TWI825133B - Measuring device - Google Patents

Measuring device Download PDF

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Publication number
TWI825133B
TWI825133B TW108125832A TW108125832A TWI825133B TW I825133 B TWI825133 B TW I825133B TW 108125832 A TW108125832 A TW 108125832A TW 108125832 A TW108125832 A TW 108125832A TW I825133 B TWI825133 B TW I825133B
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Taiwan
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contact
contact piece
measurement object
measuring device
base
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TW108125832A
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Chinese (zh)
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TW202007979A (en
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小林昌史
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日商日置電機股份有限公司
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Priority claimed from JP2018141831A external-priority patent/JP2020016625A/en
Priority claimed from JP2018141833A external-priority patent/JP2020016627A/en
Priority claimed from JP2018141832A external-priority patent/JP2020016626A/en
Application filed by 日商日置電機股份有限公司 filed Critical 日商日置電機股份有限公司
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Publication of TWI825133B publication Critical patent/TWI825133B/en

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

A measuring device 100 includes a first contact 1 and a second contact 2 which are respectively pressed against a measurement target T, a main body 10 in which the first contact 1 and the second contact 2 are installed, and a transmission substrate 60 provided with a high frequency transmission line (microstrip line) to which the first contact 1 and the second contact 2 are electrically connected. The main body 10 includes a base portion 20, a holding portion 30 for holding the first contact 1 and the second contact 2, and a support portion 40 installed to the base portion 20 and supporting the holding portion 30. The holding portion 30 moves relatively to the base portion 20 along with the first contact 1 and the second contact 2 being pressed against the measuring target T.

Description

測量裝置 Measuring device

本發明係關於一種測量裝置。 The invention relates to a measuring device.

於日本特開JP2005-223170A中揭示有一種高頻特性測量裝置,該高頻特性測量裝置具有:載置屬於測量對象之形成有複數個積體電路之晶圓的可昇降的工件台;及測量積體電路之高頻特性的高頻探針裝置。此高頻探針裝置係具有由以隔開預定間隔的方式並列地配置於大致同一平面上的信號針及接地針所構成的探針。 Japanese Patent Application Laid-Open JP2005-223170A discloses a high-frequency characteristic measuring device. The high-frequency characteristic measuring device has: an elevating workpiece table for placing a wafer having a plurality of integrated circuits that is a measurement object; and measuring High-frequency probe device for high-frequency characteristics of integrated circuits. This high-frequency probe device has a probe composed of signal pins and ground pins arranged side by side on substantially the same plane at a predetermined interval.

在上述的測量裝置中,首先使工件台上昇並使探針(接觸件)的前端與測量對象接觸,之後使工件台再上昇,藉此一面使探針彎曲一面以穩定的姿勢使之與測量對象接觸。 In the above-mentioned measuring device, the workpiece table is first raised to bring the tip of the probe (contact member) into contact with the measurement object, and then the workpiece table is raised again, thereby bending the probe and bringing it into contact with the measurement object in a stable posture. object contact.

然而,就上述的測量裝置而言,在探針彎曲的過程中,探針的前端會在測量對象上移動,而會有在測量對象發生接觸痕跡的疑慮。而且,由於探針若彎曲量愈大則其傳輸損失愈增加,所以上述的測量裝置會有肇因於探針的彎曲使高頻特性的測量精密度下降的疑慮。 However, with the above-mentioned measuring device, during the bending process of the probe, the tip of the probe may move on the measurement object, and there is a concern that contact traces may occur on the measurement object. Furthermore, the greater the bending amount of the probe, the greater the transmission loss. Therefore, the above-mentioned measuring device may have a concern that the measurement accuracy of the high-frequency characteristics is reduced due to the bending of the probe.

本發明係有鑑於上述問題點所研創者,目的在於抑制在測量對象的接觸痕跡的發生,並且使測量裝置的測量精密度提升。 The present invention was developed in view of the above-mentioned problems, and its purpose is to suppress the occurrence of contact marks on the measurement object and to improve the measurement accuracy of the measurement device.

根據本發明的一態樣,測量裝置係具備有:複數個接觸件,係各自被壓抵至測量對象;本體部,係安裝有複數個接觸件;以及傳輸基板,係設置有電性連接於複數個接觸件之高頻傳輸線路;其中,本體部係具有:基座部;保持部,係保持複數個接觸件;支持部,係安裝於基座部且支持保持部;而保持部係隨著複數個接觸件往測量對象的壓抵,而對基座部做相對移動。 According to one aspect of the present invention, the measuring device is provided with: a plurality of contact pieces, each of which is pressed against the measurement object; a body portion equipped with a plurality of contact pieces; and a transmission substrate that is electrically connected to A high-frequency transmission line with a plurality of contacts; wherein, the body part has: a base part; a holding part that holds a plurality of contacts; a support part that is installed on the base part and supports the holding part; and the holding part follows As the plurality of contact pieces are pressed against the measurement object, the base portion is relatively moved.

根據該態樣,由於保持部係隨著複數個接觸件往測量對象的壓抵而對基座部做相對移動,所以由保持部所保持之接觸件的各者也沿著壓抵的方向對基座部做相對移動。因此,會抑制往測量對象壓抵之接觸件的過度移動,且抑制於測量對象中之接觸痕跡的發生。另外,由於往測量對象壓抵之接觸件的過度的移動受到抑制,因此即使不用構成使複數個接觸件大幅地彎曲亦可,所以肇因於複數個接觸件的彎曲之傳輸損失的增加係受到抑制。因此,可抑制在測量對象之接觸痕跡的發生,並且使測量裝置之測量精確度提升。 According to this aspect, since the holding portion moves relative to the base portion as the plurality of contacts are pressed against the measurement object, each of the contacts held by the holding portion also faces each other in the direction of the pressing. The base part moves relatively. Therefore, excessive movement of the contact piece pressed against the measurement object is suppressed, and the occurrence of contact traces in the measurement object is suppressed. In addition, since excessive movement of the contacts pressed against the measurement object is suppressed, it is not necessary to greatly bend the plurality of contacts. Therefore, the increase in transmission loss due to the bending of the plurality of contacts is limited. inhibition. Therefore, the occurrence of contact marks on the measurement object can be suppressed, and the measurement accuracy of the measurement device can be improved.

1、101:第一接觸件 1. 101: First contact piece

1a、2a:底面 1a, 2a: Bottom surface

1b、2b:頂面 1b, 2b: top surface

1c、1d、2c、2d:側面 1c, 1d, 2c, 2d: side

1e、2e:第一斜面 1e, 2e: first slope

1f、2f:第二斜面 1f, 2f: second slope

1g、2g:第三斜面 1g, 2g: third slope

1h、2h:段差面 1h, 2h: step difference surface

2、102:第二接觸件 2. 102: Second contact piece

3、103:第三接觸件 3. 103: Third contact piece

10、120:本體部 10, 120: Body part

11:第一本體部 11:The first body part

15:第二本體部 15:Second body part

19:第三本體部 19:The third body part

20、130:基座部 20, 130: Base part

20a:螺栓 20a: Bolt

21:第一基座部 21:First base part

25:第二基座部 25:Second base part

29:第三基座部 29:Third base part

30:保持部 30:Maintenance Department

31:第一保持部 31:First maintenance department

32:第一插入孔 32: First insertion hole

32a、37a:擋止面 32a, 37a: Stopping surface

35:第二保持部 35:Second maintenance part

37:第二插入孔 37:Second insertion hole

39:第三保持部 39:Third maintenance department

40:支持部 40:Support Department

41:第一支持部 41:First Support Department

42、43、46、47、151、155:連接部 42, 43, 46, 47, 151, 155: Connection part

42a、43a、46a、47a、152、156:桿部 42a, 43a, 46a, 47a, 152, 156: Rod

42b、42c、43b、43c、46b、46c、47b、47c:關節部 42b, 42c, 43b, 43c, 46b, 46c, 47b, 47c: joint part

45:第二支持部 45:Second Support Department

49:第三支持部 49:Third Support Department

60、110:傳輸基板 60, 110: Transmission substrate

60a、110a、110b、260b、260c:狹縫 60a, 110a, 110b, 260b, 260c: slit

61、111:基材 61, 111: Base material

61a:凹部 61a: concave part

62、112:信號線 62, 112: signal line

63:接地線 63: Ground wire

64、64a、64b:連接層 64, 64a, 64b: connection layer

65:第一接著部 65:The first part

66:第二接著部 66: The second part

66a、68a:貫穿孔 66a, 68a: Through hole

67、69:貫穿層 67, 69: penetration layer

68:第三接著部 68:The third part

100、100A、200、300:測量裝置 100, 100A, 200, 300: Measuring device

113:第一接地線 113:First ground wire

114:第二接地線 114: Second ground wire

140:保持部 140:Maintenance Department

150:支持部 150:Support Department

153、154、157、158:關節部 153, 154, 157, 158: joints

160:彈性構件 160: Elastic component

260:彈性構造部 260:Elastic Structure Department

260a:間隙 260a: Gap

261:基部 261:Base

265:第一變形部 265:First Transformation Department

266:第二變形部 266:Second Transformation Department

267:第三變形部 267:Third Transformation Department

268:變形部 268:Deformation Department

P:前端 P:Front end

R:基準面 R: base plane

T:測量對象 T: Measurement object

Th:厚度 Th:Thickness

Ts:接觸面 Ts: contact surface

W:寬度 W: Width

第1圖為顯示本發明之第一實施型態之測量裝置的立體圖。 Figure 1 is a perspective view showing a measuring device according to a first embodiment of the present invention.

第2圖為顯示第一實施型態的測量裝置的正視圖。 Figure 2 is a front view showing the measuring device of the first embodiment.

第3圖為顯示第一實施型態之測量裝置的第一本體部的側視圖。 FIG. 3 is a side view showing the first body part of the measuring device according to the first embodiment.

第4圖為顯示第一實施型態之測量裝置的第一接觸件的立體圖。 FIG. 4 is a perspective view showing the first contact member of the measuring device according to the first embodiment.

第5圖為顯示第一實施型態之測量裝置的傳輸基板的俯視圖。 FIG. 5 is a top view showing the transmission substrate of the measuring device according to the first embodiment.

第6圖為顯示第一實施型態之測量裝置的傳輸基板的仰視圖。 FIG. 6 is a bottom view showing the transmission substrate of the measuring device according to the first embodiment.

第7圖為顯示第一實施型態之變形例的接觸件的俯視圖。 FIG. 7 is a top view showing a contact member according to a modified example of the first embodiment.

第8圖為顯示第一實施型態之變形例的測量裝置的立體圖。 Fig. 8 is a perspective view of a measuring device showing a modification of the first embodiment.

第9圖為顯示第一實施型態之變形例的傳輸基板的俯視圖。 FIG. 9 is a top view of a transmission substrate showing a modification of the first embodiment.

第10圖為從上方顯示第二實施型態之測量裝置的立體圖。 Figure 10 is a perspective view showing the measuring device of the second embodiment from above.

第11圖為顯示第二實施型態之測量裝置的側視圖。 FIG. 11 is a side view showing the measuring device of the second embodiment.

第12圖為從下方顯示第二實施型態之測量裝置的立體圖。 FIG. 12 is a perspective view showing the measuring device of the second embodiment from below.

第13圖為第二實施型態之測量裝置的傳輸基板的俯視圖。 Figure 13 is a top view of the transmission substrate of the measuring device according to the second embodiment.

第14圖為顯示第三實施型態之測量裝置的本體部的立體圖。 Fig. 14 is a perspective view showing the main body of the measuring device according to the third embodiment.

第15圖為從下方顯示第三實施型態之測量裝置的立體圖。 Fig. 15 is a perspective view showing the measuring device of the third embodiment from below.

第16圖為顯示第三實施型態之變形例之測量裝置的本體部的立體圖。 FIG. 16 is a perspective view of a main body of a measuring device according to a modification of the third embodiment.

(第一實施型態) (First implementation type)

以下,參照圖示,針對本發明的第一實施型態之測量裝置100加以說明。 Hereinafter, the measurement device 100 according to the first embodiment of the present invention will be described with reference to the drawings.

測量裝置100係用於例如電性檢查電路基板的檢查裝置(圖示省略)。測量裝置100係測量在電路基板所包含的測量對象T(參照第3圖)所發生之電磁波的高頻特性,該電路基板所包含的測量對象T為印刷有佈線圖案的半導體晶圓或電子電路基板、安裝有半導體晶圓或電子電路基板的電子電路安裝基板等。 The measuring device 100 is an inspection device (not shown) used for electrically inspecting a circuit board, for example. The measuring device 100 measures the high-frequency characteristics of electromagnetic waves generated by a measurement object T (see FIG. 3 ) included in a circuit board, which is a semiconductor wafer or an electronic circuit on which a wiring pattern is printed. Substrates, electronic circuit mounting substrates on which semiconductor wafers or electronic circuit substrates are mounted, etc.

如第1圖及第2圖所示,測量裝置100係具備有:作為各自被壓抵於測量對象T之複數個接觸件的第一接觸件1及第二接觸件2;安裝有第一接觸件1及第二接觸件2的本體部10;以及設置有電性連接於第一接觸件1及第二接觸件2之高頻傳輸線路的傳輸基板60。 As shown in Figures 1 and 2, the measuring device 100 is provided with: a first contact 1 and a second contact 2 as a plurality of contacts each pressed against the measurement object T; The body portion 10 of the component 1 and the second contact component 2; and the transmission substrate 60 provided with a high-frequency transmission line electrically connected to the first contact component 1 and the second contact component 2.

第一接觸件1及第二接觸件2為要被壓抵於測量對象T並從測量對象T輸入高頻信號的電極。第一接觸件1及第二接觸件2係從與測量對象T的接觸面Ts(參照第3圖)成垂直的方向被壓抵於測量對象T。第一接觸件1及第二接觸件2係利用燒結所形成的燒結金屬,更具體而言為由工具鋼所形成。 The first contact 1 and the second contact 2 are electrodes to be pressed against the measurement object T and to input high-frequency signals from the measurement object T. The first contact piece 1 and the second contact piece 2 are pressed against the measurement object T from a direction perpendicular to the contact surface Ts (see FIG. 3 ) with the measurement object T. The first contact piece 1 and the second contact piece 2 are made of sintered metal formed by sintering, more specifically, they are made of tool steel.

如第2圖及第3圖所示,第一接觸件1與第二接觸件2係以隔開預定的間隔並彼此平行地延伸,且對測量對象T的接觸面Ts呈傾斜的方式安裝於本體部10。第一接觸件1及第二接觸件2為具有矩形剖面的銷,且其前端部形成為逐漸變細的形狀而與測量對象T接觸。第一接觸件1及第二接觸件2的基端部係與傳輸基板60接著。第一接觸件1與第二接觸件2為相同形狀。因此,以下以第一接觸件1為例而針對具體構造加以說明,且適當省略第二接觸件2之構造的詳細說明。第4圖中的括弧內的符號係顯示與第一接觸件1之各構成相對應的第二接觸件2之構成。 As shown in Figures 2 and 3, the first contact piece 1 and the second contact piece 2 are installed at a predetermined interval, extend parallel to each other, and are inclined to the contact surface Ts of the measurement object T. Main body part 10. The first contact piece 1 and the second contact piece 2 are pins having a rectangular cross section, and their front ends are formed in a tapered shape to contact the measurement object T. The base ends of the first contact 1 and the second contact 2 are connected to the transmission substrate 60 . The first contact piece 1 and the second contact piece 2 have the same shape. Therefore, the specific structure will be described below by taking the first contact 1 as an example, and the detailed description of the structure of the second contact 2 will be appropriately omitted. The symbols in parentheses in FIG. 4 show the configuration of the second contact 2 corresponding to the respective configurations of the first contact 1 .

