CN114223053A - 夹紧用夹具以及清洗装置 - Google Patents

夹紧用夹具以及清洗装置 Download PDF

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Publication number
CN114223053A
CN114223053A CN202080055997.4A CN202080055997A CN114223053A CN 114223053 A CN114223053 A CN 114223053A CN 202080055997 A CN202080055997 A CN 202080055997A CN 114223053 A CN114223053 A CN 114223053A
Authority
CN
China
Prior art keywords
substrate
clamping jig
jig according
cross
sectional height
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080055997.4A
Other languages
English (en)
Chinese (zh)
Inventor
浜岛浩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of CN114223053A publication Critical patent/CN114223053A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0416—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3306—Horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7626—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
CN202080055997.4A 2019-08-08 2020-06-25 夹紧用夹具以及清洗装置 Pending CN114223053A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019146481 2019-08-08
JP2019-146481 2019-08-08
PCT/JP2020/024951 WO2021024638A1 (ja) 2019-08-08 2020-06-25 クランプ用治具および洗浄装置

Publications (1)

Publication Number Publication Date
CN114223053A true CN114223053A (zh) 2022-03-22

Family

ID=74502912

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080055997.4A Pending CN114223053A (zh) 2019-08-08 2020-06-25 夹紧用夹具以及清洗装置

Country Status (6)

Country Link
US (1) US12057328B2 (https=)
JP (1) JP7308955B2 (https=)
KR (1) KR102726665B1 (https=)
CN (1) CN114223053A (https=)
TW (1) TWI827861B (https=)
WO (1) WO2021024638A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022138662A1 (ja) * 2020-12-23 2022-06-30 京セラ株式会社 クランプ用治具、クランプ用治具の製造方法および洗浄装置
WO2023127796A1 (ja) * 2021-12-28 2023-07-06 京セラ株式会社 クランプ用治具および洗浄装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1432440A (zh) * 2001-11-27 2003-07-30 东京毅力科创株式会社 液处理装置及液处理方法
CN1771588A (zh) * 2003-04-02 2006-05-10 株式会社上睦可 半导体晶片用热处理夹具
CN102498558A (zh) * 2009-08-07 2012-06-13 应用材料公司 双温度加热器
CN103567169A (zh) * 2012-08-07 2014-02-12 东京毅力科创株式会社 基板清洗装置、基板清洗系统以及基板清洗方法
US20140224427A1 (en) * 2013-02-14 2014-08-14 Fujifilm Corporation Dry etching apparatus and clamp therefor
CN109804253A (zh) * 2016-10-31 2019-05-24 京瓷株式会社 探针卡用基板、探针卡和检测装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS632665U (https=) 1986-06-24 1988-01-09
JPH02292822A (ja) 1989-05-02 1990-12-04 Fujitsu Ltd 半導体製造装置
JPH10199964A (ja) 1997-01-13 1998-07-31 Dainippon Screen Mfg Co Ltd 基板回転保持装置および回転式基板処理装置
JP4565433B2 (ja) 2001-11-27 2010-10-20 東京エレクトロン株式会社 液処理装置および液処理方法
JP2003258069A (ja) * 2002-03-05 2003-09-12 Sumitomo Mitsubishi Silicon Corp 半導体ウェーハの保持具
JP2004247582A (ja) * 2003-02-14 2004-09-02 Tokyo Electron Ltd 洗浄ブラシ及び基板洗浄装置
JP6302665B2 (ja) 2013-12-24 2018-03-28 株式会社ディスコ スピンナー装置
US10920318B2 (en) 2015-10-30 2021-02-16 Kyocera Corporation Shower plate, semiconductor manufacturing apparatus, and method for manufacturing shower plate
JP6659493B2 (ja) 2016-07-29 2020-03-04 京セラ株式会社 載置用部材

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1432440A (zh) * 2001-11-27 2003-07-30 东京毅力科创株式会社 液处理装置及液处理方法
CN1771588A (zh) * 2003-04-02 2006-05-10 株式会社上睦可 半导体晶片用热处理夹具
CN102498558A (zh) * 2009-08-07 2012-06-13 应用材料公司 双温度加热器
CN103567169A (zh) * 2012-08-07 2014-02-12 东京毅力科创株式会社 基板清洗装置、基板清洗系统以及基板清洗方法
US20140224427A1 (en) * 2013-02-14 2014-08-14 Fujifilm Corporation Dry etching apparatus and clamp therefor
CN109804253A (zh) * 2016-10-31 2019-05-24 京瓷株式会社 探针卡用基板、探针卡和检测装置

Also Published As

Publication number Publication date
TWI827861B (zh) 2024-01-01
JP7308955B2 (ja) 2023-07-14
US12057328B2 (en) 2024-08-06
KR102726665B1 (ko) 2024-11-06
KR20220031923A (ko) 2022-03-14
US20220293437A1 (en) 2022-09-15
JPWO2021024638A1 (https=) 2021-02-11
WO2021024638A1 (ja) 2021-02-11
TW202106656A (zh) 2021-02-16

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