TWI827861B - 夾持用輔助具及洗淨裝置 - Google Patents

夾持用輔助具及洗淨裝置 Download PDF

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Publication number
TWI827861B
TWI827861B TW109123210A TW109123210A TWI827861B TW I827861 B TWI827861 B TW I827861B TW 109123210 A TW109123210 A TW 109123210A TW 109123210 A TW109123210 A TW 109123210A TW I827861 B TWI827861 B TW I827861B
Authority
TW
Taiwan
Prior art keywords
substrate
auxiliary tool
clamping auxiliary
less
end portion
Prior art date
Application number
TW109123210A
Other languages
English (en)
Chinese (zh)
Other versions
TW202106656A (zh
Inventor
浜島浩
Original Assignee
日商京瓷股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商京瓷股份有限公司 filed Critical 日商京瓷股份有限公司
Publication of TW202106656A publication Critical patent/TW202106656A/zh
Application granted granted Critical
Publication of TWI827861B publication Critical patent/TWI827861B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0416—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3306—Horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7626—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
TW109123210A 2019-08-08 2020-07-09 夾持用輔助具及洗淨裝置 TWI827861B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019146481 2019-08-08
JP2019-146481 2019-08-08

Publications (2)

Publication Number Publication Date
TW202106656A TW202106656A (zh) 2021-02-16
TWI827861B true TWI827861B (zh) 2024-01-01

Family

ID=74502912

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109123210A TWI827861B (zh) 2019-08-08 2020-07-09 夾持用輔助具及洗淨裝置

Country Status (6)

Country Link
US (1) US12057328B2 (https=)
JP (1) JP7308955B2 (https=)
KR (1) KR102726665B1 (https=)
CN (1) CN114223053A (https=)
TW (1) TWI827861B (https=)
WO (1) WO2021024638A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022138662A1 (ja) * 2020-12-23 2022-06-30 京セラ株式会社 クランプ用治具、クランプ用治具の製造方法および洗浄装置
WO2023127796A1 (ja) * 2021-12-28 2023-07-06 京セラ株式会社 クランプ用治具および洗浄装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10199964A (ja) * 1997-01-13 1998-07-31 Dainippon Screen Mfg Co Ltd 基板回転保持装置および回転式基板処理装置
TW200300976A (en) * 2001-11-27 2003-06-16 Tokyo Electron Ltd Liquid processing apparatus and method
TW201110266A (en) * 2009-08-07 2011-03-16 Applied Materials Inc Dual temperature heater
JP2014154866A (ja) * 2013-02-14 2014-08-25 Fujifilm Corp ドライエッチング装置及びドライエッチング装置用のクランプ

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS632665U (https=) 1986-06-24 1988-01-09
JPH02292822A (ja) 1989-05-02 1990-12-04 Fujitsu Ltd 半導体製造装置
JP4565433B2 (ja) 2001-11-27 2010-10-20 東京エレクトロン株式会社 液処理装置および液処理方法
JP2003258069A (ja) * 2002-03-05 2003-09-12 Sumitomo Mitsubishi Silicon Corp 半導体ウェーハの保持具
JP2004247582A (ja) * 2003-02-14 2004-09-02 Tokyo Electron Ltd 洗浄ブラシ及び基板洗浄装置
WO2004090967A1 (ja) * 2003-04-02 2004-10-21 Sumco Corporation 半導体ウェーハ用熱処理治具
JP5586734B2 (ja) 2012-08-07 2014-09-10 東京エレクトロン株式会社 基板洗浄装置、基板洗浄システム、基板洗浄方法および記憶媒体
JP6302665B2 (ja) 2013-12-24 2018-03-28 株式会社ディスコ スピンナー装置
US10920318B2 (en) 2015-10-30 2021-02-16 Kyocera Corporation Shower plate, semiconductor manufacturing apparatus, and method for manufacturing shower plate
JP6659493B2 (ja) 2016-07-29 2020-03-04 京セラ株式会社 載置用部材
KR102176900B1 (ko) * 2016-10-31 2020-11-10 교세라 가부시키가이샤 프로브 카드용 기판, 프로브 카드 및 검사장치

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10199964A (ja) * 1997-01-13 1998-07-31 Dainippon Screen Mfg Co Ltd 基板回転保持装置および回転式基板処理装置
TW200300976A (en) * 2001-11-27 2003-06-16 Tokyo Electron Ltd Liquid processing apparatus and method
TW201110266A (en) * 2009-08-07 2011-03-16 Applied Materials Inc Dual temperature heater
JP2014154866A (ja) * 2013-02-14 2014-08-25 Fujifilm Corp ドライエッチング装置及びドライエッチング装置用のクランプ

Also Published As

Publication number Publication date
JP7308955B2 (ja) 2023-07-14
US12057328B2 (en) 2024-08-06
KR102726665B1 (ko) 2024-11-06
KR20220031923A (ko) 2022-03-14
US20220293437A1 (en) 2022-09-15
CN114223053A (zh) 2022-03-22
JPWO2021024638A1 (https=) 2021-02-11
WO2021024638A1 (ja) 2021-02-11
TW202106656A (zh) 2021-02-16

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