如第4圖所示,第一接觸件1的前端部係隨著從與測量對象T接觸之前端P朝向基端側離開,寬度W及厚度Th會逐漸增加。其中,「寬度」係指第2圖中左右方向,並為第一接觸件1與第二接觸件2所鄰接的方向(鄰接方向)的長度。另外,「厚度」係指與第一接觸件1及第二接觸件2所延伸之方向(延伸方向)及鄰接方向成垂直之方向的長度。 As shown in FIG. 4 , the width W and thickness Th of the front end portion of the first contact 1 gradually increase as the front end P moves away from the front end P in contact with the measurement object T toward the base end side. Among them, "width" refers to the left-right direction in Figure 2 and is the length in the direction in which the first contact piece 1 and the second contact piece 2 are adjacent (adjacent direction). In addition, "thickness" refers to the length perpendicular to the direction in which the first contact member 1 and the second contact member 2 extend (the extension direction) and the adjacent direction.

以下,第一接觸件1中,將與傳輸基板60接著之面稱為「底面1a」,將與底面1a成平行之面稱為「頂面1b」,將與底面1a及頂面1b成垂直並彼此成平行之面分別稱為「側面1c」、「側面1d」。側面1c係與第二接觸件2相對向的相向面。 Hereinafter, the surface of the first contact 1 that is in contact with the transmission substrate 60 will be called the "bottom surface 1a", the surface that is parallel to the bottom surface 1a will be called the "top surface 1b", and the surface that is perpendicular to the bottom surface 1a and the top surface 1b will be called "bottom surface 1a". The surfaces that are parallel to each other are called "side 1c" and "side 1d" respectively. The side surface 1 c is an opposing surface facing the second contact piece 2 .

第一接觸件1的前端P係如第2圖及第4圖所示,設置為位於第一接觸件1之鄰接方向的中央。第一接觸件1係隨著自前端P遠離,寬度W會增加,並且厚度會朝底面1a增加。第一接觸件1的前端部係形成有:與底面1a連接且相對於測量對象T之接觸面Ts呈傾斜的第一斜面1e;各自對於側面1c及1d傾斜而連接,並且與第一斜面1e連接的第二斜面1f及第三斜面1g。前端P係由頂面1b、第一斜面1e、第二斜面1f及第三斜面1g所形成。 The front end P of the first contact 1 is located at the center of the first contact 1 in the adjacent direction as shown in FIGS. 2 and 4 . As the first contact member 1 moves away from the front end P, the width W increases, and the thickness increases toward the bottom surface 1a. The front end portion of the first contact piece 1 is formed with: a first inclined surface 1e connected to the bottom surface 1a and inclined with respect to the contact surface Ts of the measurement object T; each is connected to the side surfaces 1c and 1d with an inclination, and is connected with the first inclined surface 1e The connected second inclined surface 1f and the third inclined surface 1g. The front end P is formed by the top surface 1b, the first inclined surface 1e, the second inclined surface 1f and the third inclined surface 1g.

第二接觸件2的前端部係與第一接觸件1同樣地形成有:相對於接觸面Ts傾斜的第一斜面2e;以及各自對於側面2c及2d傾斜而連接,並且與第一斜面2e連接的第二斜面2f及第三斜面2g。第二接觸件2的前端P亦藉由頂面2b、第一斜面2e、第二斜面2f及第三斜面2g所形成。第二接觸件2亦隨著遠離前端P,寬度W增加,並且厚度Th朝向底面2a增加。 Like the first contact 1, the front end portion of the second contact 2 is formed with a first inclined surface 2e inclined with respect to the contact surface Ts; and each is connected to the side surfaces 2c and 2d by being inclined and connected to the first inclined surface 2e. The second slope 2f and the third slope 2g. The front end P of the second contact piece 2 is also formed by the top surface 2b, the first inclined surface 2e, the second inclined surface 2f and the third inclined surface 2g. The width W of the second contact member 2 also increases as it moves away from the front end P, and the thickness Th increases toward the bottom surface 2a.

如此,第一接觸件1及第二接觸件2各自具有:隨著朝向前端P剖面積會縮小之逐漸變小的形狀的前端部,所以會使前端P容易與測量對象T接觸。另外,第一接觸件1及第二接觸件2的底面1a、2a形成有以遠離測量對象T之方式傾斜的第一斜面1e、2e,所以可避免在前端P以外之第一接觸件1及第二接觸件2與測量對象T的接觸(干涉)。 In this way, each of the first contact piece 1 and the second contact piece 2 has a front end portion with a shape in which the cross-sectional area gradually decreases toward the front end P, so the front end P can easily come into contact with the measurement object T. In addition, the bottom surfaces 1a and 2a of the first contact piece 1 and the second contact piece 2 are formed with first slopes 1e and 2e that are inclined away from the measurement object T, so that the first contact piece 1 and 2 outside the front end P can be avoided. Contact (interference) between the second contact piece 2 and the measurement object T.

如第1圖至第3圖所示,本體部10係具有:基座部20;保持第一接觸件1及第二接觸件2的保持部30;以及支持安裝於基座部20之保持部30的支持部40。 As shown in Figures 1 to 3, the body part 10 has: a base part 20; a holding part 30 that holds the first contact piece 1 and the second contact piece 2; and a holding part that is supported and installed on the base part 20. 30's support section 40's.

如第1圖所示,基座部20係藉由彼此以螺栓20a而結合得第一基座部21及第二基座部25所構成。基座部20會藉由檢查裝置的昇降裝置(圖示省略)而沿著垂直上下方向(與測量對象T之接觸面Ts成垂直的方向)移動。藉由基座部20的上下移動,使第一接觸件1及第二接觸件2相對於測量對象T接觸、分離。 As shown in FIG. 1 , the base portion 20 is composed of a first base portion 21 and a second base portion 25 that are coupled to each other with bolts 20 a. The base portion 20 moves in the vertical up-and-down direction (the direction perpendicular to the contact surface Ts of the measurement object T) by the lifting device (not shown) of the inspection device. By moving the base part 20 up and down, the first contact piece 1 and the second contact piece 2 are brought into contact with and separated from the measurement object T.

保持部30係具有第一保持部31及第二保持部35,其係作為個別地保持第一接觸件1及第二接觸件2(複數個接觸件)之各者的複數個固持器部。第一保持部31係保持第一接觸件1。第二保持部35係保持第二接觸件2。另外,支持部40係具有第一支持部41及第二支持部45,其係作為個別地支持第一保持部31及第二保持部35(複數個固持器部)之各者的複數個固持器支持部。第一支持部41係安裝於第一基座部21並支持第一保持部31。第二支持部45係安裝於第二基座部25並支持第二保持部35。 The holding part 30 has a first holding part 31 and a second holding part 35 which serve as a plurality of holder parts that individually hold the first contact 1 and the second contact 2 (a plurality of contacts). The first holding part 31 holds the first contact piece 1 . The second holding part 35 holds the second contact piece 2 . In addition, the support part 40 has a first support part 41 and a second support part 45 as a plurality of holding parts that individually support each of the first holding part 31 and the second holding part 35 (a plurality of holder parts). Server Support Department. The first support part 41 is installed on the first base part 21 and supports the first holding part 31. The second support part 45 is installed on the second base part 25 and supports the second holding part 35 .

第一基座部21、第一保持部31及第一支持部41係藉由樹脂而彼此一體成形,且構成第一本體部11。第二基座部25、第二保持部35及第二支持部45係藉由樹脂而彼此地一體成形,且構成第二本體部15。也就是,由第一本體部11與第二本體部15來構成本體部10。 The first base part 21 , the first holding part 31 and the first supporting part 41 are integrally formed with each other by resin, and constitute the first body part 11 . The second base part 25 , the second holding part 35 and the second supporting part 45 are integrally formed with each other by resin, and constitute the second body part 15 . That is, the main body 10 is composed of the first main body 11 and the second main body 15 .

如第2圖所示,第一本體部11與第二本體部15係以隔著預定的間隔(間隙)而鄰接的方式設置。第一本體部11與第二本體部15係相對於與第一接觸件1及第二接觸件2平行並位於兩者之中間的假想之基準面R具有對稱構造。因此,以下以第一本體部11的具體構造為主進行說明,且適當省略第二本體部15之構造的詳細說明。第3圖中之括弧內的符號係顯示與第一本體部11之構成相對應之第二本體部15的構成者。 As shown in FIG. 2 , the first body part 11 and the second body part 15 are provided adjacent to each other with a predetermined interval (gap) therebetween. The first body part 11 and the second body part 15 have a symmetrical structure with respect to an imaginary reference plane R that is parallel to the first contact piece 1 and the second contact piece 2 and located between them. Therefore, the following description will mainly focus on the specific structure of the first body part 11 , and the detailed description of the structure of the second body part 15 will be appropriately omitted. The symbols in parentheses in FIG. 3 indicate the components of the second body part 15 corresponding to the components of the first body part 11 .

如第3圖所示,第一保持部31形成有要插入第一接觸件1的第一插入孔32。第一插入孔32係形成為開口朝第一保持部31中與第二保持部35相對向之面的缺口狀。第一插入孔32的內周形成有作為與形成在第一接觸件1之段差面1h接觸之第一限制部的擋止面32a。擋止面32a與第一接觸件1之段差面1h接觸,藉此限制第一接觸件1如前端P朝向第一插入孔32內的移動,換言之限制第一接觸件1往從測量對象T分離之方向的移動。如此,第一接觸件1會與擋止面32a接觸而定位。 As shown in FIG. 3 , the first holding portion 31 is formed with a first insertion hole 32 into which the first contact 1 is inserted. The first insertion hole 32 is formed in a notch shape that opens toward the surface of the first holding part 31 that faces the second holding part 35 . A stopper surface 32 a is formed on the inner periphery of the first insertion hole 32 as a first restricting portion that contacts the step surface 1 h formed on the first contact 1 . The stop surface 32a is in contact with the step surface 1h of the first contact member 1, thereby restricting the first contact member 1 such as the front end P from moving toward the first insertion hole 32, in other words, restricting the first contact member 1 from being separated from the measurement object T. movement in the direction. In this way, the first contact piece 1 will be in contact with the blocking surface 32a and positioned.

就由第一保持部31來保持第一接觸件1而言,首先使第一接觸件1從要與傳輸基板60接著的基端部插入至第一插入孔32。第一接觸件1從基端部插入至第一插入孔32直至段差面1h與擋止面32a接觸。在該狀態,於第一接觸件1與第一保持部31塗佈接著劑,使第一接觸件1與第一保持部31接著。因此,第一接觸件1會藉由第一保持部31保持在前端P從第一保持部31朝向測量對象T突出的狀態。 To hold the first contact 1 by the first holding portion 31 , first, the first contact 1 is inserted into the first insertion hole 32 from the base end portion to be contacted with the transmission substrate 60 . The first contact piece 1 is inserted into the first insertion hole 32 from the base end until the step surface 1 h contacts the stop surface 32 a. In this state, the adhesive is applied to the first contact 1 and the first holding part 31 to bond the first contact 1 and the first holding part 31 . Therefore, the first contact piece 1 is held by the first holding portion 31 in a state where the front end P protrudes toward the measurement object T from the first holding portion 31 .

另外,與第一保持部31同樣地,第二保持部35形成有要插入第二接觸件2的第二插入孔37。第二插入孔37的內周形成有作為與形成於第二接觸件2之段差面2h接觸之第二限制部的擋止面37a。擋止面37a與第二接觸件2之段差面2h接觸,藉此限制第二接觸件2如前端P朝向第二插入孔37內的移動。 In addition, like the first holding part 31 , the second holding part 35 is formed with a second insertion hole 37 into which the second contact 2 is inserted. A stopper surface 37 a is formed on the inner periphery of the second insertion hole 37 as a second restricting portion that contacts the step surface 2 h formed on the second contact 2 . The stop surface 37a contacts the step surface 2h of the second contact member 2, thereby restricting the movement of the second contact member 2 such as the front end P toward the second insertion hole 37.

第一支持部41係由具有一對的連接部42、43的連接機構來構成。一對的連接部42、43係各自對接觸面Ts成平行地延伸,且沿與測量對象T之接觸面Ts成垂直方向排列。一方的連接部42係具有桿部42a、關節部42b以及關節部42c,該桿部42a係具有矩形剖面,該關節部42b係連接桿部42a之一端與第一保持部31,該關節部42c係連接桿部42a之另一端與第一基座部21。同樣地,另一方的連接部43係具有桿部43a、關節部43b以及關節部43c,該桿部43a係具有矩形剖面,該關節部43b係連接桿部43a之一端與第一保持部31,該關節部43c係連接桿部43a之另一端與第一基座部21。一方的連接部42的桿部42a會以較另一方之連接部43的桿部43a還短的方式來形成。 The first support part 41 is composed of a connection mechanism having a pair of connection parts 42 and 43 . The pair of connecting portions 42 and 43 each extend parallel to the contact surface Ts and are arranged in a perpendicular direction to the contact surface Ts of the measurement object T. One connection part 42 has a rod part 42a, a joint part 42b and a joint part 42c. The rod part 42a has a rectangular cross section. The joint part 42b connects one end of the rod part 42a and the first holding part 31. The joint part 42c The other end of the rod part 42a is connected to the first base part 21. Similarly, the other connecting part 43 has a rod part 43a, a joint part 43b and a joint part 43c. The rod part 43a has a rectangular cross section. The joint part 43b connects one end of the rod part 43a and the first holding part 31. The joint part 43c connects the other end of the rod part 43a and the first base part 21. The rod portion 42a of one connecting portion 42 is formed shorter than the rod portion 43a of the other connecting portion 43.

於一方的連接部42中之桿部42a與第一基座部21及第一保持部31之間形成有半圓狀的凹槽。同樣地,於另一方的連接部43中之桿部43a與第一基座部21及第一保持部31之間形成有半圓狀的凹槽。各凹槽係與測量對象T之接觸面Ts成平行而與長邊方向(第3圖中左右方向)成垂直地延伸。藉此,在桿部42a、43a與第一基座部21及第一保持部31之間設置有關節部42b、42c、43b、43c。各關節部42b、42c、43b、43c之與桿部42a、43a之長邊方向正交的剖面面積比桿部42a、43a還縮小,而構成為相較於桿部42a、43a較容易彈性變形。 A semicircular groove is formed between the rod portion 42a of one of the connecting portions 42, the first base portion 21, and the first holding portion 31. Similarly, a semicircular groove is formed between the rod portion 43 a of the other connecting portion 43 and the first base portion 21 and the first holding portion 31 . Each groove is parallel to the contact surface Ts of the measurement object T and extends perpendicularly to the longitudinal direction (the left-right direction in Figure 3). Thereby, joint parts 42b, 42c, 43b, 43c are provided between the rod parts 42a, 43a, the first base part 21, and the first holding part 31. The cross-sectional area of each joint portion 42b, 42c, 43b, and 43c perpendicular to the longitudinal direction of the rod portions 42a and 43a is smaller than that of the rod portions 42a and 43a, and is configured to be elastically deformed more easily than the rod portions 42a and 43a. .

當使第一基座部21沿鉛直方向下方移動,並使第一接觸件1壓抵至測量對象T時,受到測量對象T的反作用力(以下,亦稱「壓抵反作用力」)來使連接部42的關節部42b、42c及連接部43的關節部43b、43c彈性變形,而各桿部42a、43a會相對於第一保持部31及第一基座部 21傾斜(相對旋轉)。若以另一方的連接部42為例說明時,另一方的連接部42會以一方的關節部42b為中心使得桿部42a對第一保持部31相對旋轉,且以另一方關節部42c為中心使得桿部42a對第一基座部21相對旋轉。如此,當將第一接觸件1壓抵於測量對象T時,會使第一支持部41變形,藉此容許鉛直方向中之第一基座部21與第一保持部31的相對移動。另外,一方的桿部42a會比另一方的桿部43a較短,所以可更直線性地使第一基座部21及第一保持部31往鉛直方向做相對移動。 When the first base portion 21 is moved downward in the vertical direction and the first contact piece 1 is pressed against the measurement object T, it receives the reaction force of the measurement object T (hereinafter also referred to as "pressure reaction force"). The joint portions 42b and 42c of the connecting portion 42 and the joint portions 43b and 43c of the connecting portion 43 are elastically deformed, and each rod portion 42a and 43a is tilted (relatively rotated) relative to the first holding portion 31 and the first base portion 21 . Taking the other connecting part 42 as an example, the other connecting part 42 will rotate the rod part 42a relative to the first holding part 31 with the one joint part 42b as the center, and with the other joint part 42c as the center. The rod part 42a is caused to rotate relative to the first base part 21. In this way, when the first contact piece 1 is pressed against the measurement object T, the first supporting part 41 will be deformed, thereby allowing the relative movement of the first base part 21 and the first holding part 31 in the vertical direction. In addition, one of the rod portions 42a is shorter than the other rod portion 43a, so the first base portion 21 and the first holding portion 31 can be relatively moved in the vertical direction more linearly.

