TWI828580B - 鍍覆裝置 - Google Patents
鍍覆裝置 Download PDFInfo
- Publication number
- TWI828580B TWI828580B TW112116533A TW112116533A TWI828580B TW I828580 B TWI828580 B TW I828580B TW 112116533 A TW112116533 A TW 112116533A TW 112116533 A TW112116533 A TW 112116533A TW I828580 B TWI828580 B TW I828580B
- Authority
- TW
- Taiwan
- Prior art keywords
- plating
- substrate
- potential
- anode
- film thickness
- Prior art date
Links
- 238000007747 plating Methods 0.000 title claims abstract description 273
- 239000000758 substrate Substances 0.000 claims abstract description 259
- 239000011248 coating agent Substances 0.000 claims abstract description 22
- 238000000576 coating method Methods 0.000 claims abstract description 22
- 238000000034 method Methods 0.000 claims description 38
- 230000008569 process Effects 0.000 claims description 36
- 230000007246 mechanism Effects 0.000 claims description 28
- 238000005259 measurement Methods 0.000 claims description 23
- 238000001514 detection method Methods 0.000 claims description 16
- 230000008859 change Effects 0.000 claims description 15
- 230000002093 peripheral effect Effects 0.000 claims description 5
- 238000012545 processing Methods 0.000 claims description 5
- 239000007788 liquid Substances 0.000 description 25
- 238000012546 transfer Methods 0.000 description 19
- 230000032258 transport Effects 0.000 description 14
- 238000011068 loading method Methods 0.000 description 10
- 230000005856 abnormality Effects 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 238000004140 cleaning Methods 0.000 description 7
- 238000001035 drying Methods 0.000 description 7
- 238000012986 modification Methods 0.000 description 7
- 230000004048 modification Effects 0.000 description 7
- 235000012431 wafers Nutrition 0.000 description 6
- 238000012937 correction Methods 0.000 description 5
- 238000003756 stirring Methods 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 239000010949 copper Substances 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000011897 real-time detection Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/008—Current shielding devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022077347A JP7233588B1 (ja) | 2022-05-10 | 2022-05-10 | めっき装置 |
| JP2022-077347 | 2022-05-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202348845A TW202348845A (zh) | 2023-12-16 |
| TWI828580B true TWI828580B (zh) | 2024-01-01 |
Family
ID=85414457
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW112116533A TWI828580B (zh) | 2022-05-10 | 2023-05-04 | 鍍覆裝置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20230366120A1 (ko) |
| JP (1) | JP7233588B1 (ko) |
| KR (1) | KR102563631B1 (ko) |
| CN (1) | CN116446024A (ko) |
| TW (1) | TWI828580B (ko) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7305075B1 (ja) | 2023-03-17 | 2023-07-07 | 株式会社荏原製作所 | めっき装置 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003013297A (ja) * | 2001-06-27 | 2003-01-15 | Ebara Corp | 電解めっき装置 |
| JP2003268599A (ja) * | 2002-03-14 | 2003-09-25 | Sumitomo Metal Mining Co Ltd | 電気めっき方法および電気めっき装置 |
| JP2006328537A (ja) * | 2005-05-25 | 2006-12-07 | Applied Materials Inc | 電気メッキ処理におけるイン・シトゥープロファイル測定 |
| JP2006342403A (ja) * | 2005-06-09 | 2006-12-21 | Sharp Corp | メッキ装置、メッキ処理管理装置、メッキ方法、及びメッキ処理管理方法 |
| JP2007270320A (ja) * | 2006-03-31 | 2007-10-18 | Ebara Corp | 分極曲線測定方法及び電解処理装置 |
| JP2010065289A (ja) * | 2008-09-11 | 2010-03-25 | Murata Mfg Co Ltd | 分極曲線測定装置及び分極曲線測定方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3797860B2 (ja) | 2000-09-27 | 2006-07-19 | 株式会社荏原製作所 | めっき装置及びめっき方法 |
| US6733656B2 (en) * | 2002-04-03 | 2004-05-11 | Eci Technology Inc. | Voltammetric reference electrode calibration |
| JP2008014699A (ja) * | 2006-07-04 | 2008-01-24 | Tokyo Institute Of Technology | 電解処理における膜厚測定方法及び膜厚測定装置 |
| JP2008019496A (ja) | 2006-07-14 | 2008-01-31 | Matsushita Electric Ind Co Ltd | 電解めっき装置および電解めっき方法 |
| CN104087947B (zh) * | 2014-07-24 | 2016-08-24 | 苏州热工研究院有限公司 | 用于阴极保护系统中的具有自校准功能的参比电极系统 |
| CN104120455B (zh) * | 2014-07-25 | 2017-11-28 | 湖南阿尔惠特科技股份有限公司 | 一种铝电解槽的阳极电流在线测量方法与装置 |
| JP6861610B2 (ja) * | 2017-11-07 | 2021-04-21 | 株式会社荏原製作所 | めっき解析方法、めっき解析システム、及びめっき解析のためのコンピュータプログラム |
| WO2022118431A1 (ja) * | 2020-12-03 | 2022-06-09 | 株式会社荏原製作所 | めっき装置、およびめっき方法 |
| JP6937974B1 (ja) * | 2021-03-10 | 2021-09-22 | 株式会社荏原製作所 | めっき装置、およびめっき方法 |
| TWI759133B (zh) * | 2021-03-11 | 2022-03-21 | 日商荏原製作所股份有限公司 | 鍍覆裝置及鍍覆方法 |
-
2022
- 2022-05-10 JP JP2022077347A patent/JP7233588B1/ja active Active
-
2023
- 2023-04-12 KR KR1020230048090A patent/KR102563631B1/ko active IP Right Grant
- 2023-04-27 US US18/140,556 patent/US20230366120A1/en active Pending
- 2023-04-27 CN CN202310473818.4A patent/CN116446024A/zh active Pending
- 2023-05-04 TW TW112116533A patent/TWI828580B/zh active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003013297A (ja) * | 2001-06-27 | 2003-01-15 | Ebara Corp | 電解めっき装置 |
| JP2003268599A (ja) * | 2002-03-14 | 2003-09-25 | Sumitomo Metal Mining Co Ltd | 電気めっき方法および電気めっき装置 |
| JP2006328537A (ja) * | 2005-05-25 | 2006-12-07 | Applied Materials Inc | 電気メッキ処理におけるイン・シトゥープロファイル測定 |
| JP2006342403A (ja) * | 2005-06-09 | 2006-12-21 | Sharp Corp | メッキ装置、メッキ処理管理装置、メッキ方法、及びメッキ処理管理方法 |
| JP2007270320A (ja) * | 2006-03-31 | 2007-10-18 | Ebara Corp | 分極曲線測定方法及び電解処理装置 |
| JP2010065289A (ja) * | 2008-09-11 | 2010-03-25 | Murata Mfg Co Ltd | 分極曲線測定装置及び分極曲線測定方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20230366120A1 (en) | 2023-11-16 |
| TW202348845A (zh) | 2023-12-16 |
| CN116446024A (zh) | 2023-07-18 |
| KR102563631B1 (ko) | 2023-08-07 |
| JP7233588B1 (ja) | 2023-03-06 |
| JP2023166684A (ja) | 2023-11-22 |
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