Chinese (zh)
Other versions
TW202016169A (zh
Inventor
Original Assignee
日商力森諾科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商力森諾科股份有限公司 filed Critical 日商力森諾科股份有限公司
Publication of TW202016169A publication Critical patent/TW202016169A/zh
Application granted granted Critical
Publication of TWI832910B publication Critical patent/TWI832910B/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/13Phenols; Phenolates
    • C08K5/132Phenols containing keto groups, e.g. benzophenones
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00Compositions of unspecified macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW108136907A 2018-10-17 2019-10-14 硬化性樹脂組成物用添加劑、硬化性樹脂組成物及電子零件裝置 TWI832910B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018195937A JP7279333B2 (ja) 2018-10-17 2018-10-17 硬化性樹脂組成物用添加剤、硬化性樹脂組成物及び電子部品装置
JP2018-195937 2018-10-17

Publications (2)

Publication Number Publication Date
TW202016169A TW202016169A (zh) 2020-05-01
TWI832910B true TWI832910B (zh) 2024-02-21

Family

ID=70283766

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108136907A TWI832910B (zh) 2018-10-17 2019-10-14 硬化性樹脂組成物用添加劑、硬化性樹脂組成物及電子零件裝置

Country Status (4)

Country Link
JP (2) JP7279333B2 (ja)
CN (1) CN112771122B (ja)
TW (1) TWI832910B (ja)
WO (1) WO2020080369A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7481070B2 (ja) 2020-03-31 2024-05-10 パナソニックオートモーティブシステムズ株式会社 車両制御装置、車両用合流支援装置及び車両
CN117858915A (zh) * 2021-08-30 2024-04-09 株式会社力森诺科 硬化性树脂组合物及电子零件装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102585438A (zh) * 2011-01-06 2012-07-18 日立化成工业株式会社 密封用环氧树脂组合物和电子部件装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01167359A (ja) * 1987-12-24 1989-07-03 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物
JP3508289B2 (ja) * 1995-05-02 2004-03-22 住友化学工業株式会社 エポキシ樹脂組成物および樹脂封止型半導体装置
JPH11147939A (ja) * 1997-11-14 1999-06-02 Toshiba Chem Corp エポキシ樹脂組成物および半導体封止装置
JP2005239912A (ja) * 2004-02-27 2005-09-08 Sumitomo Bakelite Co Ltd 光半導体封止用エポキシ樹脂組成物及び光半導体装置
JP2005272543A (ja) * 2004-03-23 2005-10-06 Sumitomo Bakelite Co Ltd 光半導体封止用エポキシ樹脂組成物及び光半導体装置
JP5400267B2 (ja) * 2005-12-13 2014-01-29 日立化成株式会社 封止用エポキシ樹脂組成物及び電子部品装置
WO2012147874A1 (ja) * 2011-04-28 2012-11-01 日立化成工業株式会社 電子部品用樹脂組成物及び電子部品装置
JP6690355B2 (ja) * 2016-03-28 2020-04-28 味の素株式会社 樹脂組成物

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102585438A (zh) * 2011-01-06 2012-07-18 日立化成工业株式会社 密封用环氧树脂组合物和电子部件装置

Also Published As

Publication number Publication date
JP2020063366A (ja) 2020-04-23
WO2020080369A1 (ja) 2020-04-23
JP7279333B2 (ja) 2023-05-23
CN112771122B (zh) 2023-02-28
TW202016169A (zh) 2020-05-01
JP2023068032A (ja) 2023-05-16
CN112771122A (zh) 2021-05-07

Similar Documents

Publication Publication Date Title
TWI829708B (zh) 硬化性樹脂組成物及電子零件裝置
TW202120580A (zh) 環氧樹脂組成物、電子零件裝置、及電子零件裝置的製造方法
JP2023068032A (ja) 硬化性樹脂組成物用添加剤、硬化性樹脂組成物及び電子部品装置
JP2024092000A (ja) 硬化性樹脂組成物及び電子部品装置
JP7269579B2 (ja) エポキシ樹脂組成物及び電子部品装置
JP7322368B2 (ja) 硬化性樹脂組成物及び電子部品装置
TWI824463B (zh) 熱硬化性樹脂組成物及電子零件裝置
TW202336068A (zh) 環氧樹脂組成物及電子零件裝置
JP7119823B2 (ja) 封止用エポキシ樹脂組成物及び電子部品装置
JP2018104603A (ja) 硬化性樹脂組成物及び電子部品装置
JP6111710B2 (ja) 硬化性樹脂組成物及び電子部品装置
TW202222942A (zh) 硬化性樹脂組成物及電子零件裝置
WO2023120738A1 (ja) 封止材組成物及び電子部品装置
WO2023032971A1 (ja) 圧縮成形用エポキシ樹脂組成物及び電子部品装置
TW202309190A (zh) 硬化性樹脂組成物及電子零件裝置
TW202313838A (zh) 硬化性樹脂組成物及電子零件裝置
JP2023034256A (ja) 熱硬化性樹脂組成物及び半導体装置
JP2023034255A (ja) 樹脂硬化物及び電子部品装置
TW202035558A (zh) 硬化性樹脂組成物及電子零件裝置
TW202235510A (zh) 熱硬化樹脂組成物及電子零件裝置
JP2020063387A (ja) 封止用樹脂組成物及び電子部品装置