與第一支持部41同樣地,第二支持部45係由連接機構所構成,該連接機構係具有一對連接部46、47。一方的連接部46係具有桿部46a、關節部46b及關節部46c,該桿部46a具有矩形剖面,該關節部46b係連接桿部46a的一端與第二保持部35,該關節部46c係連接桿部46a的另一端與第二基座部25。另一方的連接部47係具有桿部47a、關節部47b及關節部47c,該桿部47a係具有矩形剖面,該關節部47b係連接桿部47a的一端與第二保持部35,該關節部47c係連接桿部47a的另一端與第二基座部25。 Like the first support part 41 , the second support part 45 is composed of a connection mechanism having a pair of connection parts 46 and 47 . One connection part 46 has a rod part 46a, a joint part 46b, and a joint part 46c. The rod part 46a has a rectangular cross section. The joint part 46b connects one end of the rod part 46a and the second holding part 35. The joint part 46c is The other end of the rod part 46a and the second base part 25 are connected. The other connecting part 47 has a rod part 47a, a joint part 47b, and a joint part 47c. The rod part 47a has a rectangular cross section. The joint part 47b connects one end of the rod part 47a and the second holding part 35. The joint part 47a has a rectangular cross section. 47c connects the other end of the rod part 47a and the second base part 25.

當使第二接觸件2壓抵至測量對象T時,與第一支持部41同樣地,會使得第二支持部45彈性變形,且容許第二保持部35與第二基座部25之鉛直方向的相對移動。第一支持部41及第二支持部45係於兩者之間設置間隙且各自獨立與第一基座部21及第二基座部25連接,所以第一保持部31及第二保持部35可以彼此獨立移動。 When the second contact piece 2 is pressed against the measurement object T, like the first support part 41 , the second support part 45 will be elastically deformed, and the vertical position of the second holding part 35 and the second base part 25 will be allowed. relative movement in direction. The first support part 41 and the second support part 45 are independently connected to the first base part 21 and the second base part 25 with a gap between them, so the first holding part 31 and the second holding part 35 Can move independently of each other.

另外,當第一接觸件1及第二接觸件2壓抵至測量對象T時,第一支持部41及第二支持部45會相對於第一接觸件1及第二接觸件 2優先彈性變形。換言之,第一接觸件1及第二接觸件2所具有的耐久性,係當被壓抵至測量對象T時,第一支持部41及第二支持部45會優先彈性變形之程度。 In addition, when the first contact piece 1 and the second contact piece 2 are pressed against the measurement object T, the first support part 41 and the second support part 45 will elastically deform preferentially relative to the first contact piece 1 and the second contact piece 2 . In other words, the durability of the first contact piece 1 and the second contact piece 2 is such that when pressed against the measurement object T, the first supporting part 41 and the second supporting part 45 will preferentially elastically deform.

傳輸基板60為具有柔軟性之帶狀的可撓性印刷基板。傳輸基板60可由外力而變形。如第1圖及第2圖所示,於傳輸基板60的一端部(第5圖中上端部)接著有第一接觸件1及第二接觸件2。傳輸基板60中之未圖示的另一端會通過與基座部20一起移動的連接器(省略圖示),而與同軸電纜(圖示省略)電性連接。從第一接觸件1及第二接觸件2所輸入的電氣信號會藉由傳輸基板60的高頻傳輸線路來傳輸,且通過同軸電纜來輸入至控制裝置。 The transmission substrate 60 is a flexible strip-shaped flexible printed substrate. The transmission substrate 60 can be deformed by external force. As shown in FIGS. 1 and 2 , a first contact 1 and a second contact 2 are connected to one end of the transmission substrate 60 (the upper end in FIG. 5 ). The other end of the transmission substrate 60 (not shown) is electrically connected to a coaxial cable (not shown) through a connector (not shown) that moves together with the base portion 20 . The electrical signals input from the first contact 1 and the second contact 2 are transmitted through the high-frequency transmission line of the transmission substrate 60 and input to the control device through the coaxial cable.

傳輸基板60係作為高頻傳輸線路並具有形成微帶(microstrip)線路的積層構造的基板。傳輸基板60中,如第5圖及第6圖所示,於屬於絕緣層之基材61的一面(表面)印刷有屬於導體層的信號線62,而於另一面(背面)印刷有屬於導體層的接地線63。 The transmission substrate 60 serves as a high-frequency transmission line and has a multilayer structure in which a microstrip line is formed. In the transmission substrate 60, as shown in Figures 5 and 6, a signal line 62 belonging to the conductor layer is printed on one side (surface) of the base material 61 which is an insulating layer, and a conductor layer is printed on the other side (back). Layer 63 ground wire.

傳輸基板60係具有第一接著部65及第二接著部66,其作為分別接著有第一接觸件1及第二接觸件2的複數個接著部。於第一接著部65接著第一接觸件1。於第二接著部66接著第二接觸件2。於第一接著部65與第二接著部66之間形成有沿傳輸基板60之長邊方向延伸的狹縫60a。第一接著部65及第二接著部66係藉由被狹縫60a分隔,構成為彼此可獨立移動(可變形)。 The transmission substrate 60 has a first connecting portion 65 and a second connecting portion 66 as a plurality of connecting portions to which the first contact 1 and the second contact 2 are respectively connected. The first contact piece 1 is connected to the first connecting portion 65 . The second contact piece 2 is connected to the second connecting portion 66 . A slit 60 a extending along the longitudinal direction of the transmission substrate 60 is formed between the first connecting portion 65 and the second connecting portion 66 . The first joint part 65 and the second joint part 66 are separated by the slit 60a and are configured to be movable (deformable) independently of each other.

基材61係由具有柔軟性的材質所形成。如第6圖所示,於傳輸基板60的背面係有規則地排列設置有使基材61露出之矩形的複數個 凹部61a。換句話說,傳輸基板60之背面的接地線63係設置成格子狀(網眼狀)。因此,相較於對背面整面設置有接地線63的情形,傳輸基板60會變得容易彎曲。 The base material 61 is made of a flexible material. As shown in Fig. 6, a plurality of rectangular recessed portions 61a for exposing the base material 61 are regularly arranged on the back surface of the transmission substrate 60. In other words, the ground wire 63 on the back side of the transmission substrate 60 is arranged in a grid shape (mesh shape). Therefore, compared with the case where the ground wire 63 is provided on the entire back surface, the transmission substrate 60 becomes easier to bend.

信號線62係在傳輸基板60之寬度方向(第5圖中左右方向)的中央,以具有預定的寬度並沿著長邊方向延伸的方式設置。信號線62的一端部62a係位於第一接著部65上。第一接著部65上中的信號線62之一端部62a係以相較於其他部分較寬幅的方式設置,且與第一接觸件1電性連接。第一接觸件1係在與信號線62電性連接的狀態,藉由接著劑接著於第一接著部65。 The signal line 62 is provided at the center of the transmission substrate 60 in the width direction (the left-right direction in FIG. 5 ), has a predetermined width, and extends along the longitudinal direction. One end portion 62 a of the signal line 62 is located on the first connecting portion 65 . One end portion 62 a of the signal line 62 on the first connecting portion 65 is disposed wider than other portions and is electrically connected to the first contact 1 . The first contact piece 1 is in a state of being electrically connected to the signal line 62 and is adhered to the first connecting portion 65 through an adhesive.

於第二接著部66的表面係設置有與接地線63電性連接的連接層64。於第二接著部66係設置有在表面及背面開口的貫穿孔66a。於貫穿孔66a的內周面設置有:電性連接第二接著部66之表面的連接層64與背面的接地線63的貫穿層67。第二接觸件2係電性連接於第二接著部66的連接層64,且由接著劑來接著於第二接著部66。第二接觸件2係通過連接層64及貫穿層67並與接地線63電性連接。 A connection layer 64 electrically connected to the ground wire 63 is provided on the surface of the second connecting portion 66 . The second joint portion 66 is provided with through holes 66 a opening on the front and back surfaces. A through layer 67 is provided on the inner peripheral surface of the through hole 66 a to electrically connect the connection layer 64 on the surface of the second contact portion 66 and the ground line 63 on the back surface. The second contact piece 2 is electrically connected to the connection layer 64 of the second connecting portion 66 and is adhered to the second connecting portion 66 by an adhesive. The second contact member 2 passes through the connecting layer 64 and the through layer 67 and is electrically connected to the ground wire 63 .

接著,說明測量裝置100的作用。 Next, the function of the measurement device 100 will be described.

在本實施型態的測量裝置100中,就測量對象T之高頻特性的測量而言,係使基座部20對測量對象T垂直地(在本實施型態中沿鉛直方向)移動,且使第一接觸件1及第二接觸件2與測量對象T的接觸面Ts接觸。從該狀態使基座部20進一步往下方移動,藉此由預定的壓抵力來使第一接觸件1及第二接觸件2壓抵於測量對象T並電性連接。隨著從與測量對象T接觸的狀態開始,對第一接觸件1及第二接觸件2進一步的 壓抵,第一支持部41及第二支持部45會優先於第一接觸件1及第二接觸件2彈性變形,使第一保持部31及第二保持部35對第一基座部21及第二基座部25做相對移動。如此,第一保持部31及第二保持部35對第一基座部21及第二基座部25會做相對移動,所以保持於第一保持部31的第一接觸件1及保持於第二保持部35的第二接觸件2各自均會對第一基座部21及第二基座部25做相對移動。因此,即使第一接觸件1及第二接觸件2不彈性變形(彎曲變形),亦可隨著基座部20的移動將第一接觸件1及第二接觸件2往測量對象T壓抵,來抑制肇因於第一接觸件1及第二接觸件2的彎曲使得各自的前端在測量對象T上移動。如此一來,會抑制往測量對象T壓抵之第一接觸件1及第二接觸件2的過度移動,所以會抑制於測量對象T中之接觸痕跡的發生。另外,往測量對象T壓抵之第一接觸件1及第二接觸件2的過度移動受到抑制,且可不用使第一接觸件1及第二接觸件2大幅地彎曲,所以會抑制肇因於第一接觸件1及第二接觸件2的彎曲的傳輸損失的增加。因此,可抑制在測量對象T之接觸痕跡的發生,並且使測量裝置100的測量精密度提升。 In the measurement device 100 of this embodiment, in order to measure the high-frequency characteristics of the measurement object T, the base portion 20 is moved vertically (in the vertical direction in this embodiment) relative to the measurement object T, and The first contact piece 1 and the second contact piece 2 are brought into contact with the contact surface Ts of the measurement object T. From this state, the base portion 20 is further moved downward, whereby the first contact piece 1 and the second contact piece 2 are pressed against the measurement object T by a predetermined pressing force and are electrically connected. As the first contact piece 1 and the second contact piece 2 are further pressed from the state of contact with the measurement object T, the first support portion 41 and the second support portion 45 will take priority over the first contact piece 1 and the second contact piece 2 . The two contact pieces 2 elastically deform, causing the first holding part 31 and the second holding part 35 to move relative to the first base part 21 and the second base part 25 . In this way, the first holding part 31 and the second holding part 35 will move relative to the first base part 21 and the second base part 25, so the first contact piece 1 held in the first holding part 31 is not held in the first holding part 31. Each of the second contact pieces 2 of the two holding parts 35 will move relative to the first base part 21 and the second base part 25 . Therefore, even if the first contact piece 1 and the second contact piece 2 are not elastically deformed (bent deformation), the first contact piece 1 and the second contact piece 2 can be pressed against the measurement object T as the base portion 20 moves. , to suppress the movement of the respective front ends on the measurement object T due to the bending of the first contact piece 1 and the second contact piece 2. In this way, excessive movement of the first contact piece 1 and the second contact piece 2 pressed against the measurement object T will be suppressed, so the occurrence of contact marks in the measurement object T will be suppressed. In addition, excessive movement of the first contact piece 1 and the second contact piece 2 pressed against the measurement object T is suppressed, and the first contact piece 1 and the second contact piece 2 do not need to be greatly bent, so the cause of the problem is suppressed. The transmission loss increases due to the bending of the first contact 1 and the second contact 2 . Therefore, the occurrence of contact marks on the measurement object T can be suppressed, and the measurement precision of the measurement device 100 can be improved.

另外,以往的測量裝置有下述技術手段:藉由一面積極地使具有彈簧性的接觸件彎曲,一面由預定的壓抵壓來壓抵至測量對象,來獲得接觸件與測量對象之良好的接觸狀態。但是,在這樣的測量裝置中,會對接觸件要求彈簧性,所以難以提高接觸件的硬度使耐久性提升。 In addition, the conventional measuring device has the following technical means: by actively bending the spring-like contact piece, it is pressed against the measurement object with a predetermined pressing force, so as to obtain good contact between the contact piece and the measurement object. contact status. However, in such a measuring device, spring properties are required of the contacts, so it is difficult to increase the hardness of the contacts to improve durability.

對此,在本實施型態的測量裝置100中,由第一支持部41及第二支持部45的彈性變形產生彈性力,藉此確保將第一接觸件1及第二接觸件2壓抵至測量對象T的壓抵力。由於第一支持部41及第二支持部 45會對第一接觸件1及第二接觸件2優先地彈性變形而確保壓抵力,所以亦可不用積極地使第一接觸件1及第二接觸件2彈性變形。因此,提升第一接觸件1及第二接觸件2之材質選擇的自由度。在測量裝置100中,由於第一接觸件1及第二接觸件2是由屬於燒結金屬的工具鋼形成,所以具有較高耐久性。 In this regard, in the measurement device 100 of this embodiment, the elastic deformation of the first support part 41 and the second support part 45 generates elastic force, thereby ensuring that the first contact piece 1 and the second contact piece 2 are pressed against each other. The pressing force to the measurement object T. Since the first support part 41 and the second support part 45 will preferentially elastically deform the first contact piece 1 and the second contact piece 2 to ensure the pressing force, there is no need to actively move the first contact piece 1 and the second contact piece 2 The contact piece 2 is elastically deformed. Therefore, the degree of freedom in selecting the materials of the first contact piece 1 and the second contact piece 2 is increased. In the measuring device 100, since the first contact piece 1 and the second contact piece 2 are made of tool steel which is a sintered metal, they have high durability.

另外,一般而言,測量裝置的測量對象會有於測量面發生高低差(凹凸)的情形。特別是,當測量對象為電子電路基板的情形,會相較於屬於半導體晶圓的情形還容易發生較大的凹凸。當測量對象具有高低差時,會有一方的接觸件先接觸高度相對較高之部位,而另一方的接觸件卻不會充分接觸高度相對較低之部位的疑慮。如此,當測量對象發生凹凸時,會使得第一接觸件及第二接觸件與測量對象的接觸狀態變得不均等,會有不能獲得良好之接觸狀態的疑慮。 In addition, generally speaking, the measurement target of the measurement device may have a height difference (concave-convex) on the measurement surface. In particular, when the measurement object is an electronic circuit substrate, larger unevenness is more likely to occur than when it is a semiconductor wafer. When the measurement object has a height difference, there is a concern that one contact piece will first contact the relatively high part, while the other contact piece will not fully contact the relatively low height part. In this way, when the measurement object is uneven, the contact state between the first contact piece and the second contact piece and the measurement object will become uneven, and there is a concern that a good contact state cannot be obtained.

