TWI825133B - 測量裝置 - Google Patents

測量裝置 Download PDF

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Publication number
TWI825133B
TWI825133B TW108125832A TW108125832A TWI825133B TW I825133 B TWI825133 B TW I825133B TW 108125832 A TW108125832 A TW 108125832A TW 108125832 A TW108125832 A TW 108125832A TW I825133 B TWI825133 B TW I825133B
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TW
Taiwan
Prior art keywords
contact
contact piece
measurement object
measuring device
base
Prior art date
Application number
TW108125832A
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English (en)
Chinese (zh)
Other versions
TW202007979A (zh
Inventor
小林昌史
Original Assignee
日商日置電機股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2018141831A external-priority patent/JP2020016625A/ja
Priority claimed from JP2018141832A external-priority patent/JP2020016626A/ja
Priority claimed from JP2018141833A external-priority patent/JP2020016627A/ja
Application filed by 日商日置電機股份有限公司 filed Critical 日商日置電機股份有限公司
Publication of TW202007979A publication Critical patent/TW202007979A/zh
Application granted granted Critical
Publication of TWI825133B publication Critical patent/TWI825133B/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
TW108125832A 2018-07-27 2019-07-22 測量裝置 TWI825133B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2018141831A JP2020016625A (ja) 2018-07-27 2018-07-27 測定装置
JP2018-141831 2018-07-27
JP2018-141833 2018-07-27
JP2018141832A JP2020016626A (ja) 2018-07-27 2018-07-27 測定装置
JP2018-141832 2018-07-27
JP2018141833A JP2020016627A (ja) 2018-07-27 2018-07-27 測定装置

Publications (2)

Publication Number Publication Date
TW202007979A TW202007979A (zh) 2020-02-16
TWI825133B true TWI825133B (zh) 2023-12-11

Family

ID=69181468

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108125832A TWI825133B (zh) 2018-07-27 2019-07-22 測量裝置

Country Status (3)

Country Link
CN (1) CN112771387A (ja)
TW (1) TWI825133B (ja)
WO (1) WO2020022085A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI725821B (zh) * 2020-04-20 2021-04-21 躍澐科技股份有限公司 測試探針座結構
TWI802934B (zh) * 2020-07-16 2023-05-21 日商日置電機股份有限公司 測量裝置
WO2023228487A1 (ja) * 2022-05-24 2023-11-30 株式会社村田製作所 測定ユニットおよび測定装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06308155A (ja) * 1993-04-27 1994-11-04 Tokyo Electron Ltd プローブ装置
JP2000131340A (ja) * 1998-10-28 2000-05-12 Hioki Ee Corp コンタクトプローブ装置
JP2004340586A (ja) * 2003-05-13 2004-12-02 Jst Mfg Co Ltd 電気接触子、コンタクトブロック、高周波プローブ及び高周波プローブの製造方法
TW200533925A (en) * 2004-02-23 2005-10-16 Nihon Denshizairyo Kk Probe card
JP2006330006A (ja) * 2006-09-04 2006-12-07 Hioki Ee Corp コンタクトプローブ装置および回路基板検査装置
JP2008045916A (ja) * 2006-08-11 2008-02-28 Japan Electronic Materials Corp プローブの表面処理方法及びプローブ

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5506515A (en) * 1994-07-20 1996-04-09 Cascade Microtech, Inc. High-frequency probe tip assembly
JP4171094B2 (ja) * 1998-01-13 2008-10-22 株式会社日本マイクロニクス プローブユニット
JP3871825B2 (ja) * 1999-04-16 2007-01-24 株式会社日立製作所 金属質粉成形素材の再圧縮成形体及びその再圧縮成形体から得られる焼結体並びにそれらの製造方法
AU5224499A (en) * 1999-07-21 2001-02-13 Cascade Microtech, Inc. Membrane probing system
JP2001041975A (ja) * 1999-07-29 2001-02-16 Hioki Ee Corp コンタクトプローブ装置および回路基板検査装置
DE19945178C2 (de) * 1999-09-21 2003-05-28 Rosenberger Hochfrequenztech Meßspitze zur Hochfrequenzmessung und Verfahren zu deren Herstellung
JP2003035725A (ja) * 2001-07-25 2003-02-07 Micronics Japan Co Ltd 電気的接続装置
US7057404B2 (en) * 2003-05-23 2006-06-06 Sharp Laboratories Of America, Inc. Shielded probe for testing a device under test
JP2005272947A (ja) * 2004-03-25 2005-10-06 Tomokazu Takeuchi 燒結金属
JP2006226829A (ja) * 2005-02-17 2006-08-31 Yamaha Corp プローブヘッド及び電子デバイスの検査方法
JP5113481B2 (ja) * 2007-10-23 2013-01-09 株式会社日本マイクロニクス 接触子及びこれを用いる電気的接続装置
JP5219633B2 (ja) * 2008-06-05 2013-06-26 東京特殊電線株式会社 高周波測定用プローブ
JP2010060358A (ja) * 2008-09-02 2010-03-18 Murata Mfg Co Ltd 角速度センサ
JP5325085B2 (ja) * 2009-12-24 2013-10-23 日本碍子株式会社 接続装置
US8963567B2 (en) * 2011-10-31 2015-02-24 International Business Machines Corporation Pressure sensing and control for semiconductor wafer probing

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06308155A (ja) * 1993-04-27 1994-11-04 Tokyo Electron Ltd プローブ装置
JP2000131340A (ja) * 1998-10-28 2000-05-12 Hioki Ee Corp コンタクトプローブ装置
JP2004340586A (ja) * 2003-05-13 2004-12-02 Jst Mfg Co Ltd 電気接触子、コンタクトブロック、高周波プローブ及び高周波プローブの製造方法
TW200533925A (en) * 2004-02-23 2005-10-16 Nihon Denshizairyo Kk Probe card
JP2008045916A (ja) * 2006-08-11 2008-02-28 Japan Electronic Materials Corp プローブの表面処理方法及びプローブ
JP2006330006A (ja) * 2006-09-04 2006-12-07 Hioki Ee Corp コンタクトプローブ装置および回路基板検査装置

Also Published As

Publication number Publication date
TW202007979A (zh) 2020-02-16
WO2020022085A1 (ja) 2020-01-30
CN112771387A (zh) 2021-05-07

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