KR102726665B1 - 클램프용 지그 및 세정 장치 - Google Patents

클램프용 지그 및 세정 장치 Download PDF

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Publication number
KR102726665B1
KR102726665B1 KR1020227004032A KR20227004032A KR102726665B1 KR 102726665 B1 KR102726665 B1 KR 102726665B1 KR 1020227004032 A KR1020227004032 A KR 1020227004032A KR 20227004032 A KR20227004032 A KR 20227004032A KR 102726665 B1 KR102726665 B1 KR 102726665B1
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KR
South Korea
Prior art keywords
substrate
jig
less
paragraph
clamping
Prior art date
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KR1020227004032A
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English (en)
Korean (ko)
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KR20220031923A (ko
Inventor
히로시 하마시마
Original Assignee
교세라 가부시키가이샤
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Publication of KR20220031923A publication Critical patent/KR20220031923A/ko
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0416—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H01L21/68728—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H01L21/67051—
    • H01L21/68757—
    • H01L21/68785—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3306—Horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7626—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
KR1020227004032A 2019-08-08 2020-06-25 클램프용 지그 및 세정 장치 Active KR102726665B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2019-146481 2019-08-08
JP2019146481 2019-08-08
PCT/JP2020/024951 WO2021024638A1 (ja) 2019-08-08 2020-06-25 クランプ用治具および洗浄装置

Publications (2)

Publication Number Publication Date
KR20220031923A KR20220031923A (ko) 2022-03-14
KR102726665B1 true KR102726665B1 (ko) 2024-11-06

Family

ID=74502912

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227004032A Active KR102726665B1 (ko) 2019-08-08 2020-06-25 클램프용 지그 및 세정 장치

Country Status (6)

Country Link
US (1) US12057328B2 (https=)
JP (1) JP7308955B2 (https=)
KR (1) KR102726665B1 (https=)
CN (1) CN114223053A (https=)
TW (1) TWI827861B (https=)
WO (1) WO2021024638A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022138662A1 (ja) * 2020-12-23 2022-06-30 京セラ株式会社 クランプ用治具、クランプ用治具の製造方法および洗浄装置
WO2023127796A1 (ja) * 2021-12-28 2023-07-06 京セラ株式会社 クランプ用治具および洗浄装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004247582A (ja) * 2003-02-14 2004-09-02 Tokyo Electron Ltd 洗浄ブラシ及び基板洗浄装置
WO2017073679A1 (ja) * 2015-10-30 2017-05-04 京セラ株式会社 シャワープレート、半導体製造装置およびシャワープレートの製造方法
JP2018019017A (ja) * 2016-07-29 2018-02-01 京セラ株式会社 載置用部材

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS632665U (https=) 1986-06-24 1988-01-09
JPH02292822A (ja) 1989-05-02 1990-12-04 Fujitsu Ltd 半導体製造装置
JPH10199964A (ja) 1997-01-13 1998-07-31 Dainippon Screen Mfg Co Ltd 基板回転保持装置および回転式基板処理装置
TWI246124B (en) * 2001-11-27 2005-12-21 Tokyo Electron Ltd Liquid processing apparatus and method
JP4565433B2 (ja) 2001-11-27 2010-10-20 東京エレクトロン株式会社 液処理装置および液処理方法
JP2003258069A (ja) * 2002-03-05 2003-09-12 Sumitomo Mitsubishi Silicon Corp 半導体ウェーハの保持具
WO2004090967A1 (ja) * 2003-04-02 2004-10-21 Sumco Corporation 半導体ウェーハ用熱処理治具
JP5902085B2 (ja) * 2009-08-07 2016-04-13 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 処理チャンバ内で基板を位置決めするための装置及び処理チャンバ内で基板をセンタリングするための方法
JP5586734B2 (ja) 2012-08-07 2014-09-10 東京エレクトロン株式会社 基板洗浄装置、基板洗浄システム、基板洗浄方法および記憶媒体
JP2014154866A (ja) * 2013-02-14 2014-08-25 Fujifilm Corp ドライエッチング装置及びドライエッチング装置用のクランプ
JP6302665B2 (ja) 2013-12-24 2018-03-28 株式会社ディスコ スピンナー装置
KR102176900B1 (ko) * 2016-10-31 2020-11-10 교세라 가부시키가이샤 프로브 카드용 기판, 프로브 카드 및 검사장치

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004247582A (ja) * 2003-02-14 2004-09-02 Tokyo Electron Ltd 洗浄ブラシ及び基板洗浄装置
WO2017073679A1 (ja) * 2015-10-30 2017-05-04 京セラ株式会社 シャワープレート、半導体製造装置およびシャワープレートの製造方法
JP2018019017A (ja) * 2016-07-29 2018-02-01 京セラ株式会社 載置用部材

Also Published As

Publication number Publication date
TWI827861B (zh) 2024-01-01
JP7308955B2 (ja) 2023-07-14
US12057328B2 (en) 2024-08-06
KR20220031923A (ko) 2022-03-14
US20220293437A1 (en) 2022-09-15
CN114223053A (zh) 2022-03-22
JPWO2021024638A1 (https=) 2021-02-11
WO2021024638A1 (ja) 2021-02-11
TW202106656A (zh) 2021-02-16

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