對此,測量裝置100中,保持第一接觸件1的第一保持部31及保持第二接觸件2的第二保持部35係構成為彼此可獨立移動。而且,傳輸基板60構成為可變形,所以不會妨礙第一接觸件1及第二接觸件2獨立移動。因此,根據測量裝置100,即使於測量對象(特別是電路基板)發生凹凸時,亦可使第一接觸件1及第二接觸件2的一方與測量對象T接觸,進而使另一方移動並與測量對象T接觸。也就是,第一接觸件1及第二接觸件2係能夠以彼此不同的移動量來獨立移動,而能容許測量對象T的高度差,所以可使第一接觸件1及第二接觸件2與測量對象T的接觸狀態成為均等者。因此,能夠以預定的壓抵力來將第一接觸件1及第二接觸件2壓抵於測量對象T,並獲得良好的接觸狀態。 On the other hand, in the measuring device 100, the first holding part 31 holding the first contact 1 and the second holding part 35 holding the second contact 2 are configured to be movable independently of each other. Moreover, the transmission substrate 60 is configured to be deformable, so it does not prevent the first contact 1 and the second contact 2 from moving independently. Therefore, according to the measuring device 100, even when the measurement object (especially the circuit board) has unevenness, one of the first contact 1 and the second contact 2 can be brought into contact with the measurement object T, and the other can be moved and contacted with the measurement object T. Measurement object T contacts. That is, the first contact piece 1 and the second contact piece 2 can move independently with different movement amounts, and can tolerate the height difference of the measurement object T, so the first contact piece 1 and the second contact piece 2 can be The contact state with the measurement object T becomes equal. Therefore, the first contact piece 1 and the second contact piece 2 can be pressed against the measurement object T with a predetermined pressing force, and a good contact state can be obtained.

接著,說明上述第一實施型態的變形例。如下述之變形例亦為本發明的範圍內,亦可組合以下的變形例與上述第一實施型態的各構成,或將以下的變形例彼此組合。另外,上述第一實施型態的說明中所揭示的變形例亦同樣地可任意地與其他的變形例組合。另外,上述第一實施型態及以下揭示之第一實施型態的變形例,在技術上可能的範圍內,亦可與後述的第二和第三實施型態及該等的變形例組合。 Next, a modification of the above-described first embodiment will be described. As the following modifications are also within the scope of the present invention, the following modifications may be combined with each configuration of the above-described first embodiment, or the following modifications may be combined with each other. In addition, the modifications disclosed in the above description of the first embodiment can also be arbitrarily combined with other modifications. In addition, the above-mentioned first embodiment and the modifications of the first embodiment disclosed below can also be combined with the second and third embodiments and the modifications described below within the scope of technical possibility.

在上述第一實施型態中,傳輸基板60為具有柔軟性的可撓性印刷基板。對此,傳輸基板60亦可為包含有柔軟性之部位及不具有柔軟性之部位之軟硬結合(FLEX RIGID)基板。再者,當未使第一接觸件1及第二接觸件2獨立移動時,傳輸基板60之基材61亦可不具有柔軟性且為硬質的剛性基板。 In the above-described first embodiment, the transmission substrate 60 is a flexible printed substrate. In this regard, the transmission substrate 60 may also be a flexible-rigid (FLEX RIGID) substrate including flexible parts and non-flexible parts. Furthermore, when the first contact member 1 and the second contact member 2 are not allowed to move independently, the base material 61 of the transmission substrate 60 may also be a hard rigid substrate without flexibility.

另外,在上述第一實施型態中,本體部10為由第一本體部11及第二本體部15所構成的分割構造,該第一本體部11及第二本體部15係具有彼此對稱構造。另外,第一接觸件1與第二接觸件2係彼此可獨立移動。對此,為了使第一接觸件1與第二接觸件2的耐久性提升,本體部10亦可非為分割構造而一體地形成,而使第一接觸件1與第二接觸件2不可獨立移動。在測量裝置100中,為了使第一接觸件1與第二接觸件2的耐久性提升,若為隨著第一接觸件1與第二接觸件2往測量對象T的壓抵,而使得支持部40彈性變形的構造即可。 In addition, in the above-mentioned first embodiment, the main body part 10 is a divided structure composed of the first main body part 11 and the second main body part 15. The first main body part 11 and the second main body part 15 have mutually symmetrical structures. . In addition, the first contact piece 1 and the second contact piece 2 can move independently of each other. In this regard, in order to improve the durability of the first contact piece 1 and the second contact piece 2, the body part 10 may also be integrally formed without being a divided structure, so that the first contact piece 1 and the second contact piece 2 cannot be independent. Move. In the measuring device 100, in order to improve the durability of the first contact piece 1 and the second contact piece 2, if the first contact piece 1 and the second contact piece 2 are pressed against the measurement object T, the support The portion 40 can be elastically deformed.

另外,在上述第一實施型態中,支持部40(第一支持部41、第二支持部45)係由連接機構所構成。對此,在支持部40(第一支持部41, 第二支持部45)優先於第一接觸件1及第二接觸件2彈性變形的條件下,支持部40的構成不限定為連接機構而可設為任意的構成。 In addition, in the above-described first embodiment, the support portion 40 (the first support portion 41 and the second support portion 45) is composed of a connection mechanism. In this regard, under the condition that the support portion 40 (the first support portion 41, the second support portion 45) elastically deforms prior to the first contact 1 and the second contact 2, the structure of the support portion 40 is not limited to a connection mechanism. Can be set to any configuration.

另外,在上述第一實施型態中,第一接觸件1及第二接觸件2為具有矩形剖面之方形柱狀的端子。對此,第一接觸件1及第二接觸件2不限定於此,例如亦可形成為具有圓形剖面的圓柱或具有方形以外的多角形剖面的角柱(多角柱)。此外,無論任何的情形,前端部係如上述實施型態的方式形成為逐漸變細的形狀為佳。 In addition, in the above-mentioned first embodiment, the first contact member 1 and the second contact member 2 are square columnar terminals with a rectangular cross section. In this regard, the first contact 1 and the second contact 2 are not limited to this. For example, they may be formed as a cylinder having a circular cross-section or a corner post (polygonal post) having a polygonal cross-section other than a square. In any case, it is preferable that the front end portion has a tapered shape as in the above-mentioned embodiment.

另外,在上述第一實施型態中,第一接觸件1及第二接觸件2彼此為相同形狀。第一接觸件1及第二接觸件2的前端P係設置於各自的寬度方向(鄰接方向)的中央。對此,第一接觸件1及第二接觸件2不限定為彼此相同形狀,而可為任意的形狀。第一接觸件1及第二接觸件2的前端P不限定為寬度方向的中央,例如,第7圖(a)所示,各自的前端P亦可以彼此接近的方式,配置於彼此相向之側面1c、2c(相向面)上,或第7圖(b)所示,各自的前端P亦可以彼此分離的方式,配置於側面1d、2d上。於第7圖(a)或第7圖(b)所示的形狀中,第一接觸件1及第二接觸件2係形成對基準面R面對稱的構造。 In addition, in the above-mentioned first embodiment, the first contact piece 1 and the second contact piece 2 have the same shape. The front ends P of the first contact 1 and the second contact 2 are provided at the centers in the respective width directions (adjacent directions). In this regard, the first contact 1 and the second contact 2 are not limited to having the same shape, but may have any shape. The front ends P of the first contact 1 and the second contact 2 are not limited to the center in the width direction. For example, as shown in FIG. 7(a) , the respective front ends P can also be arranged close to each other on the side surfaces facing each other. 1c, 2c (opposing surfaces), or as shown in Figure 7(b), the respective front ends P can also be arranged on the side surfaces 1d, 2d in a manner separated from each other. In the shape shown in Figure 7(a) or Figure 7(b), the first contact piece 1 and the second contact piece 2 form a structure that is symmetrical with respect to the reference plane R.

另外,在上述第一實施型態中,高頻傳輸線路為微帶線路。對此,高頻傳輸線路亦可為共平面(coplanar)線路或條狀(strip)線路等其他的線路。測量裝置100若以具備有與高頻傳輸線路之種類相對應的數量的接觸件的方式構成即可。也就是,測量裝置100亦可因應高頻傳輸線路的種類而具備三個以上的接觸件者。另外,測量裝置100的本體部10亦可為因應接觸件的數量,而分割成彼此可獨立移動的構造。 In addition, in the first embodiment described above, the high-frequency transmission line is a microstrip line. In this regard, the high-frequency transmission line may also be a coplanar line or a strip line or other lines. The measuring device 100 may be configured to include a number of contacts corresponding to the type of high-frequency transmission line. That is, the measuring device 100 may also have three or more contacts according to the type of high-frequency transmission line. In addition, the main body 10 of the measuring device 100 can also be divided into structures that can move independently according to the number of contact pieces.

另外,在上述第一實施型態中,高頻傳輸線路為微帶線路,且測量裝置100係具備有兩個接觸件,該兩個接觸件為與信號線62電性連接的第一接觸件1以及與接地線63電性連接的第二接觸件2。對此,設置微帶線路來作為高頻傳輸線路時,測量裝置亦可具備三個接觸件。以下,參照第8圖及第9圖,以具體說明變形例的測量裝置100A。 In addition, in the above-mentioned first embodiment, the high-frequency transmission line is a microstrip line, and the measuring device 100 is provided with two contacts, which are first contacts electrically connected to the signal line 62 1 and the second contact 2 electrically connected to the ground wire 63 . In this regard, when a microstrip line is used as a high-frequency transmission line, the measuring device can also be equipped with three contacts. Hereinafter, a measurement device 100A according to a modified example will be described in detail with reference to FIGS. 8 and 9 .

如第8圖所示,變形例的測量裝置100A係具有與信號線62電性連接的第一接觸件1,以及與接地線63電性連接的第二接觸件2及第三接觸件3。 As shown in FIG. 8 , a measurement device 100A according to the modified example has a first contact 1 electrically connected to the signal line 62 , and a second contact 2 and a third contact 3 electrically connected to the ground line 63 .

測量裝置100A的本體部10係具有第一本體部11、第二本體部15及第三本體部19。第一本體部11及第二本體部15為與上述實施型態相同的構成。安裝有第三接觸件3的第三本體部19係以與第二本體部15一起夾持第一本體部11的方式排列設置。第三本體部19係具有與第一本體部11及第二本體部15相同的構成者。因此,省略詳細的說明及圖示,第三本體部19係具有第三基座部29、第三保持部39及第三支持部49,該第三保持部39為保持第三接觸件3的固持器部,該第三支持部49為可移動地支持第三保持部39的固持器支持部。第一基座部21、第二基座部25及第三基座部29係由螺栓20a結合而構成基座部20。第三保持部39係與第一保持部31及第二保持部35一起構成保持部30。第三支持部49係與第一支持部41及第二支持部45一起構成支持部40,且獨立於第一接觸件1及第二接觸件2而可移動地支持第三接觸件3。 The main body part 10 of the measuring device 100A has a first main body part 11 , a second main body part 15 and a third main body part 19 . The first body part 11 and the second body part 15 have the same structure as the above-mentioned embodiment. The third body portion 19 on which the third contact piece 3 is mounted is arranged so as to sandwich the first body portion 11 together with the second body portion 15 . The third body part 19 has the same structure as the first body part 11 and the second body part 15 . Therefore, detailed description and illustration are omitted. The third body part 19 has a third base part 29 , a third holding part 39 and a third supporting part 49 . The third holding part 39 holds the third contact 3 The third support part 49 is a holder support part that movably supports the third holding part 39 . The first base part 21, the second base part 25 and the third base part 29 are connected by bolts 20a to form the base part 20. The third holding part 39 forms the holding part 30 together with the first holding part 31 and the second holding part 35 . The third support part 49 forms the support part 40 together with the first support part 41 and the second support part 45 and movably supports the third contact 3 independently of the first contact 1 and the second contact 2 .

在傳輸基板60中,與上述第一實施型態同樣地,於屬於絕緣層之基材61的一面(表面)印刷有屬於導體層的信號線62,而於另一面(背面)印刷有屬於導體層的接地線63。 In the transmission substrate 60, similarly to the above-described first embodiment, the signal line 62 belonging to the conductor layer is printed on one side (surface) of the base material 61 which is the insulating layer, and the signal line 62 belonging to the conductor layer is printed on the other side (back surface). Layer 63 ground wire.

如第9圖所示,傳輸基板60係具有作為複數個接著部的第一接著部65、第二接著部66及第三接著部68,該第一接著部65係接觸第一接觸件1,第二接著部66係接觸第二接觸件2,該第三接著部68係接觸第三接觸件3。第一接著部65與第二接著部66之間以及第二接著部66與第三接著部68之間係形成有沿傳輸基板60的長邊方向延伸的狹縫60a。第一接著部65、第二接著部66及第三接著部68係藉由狹縫60a彼此的分隔,而構成為可獨立移動(可變形)。 As shown in FIG. 9 , the transmission substrate 60 has a first bonding portion 65 , a second bonding portion 66 , and a third bonding portion 68 as a plurality of bonding portions. The first bonding portion 65 contacts the first contact 1 . The second connecting portion 66 contacts the second contact member 2 , and the third connecting portion 68 contacts the third contact member 3 . A slit 60 a extending along the longitudinal direction of the transmission substrate 60 is formed between the first bonding portion 65 and the second bonding portion 66 and between the second bonding portion 66 and the third bonding portion 68 . The first joint part 65 , the second joint part 66 and the third joint part 68 are separated from each other by the slits 60 a and are configured to be independently movable (deformable).

第二接著部66係與上述第一實施型態同樣具有連接層64a(相當於上述實施型態的連接層64)、貫穿孔66a及貫穿層67。第二接觸件2係與第二接著部66的連接層64a電性連接,且由接著劑來接著於第二接著部66。第二接觸件2係通過連接層64a及貫穿層67而與接地線63電性連接。 The second connecting portion 66 has a connection layer 64a (corresponding to the connection layer 64 in the above-described embodiment), a through hole 66a and a through layer 67, similarly to the above-described first embodiment. The second contact 2 is electrically connected to the connection layer 64a of the second connecting portion 66, and is adhered to the second connecting portion 66 by an adhesive. The second contact member 2 is electrically connected to the ground wire 63 through the connection layer 64a and the through layer 67.

第三接著部68係與第二接著部66同樣地具有連接層64b、貫穿孔68a及貫穿層69,該連接層64b係與接地線63電性連接,該貫穿孔68a係於表面及背面開口,該貫穿層69係設置於貫穿孔68a的內周面,且電性連接第三接著部68中之表面的連接層64b與背面的接地線63。第三接觸件3係與第三接著部68的連接層64b電性連接,且藉由接著劑來接著至第三接著部68。第三接觸件3係通過連接層64b及貫穿層69來與接地線63電性連接。 The third joint part 68 has a connection layer 64b, a through hole 68a and a through layer 69 like the second joint part 66. The connection layer 64b is electrically connected to the ground wire 63, and the through hole 68a is open on the front and back surfaces. , the through layer 69 is provided on the inner peripheral surface of the through hole 68 a, and electrically connects the connection layer 64 b on the surface of the third connecting portion 68 and the ground line 63 on the back surface. The third contact piece 3 is electrically connected to the connection layer 64b of the third connecting portion 68 and is adhered to the third connecting portion 68 through an adhesive. The third contact member 3 is electrically connected to the ground wire 63 through the connection layer 64b and the through layer 69.

在如上述的變形例中,也發揮與上述第一實施型態同樣的效果。 Even in the above-mentioned modified example, the same effect as that of the above-mentioned first embodiment is exerted.

(第二實施型態) (Second implementation type)

以下,參照第10圖至第13圖,說明本發明之第二實施型態的測量裝置200。 Hereinafter, the measuring device 200 according to the second embodiment of the present invention will be described with reference to FIGS. 10 to 13 .

測量裝置200係用於例如電性檢查電路基板的檢查裝置(圖示省略)。測量裝置200係測量在電路基板所包含的測量對象T(請參閱第11圖)發生之電磁波的高頻特性,該電路基板所包含的測量對象T係印刷有佈線圖案的半導體晶圓或電子電路基板、安裝有半導體晶圓或電子電路基板的電子電路安裝基板等。 The measuring device 200 is an inspection device (not shown) used for electrically inspecting a circuit board, for example. The measuring device 200 measures the high-frequency characteristics of the electromagnetic wave generated by the measurement object T (see FIG. 11) included in the circuit board, which is a semiconductor wafer or an electronic circuit on which a wiring pattern is printed. Substrates, electronic circuit mounting substrates on which semiconductor wafers or electronic circuit substrates are mounted, etc.

如第10圖至第12圖所示,測量裝置200係具備有:作為各自被壓抵於測量對象T之複數個接觸件的第一接觸件101、第二接觸件102及第三接觸件103;設置有高頻傳輸線路,且具有柔軟性的傳輸基板110;以及安裝有第一接觸件101、第二接觸件102及第三接觸件103的本體部120。 As shown in FIGS. 10 to 12 , the measuring device 200 is provided with: a first contact 101 , a second contact 102 and a third contact 103 as a plurality of contacts each pressed against the measurement object T. ; Provided with a high-frequency transmission line and a flexible transmission substrate 110; and a body portion 120 on which the first contact 101, the second contact 102 and the third contact 103 are installed.

第一接觸件101、第二接觸件102及第三接觸件103為各自要被壓抵於測量對象T並從測量對象T輸入高頻信號的電極。第一接觸件101、第二接觸件102及第三接觸件103係如第12圖及第13圖所示,彼此形成為相同的圓柱形狀,且設置於傳輸基板110之長邊方向的一端部。 The first contact 101 , the second contact 102 and the third contact 103 are electrodes to be pressed against the measurement object T and to input high-frequency signals from the measurement object T respectively. The first contact 101 , the second contact 102 and the third contact 103 are formed into the same cylindrical shape as shown in FIGS. 12 and 13 , and are disposed at one end of the transmission substrate 110 in the longitudinal direction. .

傳輸基板110為具有柔軟性的帶狀可撓性印刷基板,且可受外力而變形。 The transmission substrate 110 is a strip-shaped flexible printed substrate with flexibility and can be deformed by external force.

如第12圖及第13圖所示,傳輸基板110係設置有作為高頻傳輸線路的共平面線路。具體而言,傳輸基板110中,於屬於具有柔軟性之絕緣層的基材111的下表面(與測量對象T相向之面),設置有屬於導體層的單一信號線112及屬於導體層的兩條接地線。以下中,將兩條接地線的一條稱為「第一接地線113」,將另一條稱為「第二接地線114」。 As shown in FIGS. 12 and 13 , the transmission substrate 110 is provided with coplanar lines as high-frequency transmission lines. Specifically, in the transmission substrate 110, a single signal line 112 belonging to the conductor layer and two signal lines 112 belonging to the conductor layer are provided on the lower surface (the surface facing the measurement object T) of the base material 111 which is a flexible insulating layer. A ground wire. In the following, one of the two ground lines is called the "first ground line 113" and the other is called the "second ground line 114".

如第13圖所示,信號線112係具有預定寬度(第13圖中左右方向的長度),且沿著傳輸基板110的長邊方向(第13圖中上下方向)延伸。第一接地線113及第二接地線114係各自具有預定的寬度,且沿著傳輸基板110的長邊方向延伸。信號線112、第一接地線113及第二接地線114的寬度各自於長邊方向為均等者。如此,信號線112、第一接地線113及第二接地線114係以彼此平行地延伸的方式設置。 As shown in FIG. 13 , the signal line 112 has a predetermined width (length in the left-right direction in FIG. 13 ) and extends along the longitudinal direction of the transmission substrate 110 (up-and-down direction in FIG. 13 ). The first ground line 113 and the second ground line 114 each have a predetermined width and extend along the longitudinal direction of the transmission substrate 110 . The widths of the signal line 112 , the first ground line 113 and the second ground line 114 are equal in the longitudinal direction. In this way, the signal line 112, the first ground line 113 and the second ground line 114 are arranged to extend parallel to each other.

信號線112係以分別對第一接地線113及第二接地線114空開預定的間隔的方式設置於第一接地線113與第二接地線114之間。信號線112、第一接地線113及第二接地線114之各自的寬度與彼此的間隔係設定成高頻傳輸線路的特性阻抗與測量對象T的特定阻抗匹配。 The signal line 112 is provided between the first ground line 113 and the second ground line 114 with a predetermined interval between the first ground line 113 and the second ground line 114 respectively. The respective widths and mutual intervals of the signal line 112 , the first ground line 113 and the second ground line 114 are set so that the characteristic impedance of the high-frequency transmission line matches the specific impedance of the measurement object T.

信號線112係電性連接第一接觸件101。第一接觸件101係以積層對信號線112之表面施予的鍍覆(例如鍍鎳)的方式形成於信號線112上。因此,第一接觸件101係與信號線112一體成形。換言之,信號線112的一部分係發揮作為第一接觸件101的功能。 The signal line 112 is electrically connected to the first contact 101 . The first contact 101 is formed on the signal line 112 by laminating plating (for example, nickel plating) applied to the surface of the signal line 112 . Therefore, the first contact 101 and the signal line 112 are integrally formed. In other words, a part of the signal line 112 functions as the first contact 101 .

第一接地線113係電性連接第二接觸件102。與第一接觸件101同樣地,第二接觸件102係以積層對第一接地線113所施予的鍍覆的方式形成於第一接地線113上。 The first ground wire 113 is electrically connected to the second contact 102 . Like the first contact 101 , the second contact 102 is formed on the first ground line 113 by laminating the plating applied to the first ground line 113 .

第二接地線114係電性連接第三接觸件103。與第一接觸件101及第二接觸件102同樣地,第三接觸件103係以積層對第二接地線114所施予的鍍覆的方式形成於第二接地線114上。 The second ground wire 114 is electrically connected to the third contact 103 . Like the first contact 101 and the second contact 102 , the third contact 103 is formed on the second ground line 114 by laminating the plating applied to the second ground line 114 .

如以上的方式,第一接觸件101、第二接觸件102及第三接觸件103係分別與對應的信號線112、第一接地線113、第二接地線114一體地設置,所以抑制於各接觸件101、102、103與傳輸基板110的高頻傳輸線路之間的傳輸損失。從另一觀點而言,於本實施型態中的第一接觸件101、第二接觸件102、第三接觸件103並非如針狀的接觸件之容易發生彎曲的接觸件,肇因於彎曲之傳輸損失之增加的疑慮較低,而能抑制傳輸損失。因此,高頻傳輸線路的傳輸特性會提升。 In the above manner, the first contact piece 101, the second contact piece 102 and the third contact piece 103 are integrally provided with the corresponding signal line 112, the first ground line 113 and the second ground line 114 respectively. Transmission loss between the contacts 101, 102, 103 and the high-frequency transmission line of the transmission substrate 110. From another point of view, the first contact 101, the second contact 102, and the third contact 103 in this embodiment are not contact members that are prone to bending like needle-shaped contacts. The concern about the increase in transmission loss is low and the transmission loss can be suppressed. Therefore, the transmission characteristics of high-frequency transmission lines are improved.

第一接觸件101、第二接觸件102及第三接觸件103係排列設置於與傳輸基板110的長邊方向成垂直的直線上。也就是,第一接觸件101、第二接觸件102及第三接觸件103係設置於與彼此平行地延伸之信號線112、第一接地線113及第二接地線114成正交的假想直線上。第一接觸件101、第二接觸件102及第三接觸件103會從與測量對象T之接觸面Ts(參照第11圖)成垂直的方向而被壓抵至測量對象T。 The first contact 101 , the second contact 102 and the third contact 103 are arranged on a straight line perpendicular to the longitudinal direction of the transmission substrate 110 . That is, the first contact 101 , the second contact 102 and the third contact 103 are arranged on an imaginary straight line orthogonal to the signal line 112 , the first ground line 113 and the second ground line 114 extending parallel to each other. superior. The first contact piece 101 , the second contact piece 102 and the third contact piece 103 will be pressed against the measurement object T from a direction perpendicular to the contact surface Ts with the measurement object T (refer to FIG. 11 ).

傳輸基板110中之未圖示的另一端部係與未圖示的控制裝置(controller)電性連接。從第一接觸件101、第二接觸件102及第三接觸件103所輸入的高頻信號係由傳輸基板110的高頻傳輸線路來傳輸,而輸入至控制裝置。 The other end of the transmission substrate 110 (not shown) is electrically connected to a controller (not shown). The high-frequency signals input from the first contact 101 , the second contact 102 and the third contact 103 are transmitted through the high-frequency transmission lines of the transmission substrate 110 and then input to the control device.

如第10圖至第12圖所示,本體部120係具有基座部130、保持部140及支持部150,該保持部140係保持第一接觸件101、第二接 觸件102及第三接觸件103,該支持部150係安裝於基座部130且支持保持部140。基座部130、保持部140及支持部150係藉由樹脂而彼此一體成形。保持部140、支持部150、基座部130係構成為沿著傳輸基板110的長邊方向排列。 As shown in Figures 10 to 12, the body part 120 has a base part 130, a holding part 140 and a supporting part 150. The holding part 140 holds the first contact piece 101, the second contact piece 102 and the third contact piece. The support part 150 is installed on the base part 130 and supports the holding part 140. The base part 130, the holding part 140 and the supporting part 150 are integrally formed with each other by resin. The holding part 140 , the supporting part 150 , and the base part 130 are arranged along the longitudinal direction of the transmission substrate 110 .

基座部130係形成為長方體形狀,且藉由檢查裝置的昇降裝置(圖示省略)來沿著鉛直上下方向(與測量對象T之接觸面Ts成垂直的方向)移動。藉由基座部130的上下移動,第一接觸件101、第二接觸件102及第三接觸件103會對測量對象T接觸、分離。如第11圖所示,基座部130的底面(與測量對象T相向之面)安裝有傳輸基板110中從一端部往長邊方向分離的中間部分。傳輸基板110係以不作用張力的方式安裝於基座部130。 The base portion 130 is formed in a rectangular parallelepiped shape and moves in the vertical up-and-down direction (the direction perpendicular to the contact surface Ts of the measurement object T) by a lifting device (not shown) of the inspection device. By the up and down movement of the base part 130, the first contact piece 101, the second contact piece 102 and the third contact piece 103 come into contact with and separate from the measurement object T. As shown in FIG. 11 , the middle portion of the transmission substrate 110 separated from one end in the longitudinal direction is attached to the bottom surface of the base portion 130 (the surface facing the measurement object T). The transmission substrate 110 is mounted on the base portion 130 without applying tension.

保持部140係形成為長方體形狀,且一部分係從基座部130的底面朝測量對象T突出。在從基座部130突出的保持部140的底面(與測量對象T相對向之面)係設置有彈性構件160,該彈性構件160係作為容許隨著往測量對象T之壓抵的第一接觸件101、第二接觸件102及第三接觸件103彼此的獨立移動之移動容許部。 The holding part 140 is formed in a rectangular parallelepiped shape, and a part thereof protrudes toward the measurement object T from the bottom surface of the base part 130 . An elastic member 160 is provided on the bottom surface of the holding portion 140 protruding from the base portion 130 (the surface facing the measurement object T). The elastic member 160 serves as a first contact that allows the pressure toward the measurement object T. A movement allowing portion for the member 101, the second contact member 102 and the third contact member 103 to move independently of each other.

彈性構件160係例如以橡膠等來形成,且可受外力而伸縮。彈性構件160係由接著劑來接著於保持部140的底面。如第11圖及第12圖所示,彈性構件160係接著有傳輸基板110的一端部,且隔著傳輸基板110而安裝有第一接觸件101、第二接觸件102及第三接觸件103。第一接觸件101、第二接觸件102及第三接觸件103係隔著傳輸基板110而與彈性構件160相向。也就是,保持部140係經由彈性構件160,來保持傳輸 基板110和設置於該傳輸基板110的第一接觸件101、第二接觸件102及第三接觸件103。 The elastic member 160 is made of rubber, for example, and can expand and contract upon receiving external force. The elastic member 160 is adhered to the bottom surface of the holding part 140 with an adhesive. As shown in FIGS. 11 and 12 , the elastic member 160 is connected to one end of the transmission substrate 110 , and the first contact 101 , the second contact 102 and the third contact 103 are installed across the transmission substrate 110 . The first contact 101 , the second contact 102 and the third contact 103 are opposite to the elastic member 160 across the transmission substrate 110 . That is, the holding part 140 holds the transmission substrate 110 and the first contact 101, the second contact 102 and the third contact 103 provided on the transmission substrate 110 via the elastic member 160.

彈性構件160較佳為比第一接觸件101、第二接觸件102及第三接觸件103還容易彈性變形的材質。另外,彈性構件160較佳為於將第一接觸件101、第二接觸件102及第三接觸件103壓抵至測量對象T時,會優先於第一接觸件101、第二接觸件102及第三接觸件103而變形。 The elastic member 160 is preferably made of a material that is easier to elastically deform than the first contact member 101 , the second contact member 102 and the third contact member 103 . In addition, the elastic member 160 preferably has priority over the first contact member 101 , the second contact member 102 and the third contact member 103 when pressing the first contact member 101 , the second contact member 102 and the third contact member 103 against the measurement object T. The third contact member 103 is deformed.

如第2圖所示,支持部150主要由具有一對連接部151、155的連接機構所構成。一對連接部151、155係各自與測量對象T的接觸面Ts平行地延伸,且沿著與接觸面Ts成垂直的方向排列而設置。 As shown in FIG. 2 , the support part 150 is mainly composed of a connection mechanism having a pair of connection parts 151 and 155 . The pair of connecting portions 151 and 155 each extend in parallel with the contact surface Ts of the measurement object T and are arranged in a direction perpendicular to the contact surface Ts.

一方的連接部151係具有桿部152、關節部153及關節部154,該桿部152具有矩形剖面,該關節部153係連接桿部152的一端與保持部140,該關節部154係連接桿部152的另一端與基座部130。同樣地,另一方的連接部155係具有桿部156、關節部157及關節部158,該桿部156係具有矩形剖面,該關節部157係連接桿部156的一端與保持部140,該關節部158係連接桿部156的另一端與基座部130。 One connection part 151 has a rod part 152, a joint part 153 and a joint part 154. The rod part 152 has a rectangular cross section. The joint part 153 connects one end of the rod part 152 and the holding part 140. The joint part 154 connects the rod. The other end of the part 152 and the base part 130. Similarly, the other connecting part 155 has a rod part 156, a joint part 157 and a joint part 158. The rod part 156 has a rectangular cross section. The joint part 157 connects one end of the rod part 156 and the holding part 140. The joint part 156 has a rectangular cross section. The portion 158 connects the other end of the rod portion 156 and the base portion 130 .

桿部152、156與基座部130及保持部140之間係形成有半圓狀的凹槽。各凹槽係與測量對象T的接觸面Ts平行而與桿部152、156的長邊方向(第2圖中左右方向)成垂直地延伸。因此,於桿部152、156與基座部130及保持部140之間係設置有關節部153、154、157、158。各關節部153、154、157、158之與桿部152、156長邊方向正交的剖面面積比桿部152、156還縮小,而構成為相較於桿部152、156較容易彈性變形。 Semicircular grooves are formed between the rod portions 152 and 156, the base portion 130 and the holding portion 140. Each groove is parallel to the contact surface Ts of the measurement object T and extends perpendicularly to the longitudinal direction of the rod portions 152 and 156 (the left-right direction in FIG. 2). Therefore, joint portions 153, 154, 157, and 158 are provided between the rod portions 152 and 156, the base portion 130, and the holding portion 140. The cross-sectional area of each joint part 153, 154, 157, 158 perpendicular to the longitudinal direction of the rod parts 152, 156 is smaller than that of the rod parts 152, 156, and is configured to be elastically deformed more easily than the rod parts 152, 156.

當使基座部130沿鉛直方向下方移動,並使第一接觸件101、第二接觸件102及第三接觸件103壓抵至測量對象T時,受到該壓抵的反作用力(以下,亦稱「壓抵反作用力」)來使連接部151的關節部153、154及連接部155的關節部157、158彈性變形,而各桿部152、156會相對於保持部140及基座部130傾斜(相對旋轉)。 When the base portion 130 is moved downward in the vertical direction and the first contact piece 101 , the second contact piece 102 and the third contact piece 103 are pressed against the measurement object T, the reaction force of the pressing force (hereinafter, also referred to as (called "pressure reaction force") to elastically deform the joint parts 153 and 154 of the connecting part 151 and the joint parts 157 and 158 of the connecting part 155, and each rod part 152 and 156 will be relative to the holding part 140 and the base part 130 Tilt (relative rotation).

若以一方的連接部151為例說明時,會以一方的關節部153為中心使得桿部152對保持部140相對旋轉,且以另一方的關節部154為中心使得桿部152對基座部130相對旋轉。如此,當將第一接觸件101、第二接觸件102及第三接觸件103壓抵於測量對象T,會使支持部150彈性變形,藉此容許沿著鉛直方向之基座部130與保持部140的相對移動。另外,支持部150係由連接機構所構成,所以基座部130與保持部140可在鉛直方向中大致直線地相對移動。 Taking one connecting part 151 as an example, the joint part 153 of one side is used as the center so that the rod part 152 rotates relative to the holding part 140, and the other joint part 154 is used as the center so that the rod part 152 rotates relative to the base part. 130 relative rotation. In this way, when the first contact piece 101, the second contact piece 102 and the third contact piece 103 are pressed against the measurement object T, the support part 150 will be elastically deformed, thereby allowing the base part 130 to be held along the vertical direction. relative movement of the part 140. In addition, the support part 150 is composed of a connection mechanism, so the base part 130 and the holding part 140 can move relatively linearly in the vertical direction.

接著,說明測量裝置200的作用。 Next, the function of the measurement device 200 will be described.

就測量對象T之高頻特性的測量而言,要使基座部130對測量對象T垂直地(在本實施型態中沿鉛直方向)移動,且使第一接觸件101、第二接觸件102及第三接觸件103與測量對象T的接觸面Ts接觸。從該狀態使基座部130進一步往下方移動,藉此由預定的壓抵力來使第一接觸件101、第二接觸件102及第三接觸件103壓抵於測量對象T並電性連接。隨著從與測量對象T接觸的狀態,將第一接觸件101、第二接觸件102及第三接觸件103進一步的壓抵,使得支持部150彈性變形,且使保持部140對基座部130做相對移動。如此,保持部140對基座部130會做相對移動,所以保持於保持部140的第一接觸件101、第二接觸件102及 第三接觸件103亦對基座部130做相對移動。因此,會抑制往測量對象T壓抵之第一接觸件101、第二接觸件102及第三接觸件103的過度移動,而抑制於測量對象T中之接觸痕跡的發生。另外,藉由因支持部150的彈性變形所發生的彈性力,確保將第一接觸件101、第二接觸件102及第三接觸件103壓抵於測量對象T的壓抵力。也就是,隨著第一接觸件101、第二接觸件102及第三接觸件103往測量對象T的壓抵使得支持部150彈性變形,所以能夠以與信號線112、第一接地線113及第二接地線114形成為一體之圓柱形狀的方式來構成第一接觸件101、第二接觸件102及第三接觸件103,可抑制肇因於第一接觸件101、第二接觸件102及第三接觸件103的彎曲之傳輸損失的發生,並且可由預定的壓抵壓來使之與測量對象T接觸。因此,可抑制在測量對象T之接觸痕跡的發生,並且提升測量裝置200的測量精密度。 For the measurement of the high-frequency characteristics of the measurement object T, the base portion 130 is moved vertically (in the vertical direction in this embodiment) relative to the measurement object T, and the first contact piece 101 and the second contact piece are moved 102 and the third contact member 103 are in contact with the contact surface Ts of the measurement object T. From this state, the base portion 130 is further moved downward, whereby the first contact piece 101 , the second contact piece 102 and the third contact piece 103 are pressed against the measurement object T by a predetermined pressing force and are electrically connected. . As the first contact piece 101 , the second contact piece 102 and the third contact piece 103 are moved from the state of contact with the measurement object T, the first contact piece 101 , the second contact piece 102 and the third contact piece 103 are further pressed, causing the support part 150 to elastically deform, and causing the holding part 140 to press against the base part. 130 for relative movement. In this way, the holding part 140 will move relative to the base part 130, so the first contact piece 101, the second contact piece 102 and the third contact piece 103 held in the holding part 140 will also move relative to the base part 130. Therefore, excessive movement of the first contact piece 101 , the second contact piece 102 and the third contact piece 103 pressed against the measurement object T is suppressed, and the occurrence of contact traces in the measurement object T is suppressed. In addition, the pressing force for pressing the first contact piece 101 , the second contact piece 102 and the third contact piece 103 against the measurement object T is ensured by the elastic force generated by the elastic deformation of the support part 150 . That is, as the first contact piece 101, the second contact piece 102 and the third contact piece 103 are pressed against the measurement object T, the support portion 150 is elastically deformed, so that it can be connected with the signal line 112, the first ground line 113 and the The second ground wire 114 is formed into an integrated cylindrical shape to form the first contact piece 101 , the second contact piece 102 and the third contact piece 103 , which can suppress the faults caused by the first contact piece 101 , the second contact piece 102 and the third contact piece 103 . The bending of the third contact member 103 causes transmission loss, and can be brought into contact with the measurement object T by a predetermined pressure. Therefore, the occurrence of contact marks on the measurement object T can be suppressed, and the measurement precision of the measurement device 200 can be improved.

另外,一般就測量裝置而言,已有在具有不可逆性之半剛性型之同軸電纜的前端安裝著設置有接觸件的印刷電路基板的構成。在這樣的測量裝置中,當接觸件以預定的壓抵力壓抵於測量對象時,會使同軸電纜變形,因而使得同軸電纜之特性阻抗變化。因此,在這樣的測量裝置中,會有因同軸電纜所致之傳輸損失增加,且因測量裝置所致之高頻特性的測量精密度下降的疑慮。 In addition, measurement devices generally have a structure in which a printed circuit board provided with contacts is attached to the tip of an irreversible semi-rigid coaxial cable. In such a measuring device, when the contact piece is pressed against the measurement object with a predetermined pressing force, the coaxial cable will be deformed, thereby causing the characteristic impedance of the coaxial cable to change. Therefore, in such a measuring device, there is a concern that the transmission loss due to the coaxial cable increases and the measurement accuracy of the high-frequency characteristics due to the measuring device decreases.

對此,在測量裝置200中,傳輸基板110為具有柔軟性的可撓性印刷基板,所以會受到支持部150的彈性變形(於基座部130與保持部140之鉛直方向的相對移動)而彎曲。具體而言,傳輸基板110係以安裝於保持部140的一端部會相對於安裝於基座部130的中間部而上下(第11圖 中上下方向)地移動的方式變形。在如此之傳輸基板110的變形中,信號線112、第一接地線113及第二接地線114之相對性的位置關係(間隔)並不會改變。因此,即使傳輸基板110隨著支持部150的變形而變形,傳輸基板110的特性阻抗也不會變化,也抑制了傳輸基板110的傳輸損失。因此,可使測量裝置200的測量精密度會提升。 In contrast, in the measurement device 200, the transmission substrate 110 is a flexible printed circuit board with flexibility, so it is subject to elastic deformation of the support portion 150 (relative movement in the vertical direction between the base portion 130 and the holding portion 140). bend. Specifically, the transmission substrate 110 is deformed in such a manner that one end portion attached to the holding portion 140 moves up and down (in the up and down direction in FIG. 11 ) relative to an intermediate portion attached to the base portion 130 . During such deformation of the transmission substrate 110, the relative positional relationship (spacing) of the signal line 112, the first ground line 113 and the second ground line 114 does not change. Therefore, even if the transmission substrate 110 deforms as the support portion 150 deforms, the characteristic impedance of the transmission substrate 110 does not change, and the transmission loss of the transmission substrate 110 is suppressed. Therefore, the measurement precision of the measurement device 200 can be improved.

另外,一般在測量對象中,會有於測量面會發生高低差(凹凸)的情形。特別是,當測量對象為電子電路基板的情形,會相較於半導體晶圓等還容易發生較大的凹凸。當測量對象具有高低差時,會有某一接觸件先接觸高度相對較高之部位,而其他的接觸件卻不會充分地接觸高度相對較低之部位的疑慮。如此,當測量對象發生高低差(凹凸)時,接觸件與測量對象的接觸狀態變得不均等,會有不能獲得良好之接觸狀態的疑慮。 In addition, in general, in the measurement object, there may be a difference in level (concavity and convexity) on the measurement surface. In particular, when the measurement object is an electronic circuit substrate, larger unevenness is likely to occur compared to a semiconductor wafer, for example. When the measurement object has a height difference, there may be a concern that a certain contact piece contacts the relatively high height part first, while other contact pieces will not fully contact the relatively low height part. In this way, when the measurement object has a height difference (concave-convexity), the contact state between the contact piece and the measurement object becomes uneven, and there is a concern that a good contact state cannot be obtained.

對此,測量裝置200中,第一接觸件101、第二接觸件102及第三接觸件103係經由彈性構件160而安裝於保持部140。另外,第一接觸件101、第二接觸件102及第三接觸件103係設置於具有柔軟性的傳輸基板110上。因此,當第一接觸件101、第二接觸件102及第三接觸件103與測量對象T接觸時,與該接觸件相對向的彈性構件160會被壓縮,並且使傳輸基板110變形。因此,即使某一接觸件先與測量對象T接觸,亦可藉由彈性構件160與傳輸基板110的變形而與其他的接觸件一起使保持部140朝測量對象T進一步移動。 In contrast, in the measuring device 200 , the first contact 101 , the second contact 102 and the third contact 103 are mounted on the holding part 140 via the elastic member 160 . In addition, the first contact member 101, the second contact member 102 and the third contact member 103 are provided on the flexible transmission substrate 110. Therefore, when the first contact member 101 , the second contact member 102 and the third contact member 103 come into contact with the measurement object T, the elastic member 160 opposite to the contact member will be compressed and deform the transmission substrate 110 . Therefore, even if a certain contact piece comes into contact with the measurement object T first, the holding part 140 can be further moved toward the measurement object T together with other contact pieces through the deformation of the elastic member 160 and the transmission substrate 110 .

如此,測量裝置200中,第一接觸件101、第二接觸件102、及第三接觸件103係能夠以彼此不同的移動量來獨立移動(換言之相對移動),而能容許測量對象T之高度的差。因此,可使第一接觸件101、第二 接觸件102及第三接觸件103與測量對象T的接觸狀態成為均等者。藉此,能夠以預定的壓抵力來分別將第一接觸件101、第二接觸件102及第三接觸件與測量對象T壓抵,並獲得良好的接觸狀態。 In this way, in the measuring device 200, the first contact piece 101, the second contact piece 102, and the third contact piece 103 can move independently (in other words, move relative to each other) with different movement amounts, thereby allowing the height of the object T to be measured. difference. Therefore, the contact states of the first contact 101, the second contact 102, and the third contact 103 with the measurement object T can be equalized. Thereby, the first contact piece 101, the second contact piece 102, and the third contact piece can be pressed against the measurement object T with a predetermined pressing force, and a good contact state can be obtained.

(第三實施型態) (Third implementation type)

接著,參照第14圖及第15圖,說明本發明的第三實施型態。以下,以與上述第二實施型態不同點為中心加以說明,且對與上述第二實施型態相同的構成標示相同的符號並省略說明。 Next, a third embodiment of the present invention will be described with reference to Figures 14 and 15. The following description will focus on differences from the second embodiment, and the same components as those in the second embodiment will be designated by the same reference numerals and descriptions will be omitted.

在上述第二實施型態中,使第一接觸件101、第二接觸件102及第三接觸件103彼此獨立移動的移動容許部係設置於保持部140的彈性構件160。在上述第二實施型態中,以彈性構件160膨脹收縮的方式,使第一接觸件101、第二接觸件102及第三接觸件103彼此獨立移動。 In the second embodiment described above, the movement allowing portion that allows the first contact 101 , the second contact 102 and the third contact 103 to move independently of each other is provided in the elastic member 160 of the holding portion 140 . In the second embodiment described above, the elastic member 160 expands and contracts to cause the first contact member 101 , the second contact member 102 and the third contact member 103 to move independently of each other.

對此,第三實施型態的測量裝置300中,移動容許部係與保持部140一體成形的彈性構造部260。 On the other hand, in the measurement device 300 of the third embodiment, the movement allowing portion is the elastic structure portion 260 that is integrally formed with the holding portion 140 .

彈性構造部260係具有:基部261及複數個變形部,該基部261係與保持部140連接,而該複數個變形部係以基部261為支點而彼此獨立地彎曲變形(彈性變形)。 The elastic structure part 260 has a base part 261 and a plurality of deformation parts. The base part 261 is connected to the holding part 140. The plurality of deformation parts are bent and deformed (elastically deformed) independently of each other with the base part 261 as a fulcrum.

如第14圖及第15圖所示,變形部係設置有與接觸件相對應的數量(在本實施型態中為三個),且各自隔著傳輸基板110而安裝有第一接觸件101、第二接觸件102及第三接觸件103。以下中,將安裝有第一接觸件101的變形部稱為「第一變形部265」、將安裝有第二接觸件102的變形部稱為「第二變形部266」、將安裝有第三接觸件103的變形部稱為「第三變形部267」。第一變形部265、第二變形部266及第三變形部 267係各自從基部261折彎基端側而形成,且從基端側與測量對象T平行地延伸。第一變形部265、第二變形部266及第三變形部267的前端部係構成為自由端。 As shown in FIGS. 14 and 15 , the deformation portions are provided with a number corresponding to the contacts (three in this embodiment), and first contacts 101 are installed on each of the deformation portions across the transmission substrate 110 . , the second contact piece 102 and the third contact piece 103. In the following, the deformation part to which the first contact 101 is attached will be called the "first deformation part 265", the deformation part to which the second contact 102 will be attached will be called the "second deformation part 266", and the deformation part to which the third contact 102 will be attached will be called the "second deformation part 266". The deformation part of the contact piece 103 is called the "third deformation part 267". The first deformation part 265, the second deformation part 266 and the third deformation part 267 are each formed by bending the proximal end side from the base part 261, and extend parallel to the measurement object T from the proximal end side. The front end portions of the first deformation portion 265, the second deformation portion 266, and the third deformation portion 267 are configured as free ends.

如第14圖所示,於第一變形部265、第二變形部266及第三變形部267與保持部140之間係主要形成有間隙260a。藉由間隙260a的設置,防止第一變形部265、第二變形部266及第三變形部267與保持部140的衝突。 As shown in FIG. 14 , a gap 260 a is mainly formed between the first deformation part 265 , the second deformation part 266 and the third deformation part 267 and the holding part 140 . By providing the gap 260a, the first deformation part 265, the second deformation part 266 and the third deformation part 267 are prevented from colliding with the holding part 140.

另外,於第一變形部265、第二變形部266及第三變形部267之間係形成有彼此分隔彼此的狹縫260b、260c。基部261、第一變形部265、第二變形部266及第三變形部267係與保持部140一起藉由樹脂一體成形。 In addition, slits 260b and 260c are formed between the first deformation part 265, the second deformation part 266 and the third deformation part 267 to separate each other. The base portion 261, the first deformation portion 265, the second deformation portion 266, and the third deformation portion 267 are integrally molded with resin together with the holding portion 140.

如第15圖所示,傳輸基板110係形成有狹縫110a、110b,該狹縫110a、110b係在信號線112與第一接地線113之間及在信號線112與第二接地線114之間中沿著長邊方向延伸。第一接觸件101、第二接觸件102及第三接觸件103係藉由狹縫110a、110b而彼此分隔,所以變得容易獨立移動。 As shown in FIG. 15, the transmission substrate 110 is formed with slits 110a and 110b. The slits 110a and 110b are between the signal line 112 and the first ground line 113 and between the signal line 112 and the second ground line 114. extending along the long side. The first contact piece 101, the second contact piece 102 and the third contact piece 103 are separated from each other by the slits 110a and 110b, so they become easy to move independently.

第一變形部265、第二變形部266及第三變形部267係可彎曲變形,俾使各自能夠以基部261為支點而使自由端朝鉛直方向上下移動。換言之,第一變形部265、第二變形部266及第三變形部267係能夠以基部261為支點而彎曲變形。另外,第一變形部265、第二變形部266及第三變形部267係由狹縫260b、260c分隔,且可彼此獨立地變形。因此,安裝於第一變形部265、第二變形部266及第三變形部267的第一接觸件 101、第二接觸件102及第三接觸件103亦可彼此獨立移動。在如此的第四實施型態中,亦與上述第三實施型態同樣地,可容許測量對象T的高低差,並使第一接觸件101、第二接觸件102及第三接觸件103與測量對象T的接觸狀態成為均等者。因此,即使於測量對象T具有高低差,亦可實現第一接觸件101、第二接觸件102及第三接觸件103與測量對象T的良好接觸狀態。 The first deformation part 265, the second deformation part 266 and the third deformation part 267 are bendable and deformable, so that each of the free ends can move up and down in the vertical direction using the base part 261 as a fulcrum. In other words, the first deformation part 265, the second deformation part 266, and the third deformation part 267 are bendable and deformable with the base part 261 as a fulcrum. In addition, the first deformation part 265, the second deformation part 266 and the third deformation part 267 are separated by slits 260b and 260c, and can deform independently from each other. Therefore, the first contact piece 101, the second contact piece 102 and the third contact piece 103 installed on the first deformation part 265, the second deformation part 266 and the third deformation part 267 can also move independently of each other. In this fourth embodiment, similarly to the above-described third embodiment, the height difference of the measurement object T can be tolerated, and the first contact 101, the second contact 102, and the third contact 103 can be connected to each other. The contact state of the measurement object T becomes equal. Therefore, even if the measurement object T has a height difference, a good contact state between the first contact piece 101 , the second contact piece 102 and the third contact piece 103 and the measurement object T can be achieved.

此外,與上述第二實施型態同樣,在測量裝置300中,亦可設為於傳輸基板110不設置狹縫110a、110b的構成。該情形,亦可不設成為以設置複數個狹縫260b、260c而設置變形部的構成(第14圖的構成),而如第16圖所示,構成為單一變形部268與基部261連接,且對變形部268安裝有第一接觸件101、第二接觸件102、第三接觸件103。 In addition, similar to the second embodiment described above, the measuring device 300 may be configured such that the slits 110 a and 110 b are not provided in the transmission substrate 110 . In this case, instead of providing a plurality of slits 260b and 260c to provide a deformation portion (the configuration of FIG. 14), as shown in FIG. 16, a single deformation portion 268 is connected to the base portion 261, and The first contact 101 , the second contact 102 , and the third contact 103 are attached to the deformation portion 268 .

反之,在上述第二實施型態中,亦可如第三實施型態的方式,於傳輸基板110設置隔開第一接觸件101、第二接觸件102及第三接觸件103的狹縫110a、110b。當於傳輸基板110設置狹縫110a、110b的情形,如上述,會使第一接觸件101、第二接觸件102及第三接觸件103容易獨立移動。另一方面,當於傳輸基板110不設置狹縫110a、110b的情形,在信號線112與第一接地線113之間及在信號線112與第二接地線114之間不會形成有由狹縫110a、110b所產生的空氣層。因此,當於傳輸基板110不設置狹縫110a、110b時,容易使高頻傳輸線路的特性阻抗與測量對象T的特性阻抗匹配。關於是否於傳輸基板110設置狹縫110a、110b,只要考慮高頻傳輸線路的特性阻抗來決定即可。 On the contrary, in the above-mentioned second embodiment, the slit 110a that separates the first contact 101, the second contact 102 and the third contact 103 can also be provided in the transmission substrate 110 in the same manner as the third embodiment. ,110b. When the slits 110a and 110b are provided in the transmission substrate 110, as described above, the first contact member 101, the second contact member 102 and the third contact member 103 can easily move independently. On the other hand, when the transmission substrate 110 is not provided with the slits 110a and 110b, no slits are formed between the signal line 112 and the first ground line 113 and between the signal line 112 and the second ground line 114. The air layer created by the slits 110a and 110b. Therefore, when the slits 110 a and 110 b are not provided in the transmission substrate 110 , the characteristic impedance of the high-frequency transmission line and the characteristic impedance of the measurement object T can be easily matched. Whether to provide the slits 110a and 110b in the transmission substrate 110 may be determined by considering the characteristic impedance of the high-frequency transmission line.

如以上方式,在使屬於移動容許部的彈性構造部260以基部261為支點並使複數個變形部彼此獨立地彎曲變形的第三實施型態中,亦發揮與第二實施型態同樣的作用效果。也就是,移動容許部亦可是如上述第二實施型態之方式,藉由本身的壓縮(伸縮)來容許接觸件的獨立移動,亦可是如上述第三實施型態之方式,藉由以基部261為支點的複數個變形部(第一變形部265、第二變形部266及第三變形部267)的彎曲變形來容許接觸件的獨立移動。 As described above, in the third embodiment in which the elastic structure portion 260 belonging to the movement allowing portion is bent and deformed independently of each other using the base portion 261 as a fulcrum, the same function as in the second embodiment is exerted. Effect. That is, the movement allowing part may allow independent movement of the contact piece by its own compression (expansion and contraction) as in the above-mentioned second embodiment, or may be as in the above-mentioned third embodiment by using the base part 261 represents the bending deformation of the plurality of deformation portions (the first deformation portion 265, the second deformation portion 266, and the third deformation portion 267) of the fulcrum to allow independent movement of the contact.

接著,說明第二及第三實施型態的變形例。如下述之變形例亦為本發明的範圍內,亦可組合以下的變形例與上述實施型態的各構成,或將以下的變形例彼此組合。另外,上述實施型態的說明中所揭示的變形例亦同樣地可任意地與其他的變形例組合。 Next, modifications of the second and third embodiments will be described. As the following modifications are also within the scope of the present invention, the following modifications may be combined with each configuration of the above-described embodiment, or the following modifications may be combined with each other. In addition, the modifications disclosed in the description of the above embodiments can also be arbitrarily combined with other modifications.

在上述第二及第三實施型態中,高頻傳輸線路為共平面線路。對此,高頻傳輸線路亦可為條狀線路或微帶線路等其他的線路。 In the above-mentioned second and third embodiments, the high-frequency transmission lines are coplanar lines. In this regard, the high-frequency transmission line may also be a strip line or a microstrip line or other lines.

另外,在上述第二及第三實施型態中,傳輸基板110為具有柔軟性的可撓性印刷基板。對此,傳輸基板110係可為包含具有柔軟性之部位及不具有柔軟性之部位之軟硬結合基板。於申請專利範圍中之「具有柔軟性的傳輸基板」意指不限定為整體具有柔軟性的可撓性印刷基板,亦包含部分具有柔軟性的軟硬結合基板。 In addition, in the above-mentioned second and third embodiments, the transmission substrate 110 is a flexible flexible printed substrate. In this regard, the transmission substrate 110 may be a rigid-flexible substrate including a flexible portion and a non-flexible portion. The "flexible transmission substrate" in the scope of the patent application is not limited to a flexible printed substrate that is flexible as a whole, but also includes a soft-hard composite substrate that is partially flexible.

另外,在上述第二及第三實施型態中,於支持部150中之連接部151、155的桿部152、156係具有彼此相同的長度。對此,桿部152、156亦可構成為長度彼此不同。 In addition, in the above-mentioned second and third embodiments, the rod portions 152 and 156 of the connecting portions 151 and 155 in the supporting portion 150 have the same length as each other. In this regard, the rod portions 152 and 156 may be configured to have different lengths from each other.

另外,在上述第二及第三實施型態中,支持部150係指藉由具有一對連接部151、155的連接機構所構成。對此,支持部150只要構成為隨著第一接觸件101、第二接觸件102及第三接觸件103往測量對象T的壓抵而變形,則不限定為連接機構,可設為任意的構成。 In addition, in the above-mentioned second and third embodiments, the support part 150 is constituted by a connection mechanism having a pair of connection parts 151 and 155 . In this regard, the support portion 150 is not limited to a connection mechanism and may be any structure as long as it is deformed as the first contact 101 , the second contact 102 and the third contact 103 are pressed against the measurement object T. composition.

另外,在上述第二及第三實施型態中,第一接觸件101、第二接觸件102、第三接觸件103係形成為圓柱形狀。不限定於此,第一接觸件101、第二接觸件102、第三接觸件103可形成為任意的形狀。第一接觸件101、第二接觸件102、第三接觸件103例如亦可是角柱、角錐、圓錐、角錐台、圓錐台等的形狀。 In addition, in the above-mentioned second and third embodiments, the first contact piece 101, the second contact piece 102, and the third contact piece 103 are formed in a cylindrical shape. It is not limited thereto, and the first contact 101, the second contact 102, and the third contact 103 may be formed in any shape. The first contact 101 , the second contact 102 , and the third contact 103 may also have shapes such as a corner prism, a pyramid, a cone, a pyramid, a truncated cone, or the like.

接著,總結說明上述各實施型態的作用效果 Next, the functions and effects of each of the above embodiments are summarized and explained.

在第一至三實施型態中,測量裝置100、200、300係具備有:第一接觸件1、101、第二接觸件2、102、第三接觸件3、103;本體部10、120;以及傳輸基板60、110;該第一接觸件1、101、第二接觸件2、102、第三接觸件3、103係各自被壓抵至測量對象T;該本體部10、120係安裝有第一接觸件1、101、第二接觸件2、102、第三接觸件3、103;該傳輸基板60、110係設置有電性連接於第一接觸件1、101、第二接觸件2、102、第三接觸件3、103的高頻傳輸線路;其中,本體部120係具有:基座部20、130;保持部30、140;以及支持部40、150;該保持部30、140係保持第一接觸件1、101、第二接觸件2、102、第三接觸件3、103;該支持部40、150係安裝於基座部20、130並支持保持部30、140;而保持部30、140係隨著第一接觸件1、101、第二接觸件2、102、第三接觸件3、103往測量對象T的壓抵,對基座部20、130做相對移動。 In the first to third embodiments, the measuring devices 100, 200, and 300 are equipped with: first contact members 1, 101, second contact members 2, 102, and third contact members 3, 103; body parts 10, 120 ; and transmission substrates 60, 110; the first contact 1, 101, the second contact 2, 102, and the third contact 3, 103 are each pressed against the measurement object T; the body portion 10, 120 is installed There are first contacts 1, 101, second contacts 2, 102, and third contacts 3, 103; the transmission substrates 60, 110 are provided with electrically connected to the first contacts 1, 101, and the second contacts 2. 102. The high-frequency transmission line of the third contact 3, 103; wherein, the body part 120 has: a base part 20, 130; a holding part 30, 140; and a supporting part 40, 150; the holding part 30, 140 holds the first contact piece 1, 101, the second contact piece 2, 102, and the third contact piece 3, 103; the support parts 40, 150 are installed on the base parts 20, 130 and support the holding parts 30, 140; The holding portions 30 and 140 move relative to the base portions 20 and 130 as the first contact piece 1, 101, the second contact piece 2, 102, and the third contact piece 3, 103 press against the measurement object T. .

根據第一至三實施型態,由於保持部30、140會隨著第一接觸件1、101、第二接觸件2、102、第三接觸件3、103往測量對象T的壓抵來對基座部20、130做相對移動,所以藉由保持部30、140所保持的第一接觸件1、101、第二接觸件2、102、第三接觸件3、103,各自也會沿著壓抵的方向來對基座部20、130做相對移動。藉此,會抑制往測量對象T壓抵之第一接觸件1、101、第二接觸件2、102、第三接觸件3、103的過度移動,而抑制於測量對象T中之接觸痕跡的發生。另外,由於抑制往測量對象T壓抵之第一接觸件1、101、第二接觸件2、102、第三接觸件3、103的過度移動,所以亦可不使第一接觸件1、101、第二接觸件2、102、第三接觸件3、103大幅地彎曲,而抑制肇因於第一接觸件1、101、第二接觸件2、102、第三接觸件3、103之傳輸損失的增加。因此,可抑制在測量對象T之接觸痕跡的發生,並且提升測量裝置100、200、300的測量精密度。 According to the first to third embodiments, since the holding portions 30 and 140 will press against the measurement object T as the first contact piece 1, 101, the second contact piece 2, 102, and the third contact piece 3, 103 The base parts 20 and 130 move relative to each other, so the first contact parts 1 and 101, the second contact parts 2 and 102, and the third contact parts 3 and 103 held by the holding parts 30 and 140 will also move along the The base portions 20 and 130 are relatively moved in the pressing direction. Thereby, excessive movement of the first contact piece 1, 101, the second contact piece 2, 102, and the third contact piece 3, 103 that are pressed against the measurement object T is suppressed, and the contact traces in the measurement object T are suppressed. happen. In addition, since excessive movement of the first contact 1, 101, the second contact 2, 102, and the third contact 3, 103 pressing against the measurement object T is suppressed, the first contact 1, 101, 101, 103, The second contact 2, 102, and the third contact 3, 103 are greatly bent, thereby suppressing the transmission loss caused by the first contact 1, 101, the second contact 2, 102, and the third contact 3, 103. increase. Therefore, the occurrence of contact marks on the measurement object T can be suppressed, and the measurement precision of the measurement devices 100, 200, and 300 can be improved.

另外,在第一實施型態中,測量裝置100的支持部40會隨著第一接觸件1及第二接觸件2往測量對象T的壓抵而彈性變形。 In addition, in the first embodiment, the support portion 40 of the measuring device 100 will elastically deform as the first contact piece 1 and the second contact piece 2 press against the measurement object T.

另外,第一實施型態的測量裝置100中,支持部40係構成為隨著第一接觸件1及第二接觸件2往測量對象T的壓抵,優先於第一接觸件1及第二接觸件2而彈性變形。 In addition, in the measurement device 100 of the first embodiment, the support portion 40 is configured to have priority over the first contact 1 and the second contact 2 as the first contact 1 and the second contact 2 are pressed against the measurement object T. The contact piece 2 is elastically deformed.

根據如此的第一實施型態,在將第一接觸件1及第二接觸件2與測量對象T壓抵時,可藉由本體部10之支持部40的彈性變形而以預定的壓抵力來使第一接觸件1及第二接觸件2接觸。因此,可不用使第一 接觸件1及第二接觸件2積極地彎曲,而可提升第一接觸件1及第二接觸件2的耐久性。 According to such a first embodiment, when the first contact piece 1 and the second contact piece 2 are pressed against the measurement object T, the elastic deformation of the support portion 40 of the body portion 10 can be used to press the first contact piece 1 and the second contact piece 2 with a predetermined pressing force. to bring the first contact piece 1 and the second contact piece 2 into contact. Therefore, there is no need to actively bend the first contact member 1 and the second contact member 2, and the durability of the first contact member 1 and the second contact member 2 can be improved.

另外,第一實施型態的測量裝置100中,第一接觸件1及第二接觸件2係各自由燒結金屬所形成。 In addition, in the measuring device 100 of the first embodiment, the first contact piece 1 and the second contact piece 2 are each formed of sintered metal.

另外,第一實施型態的測量裝置100中,第一接觸件1及第二接觸件2係各自由工具鋼所形成。 In addition, in the measuring device 100 of the first embodiment, the first contact piece 1 and the second contact piece 2 are each made of tool steel.

根據如此的第一實施型態,第一接觸件1及第二接觸件2係由耐久性較高且耐磨性優越的材質所形成,所以會抑制測量裝置100之測量精密度隨著磨耗而降低此一情形。 According to the first embodiment, the first contact piece 1 and the second contact piece 2 are made of a material with high durability and excellent wear resistance, so the measurement accuracy of the measuring device 100 is suppressed from deteriorating with wear. Reduce this situation.

另外,在第一實施型態中,保持部30係具有:保持連接於基座部20之第一接觸件1的第一保持部31;以及保持連接於基座部20之第二接觸件2的第二保持部35;且第一保持部31與第二保持部35係彼此可獨立移動地安裝於基座部20。 In addition, in the first embodiment, the holding portion 30 has: a first holding portion 31 that holds the first contact 1 connected to the base portion 20; and a second contact 2 that holds the connection to the base portion 20. The second holding part 35; and the first holding part 31 and the second holding part 35 are movably installed on the base part 20 independently of each other.

根據如此的第一實施型態,第一接觸件1及第二接觸件2係電性連接於傳輸基板60,並且藉由彼此可獨立移動的第一保持部31及第二保持部35來保持。藉此,可使第一接觸件1與第二接觸件2彼此獨立移動。如此,藉由第一保持部31及第二保持部35的移動,來使第一接觸件1與第二接觸件2彼此獨立運動,所以可大幅地確保第一接觸件1與第二接觸件2的移動量。因此,即使在測量對象T中產生高低差的情形,也會使第一接觸件1及第二接觸件2均等地與測量對象T接觸,而可實現良好接觸狀態。因此,提升測量裝置100的測量精密度。 According to such a first embodiment, the first contact 1 and the second contact 2 are electrically connected to the transmission substrate 60 and are held by the first holding part 31 and the second holding part 35 that are independently movable to each other. . Thereby, the first contact piece 1 and the second contact piece 2 can move independently of each other. In this way, through the movement of the first holding part 31 and the second holding part 35, the first contact piece 1 and the second contact piece 2 move independently of each other, so the first contact piece 1 and the second contact piece can be greatly ensured. 2 movement amount. Therefore, even if a height difference occurs in the measurement object T, the first contact 1 and the second contact 2 are brought into equal contact with the measurement object T, and a good contact state can be achieved. Therefore, the measurement precision of the measurement device 100 is improved.

另外,在第一實施型態中,傳輸基板60係具有:接著於第一接觸件1的第一接著部65;以及接著於第二接觸件2的第二接著部66;且第一接著部65與第二接著部66係構成為藉由狹縫60a分隔而彼此可獨立移動。 In addition, in the first embodiment, the transmission substrate 60 has: a first connecting portion 65 connected to the first contact 1; and a second connecting portion 66 connected to the second contact 2; and the first connecting portion 65 and the second connecting portion 66 are separated by the slit 60a and are configured to move independently of each other.

根據如此的第一實施型態,第一接著部65與第二接著部66係可獨立移動,所以抑制第一接觸件1與第二接觸件2的相對移動被傳輸基板60阻礙。因此,可使第一接觸件1與第二接觸件2更大幅地做相對移動。因此,即使測量對象T的凹凸變大,也能夠以良好精密度進行測量。也就是,根據本實施型態,為了高精密度量測而可容許之測量對象T的凹凸量(高低差)會加大。 According to this first embodiment, the first connecting portion 65 and the second connecting portion 66 can move independently, so the relative movement of the first contact 1 and the second contact 2 is suppressed from being hindered by the transmission substrate 60 . Therefore, the first contact piece 1 and the second contact piece 2 can be relatively moved more significantly. Therefore, even if the unevenness of the measurement target T becomes large, the measurement can be performed with good accuracy. That is, according to this embodiment, the allowable amount of unevenness (height difference) of the measurement object T for high-precision measurement is increased.

另外,在第一實施型態中,本體部10更具有:設置於基座部20且支持第一保持部31的第一支持部41;以及設置於基座部20且支持第二保持部35的第二支持部45;且第一支持部41會隨著第一接觸件1往測量對象T的壓抵而彈性變形,而第二支持部45會隨著第二接觸件2往測量對象T的壓抵而彈性變形。 In addition, in the first embodiment, the body part 10 further has: a first supporting part 41 provided on the base part 20 and supporting the first holding part 31; and a second holding part 35 provided on the base part 20 and supporting the first holding part 31. The second support part 45; and the first support part 41 will elastically deform as the first contact piece 1 is pressed against the measurement object T, and the second support part 45 will follow the second contact piece 2 to the measurement object T. The pressure causes elastic deformation.

根據如此的第一實施型態,第一支持部41與第二支持部45會獨立,且各自可彈性變形,所以可使第一接觸件1與第二接觸件2彼此獨立移動。因此,藉由第一支持部41及第二支持部45的彈性變形,相較於使第一接觸件1與第二接觸件2彎曲的情形,能夠以更大幅的移動量來使第一接觸件1與第二接觸件2獨立移動。也就是,本體部10係相較於第一接觸件1及第二接觸件2為較大的構件,所以可容易確保使之獨立移動的移動量。 According to such a first embodiment, the first support part 41 and the second support part 45 are independent and elastically deformable, so that the first contact piece 1 and the second contact piece 2 can move independently of each other. Therefore, through the elastic deformation of the first support part 41 and the second support part 45, the first contact member 1 and the second contact member 2 can be moved with a larger movement amount than when the first contact member 1 and the second contact member 2 are bent. Part 1 and second contact part 2 move independently. That is, the body part 10 is a larger member than the first contact piece 1 and the second contact piece 2, so it is easy to ensure a movement amount for independent movement.

此外,在第二及第三實施型態的測量裝置200、300中,傳輸基板110係具有柔軟性,高頻傳輸線路係含有信號線112及接地線(第一接地線113、第二接地線114),且第一接觸件101、第二接觸件102及第三接觸件103係與各自相對應的信號線112及接地線(第一接地線113、第二接地線114)一體地設置,而支持部150會隨著第一接觸件101、第二接觸件102、第三接觸件103往測量對象T的壓抵而彈性變形。 In addition, in the measurement devices 200 and 300 of the second and third embodiments, the transmission substrate 110 is flexible, and the high-frequency transmission line includes a signal line 112 and a ground line (first ground line 113, second ground line 114), and the first contact piece 101, the second contact piece 102 and the third contact piece 103 are integrally provided with the corresponding signal lines 112 and ground lines (the first ground line 113, the second ground line 114), The support part 150 will elastically deform as the first contact piece 101, the second contact piece 102, and the third contact piece 103 press against the measurement object T.

根據如此的第二及第三實施型態,在將第一接觸件101、第二接觸件102、第三接觸件103壓抵於測量對象T時,可藉由本體部120的支持部150的彈性變而以預定的壓抵力來使第一接觸件101、第二接觸件102、第三接觸件103接觸。另外,高頻傳輸線路係設置於具有柔軟性的傳輸基板110,所以即使隨著對測量對象T壓抵第一接觸件101、第二接觸件102、第三接觸件103並使傳輸基板110變形,也可抑制傳輸損失。因此,以預定的壓抵力,將第一接觸件101、第二接觸件102、第三接觸件103與測量對象T壓抵,可抑制傳輸損失,所以可提升測量裝置200、300的測量精密度。 According to such second and third embodiments, when the first contact piece 101, the second contact piece 102, and the third contact piece 103 are pressed against the measurement object T, the support portion 150 of the body portion 120 can The elasticity changes to bring the first contact piece 101, the second contact piece 102, and the third contact piece 103 into contact with a predetermined pressing force. In addition, the high-frequency transmission line is provided on the flexible transmission substrate 110, so even if the measurement object T is pressed against the first contact 101, the second contact 102, and the third contact 103 and the transmission substrate 110 is deformed, , which can also suppress transmission losses. Therefore, by pressing the first contact piece 101, the second contact piece 102, and the third contact piece 103 against the measurement object T with a predetermined pressing force, the transmission loss can be suppressed, so the measurement precision of the measuring devices 200 and 300 can be improved. Spend.

另外,第二及第三實施型態的測量裝置200、300係更具備有移動容許部(彈性構件160、彈性構造部260),該移動容許部係設置於保持部140,且容許隨著往測量對象T的壓抵之第一接觸件101、第二接觸件102、第三接觸件103彼此的獨立移動。 In addition, the measuring devices 200 and 300 of the second and third embodiments are further equipped with a movement allowing part (elastic member 160, elastic structure part 260). The movement allowing part is provided in the holding part 140 and allows the movement of the moving parts as they move. The first contact piece 101 , the second contact piece 102 , and the third contact piece 103 against which the object T is pressed move independently of each other.

另外,在第二實施型態的測量裝置200中,移動容許部為具有彈性的彈性構件160,且第一接觸件101、第二接觸件102、第三接觸件103係構成為藉由彈性構件160的彈性變形而彼此可獨立移動。 In addition, in the measuring device 200 of the second embodiment, the movement allowing portion is an elastic member 160 having elasticity, and the first contact 101, the second contact 102, and the third contact 103 are configured by the elastic member. 160 degrees of elastic deformation and can move independently of each other.

另外,在第三實施型態的測量裝置300中,移動容許部係具有:連接於保持部140的基部261;以基部261為支點而彼此獨立彈性變形的複數個變形部(第一變形部265、第二變形部266、第三變形部267),且第一接觸件101、第二接觸件102、第三接觸件103係安裝於各自相對應的複數個變形部(第一變形部265、第二變形部266、第三變形部267),且構成為藉由變形部(第一變形部265、第二變形部266、第三變形部267)以基部261為支點彈性變形,而彼此可獨立移動。 In addition, in the measurement device 300 of the third embodiment, the movement allowing portion includes: a base portion 261 connected to the holding portion 140; and a plurality of deformation portions (first deformation portion 265) that elastically deform independently of each other with the base portion 261 as a fulcrum. , the second deformation part 266, the third deformation part 267), and the first contact piece 101, the second contact piece 102, the third contact piece 103 are installed on a plurality of corresponding deformation parts (the first deformation part 265, The second deformation part 266, the third deformation part 267), and are configured to be elastically deformed with the base part 261 as a fulcrum by the deformation parts (the first deformation part 265, the second deformation part 266, the third deformation part 267), so as to be mutually accessible to each other. Move independently.

根據如此的第二及第三實施型態,可使第一接觸件101、第二接觸件102、第三接觸件103彼此獨立移動,所以即使在測量對象T中產生高低差時,也可使第一接觸件101、第二接觸件102、第三接觸件103之各者均等地與測量對象T接觸。因此,可實現第一接觸件101、第二接觸件102、第三接觸件103與測量對象T之良好接觸狀態,且提升測量裝置200、300的測量精密度。 According to the second and third embodiments, the first contact 101, the second contact 102, and the third contact 103 can be moved independently of each other. Therefore, even when a height difference occurs in the measurement object T, the first contact 101, the second contact 102, and the third contact 103 can be moved independently. Each of the first contact 101 , the second contact 102 , and the third contact 103 contacts the measurement object T equally. Therefore, a good contact state between the first contact piece 101 , the second contact piece 102 , and the third contact piece 103 and the measurement object T can be achieved, and the measurement precision of the measurement devices 200 and 300 can be improved.

以上,說明本發明的實施型態,惟上述實施型態只是顯示本發明之應用例的一部分,且並非將本發明的技術範圍限定為上述實施型態的具體構成之內容。 The embodiments of the present invention have been described above. However, the above-mentioned embodiments only show a part of the application examples of the present invention, and do not limit the technical scope of the present invention to the specific configuration of the above-mentioned embodiments.

本案依據2018年7月27日對日本特許廳提出申請之日本特願2018-141831、日本特願2018-141832及日本特願2018-141833之專利申請案主張優先權,在此以引用之方式將該等申請案的所有內容併入本發明專利說明書。 This case claims priority based on Japanese Patent Application No. 2018-141831, Japanese Patent Application No. 2018-141832 and Japanese Patent Application No. 2018-141833 filed with the Japan Patent Office on July 27, 2018, which are hereby incorporated by reference. All contents of these applications are incorporated into the patent specification of this invention.

1‧‧‧第一接觸件 1‧‧‧First contact piece

2‧‧‧第二接觸件 2‧‧‧Second contact piece

10‧‧‧本體部 10‧‧‧Main part

11‧‧‧第一本體部 11‧‧‧The first body part

15‧‧‧第二本體部 15‧‧‧Second body part

20‧‧‧基座部 20‧‧‧Base part

20a‧‧‧螺栓 20a‧‧‧Bolt

21‧‧‧第一基座部 21‧‧‧First base part

25‧‧‧第二基座部 25‧‧‧Second base part

30‧‧‧保持部 30‧‧‧Maintenance Department

31‧‧‧第一保持部 31‧‧‧First Holding Department

35‧‧‧第二保持部 35‧‧‧Second holding part

40‧‧‧支持部 40‧‧‧Support Department

41‧‧‧第一支持部 41‧‧‧First Support Department

45‧‧‧第二支持部 45‧‧‧Second Support Department

60‧‧‧傳輸基板 60‧‧‧Transmission substrate

100‧‧‧測量裝置 100‧‧‧Measuring device

Claims (4)

一種測量裝置,係具備有:複數個接觸件,係各自被壓抵至測量對象;本體部,係安裝有前述複數個接觸件;以及傳輸基板,係設置有電性連接於前述複數個接觸件的高頻傳輸線路;前述本體部係具有:基座部;保持部,係保持前述複數個接觸件;以及支持部,係安裝於前述基座部且支持前述保持部;前述保持部係隨著前述複數個接觸件往前述測量對象的壓抵,對前述基座部做相對移動;前述傳輸基板係具有柔軟性,前述高頻傳輸線路係含有信號線及接地線,前述複數個接觸件係與各自相對應的前述信號線及前述接地線一體地設置,前述支持部係隨著前述複數個接觸件往前述測量對象的壓抵而彈性變形;前述測量裝置更具備移動容許部,該移動容許部係設置於前述保持部,並且安裝有前述複數個接觸件,且容許伴隨著往前述測量對象的壓抵之前述複數個接觸件彼此的獨立移動。 A measuring device, which is provided with: a plurality of contact pieces, each of which is pressed against a measurement object; a main body portion, which is equipped with the aforementioned plurality of contact pieces; and a transmission substrate, which is electrically connected to the aforementioned plurality of contact pieces. A high-frequency transmission line; the aforementioned body part has: a base part; a holding part that holds the plurality of contacts; and a support part that is installed on the base part and supports the holding part; the holding part follows The plurality of contact pieces are pressed against the measurement object to relatively move the base portion; the transmission substrate is flexible, the high-frequency transmission line contains signal lines and ground lines, and the plurality of contact pieces are connected to The corresponding signal lines and the ground wires are integrally provided, and the supporting portion is elastically deformed as the plurality of contacts are pressed against the measurement object; the measuring device further has a movement allowing portion, the movement allowing portion It is provided in the holding part, has the plurality of contacts attached thereto, and allows the plurality of contacts to move independently of each other in response to pressing against the measurement object. 如申請專利範圍第1項所述之測量裝置,其中,前述支持部係構成為隨著前述複數個接觸件往前述測量對象的壓抵,優先於前述複數個接觸件而彈性變形。 The measuring device as claimed in claim 1, wherein the support portion is configured to elastically deform in priority to the plurality of contact members as the plurality of contact members are pressed against the measurement object. 如申請專利範圍第1項所述之測量裝置,其中,前述移動容許部係具有彈性的彈性構件,前述複數個接觸件係構成為可藉由前述彈性構件的伸縮而彼此獨立移動。 The measuring device according to claim 1, wherein the movement allowing portion is an elastic member having elasticity, and the plurality of contacts are configured to move independently of each other by expansion and contraction of the elastic member. 如申請專利範圍第1項所述之測量裝置,其中,前述移動容許部係具有:基部,係連接於前述保持部;以及複數個變形部,係以前述基部為支點而彼此獨立地彈性變形;前述複數個接觸件係安裝於各自相對應的前述複數個變形部,且構成為可藉由以前述基部為支點使前述複數個變形部彎曲變形,而彼此獨立移動。 The measuring device according to claim 1, wherein the movement-allowing part has: a base part connected to the holding part; and a plurality of deformation parts that are elastically deformed independently of each other with the base part as a fulcrum; The plurality of contact pieces are mounted on the corresponding plurality of deformation portions, and are configured to move independently of each other by bending and deforming the plurality of deformation portions using the base portion as a fulcrum.
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JP2018141832A JP2020016626A (en) 2018-07-27 2018-07-27 Measuring apparatus
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