JP2001041975A - Contact probe device and inspection apparatus for circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a contact probe device in which a probe can be replaced quickly and easily. SOLUTION: This contact probe device 1 is provided with a probe holding means 4 which holds contact-type probes 5 and which is fixed to a probe guide mechanism PM1 so as to be detachable, and ends, on one side, of cables W1, for connection, ends, on the other side, of which are connected to an inspection means are connected to probes 6. The contact probe device 1 is featured in such a way that the probe holding means 4 is provided with holding-means-side electrodes 11a, 11b to which the ends, on the other side, of the cables W1 for connection are connected and that the holding-means-side electrodes 11a, 11b are constituted so as to be capable of being brought into contact with guide- mechanism-side electrodes 41a, 41b which are arranged and installed at the probe guide mechanism PM1 and which are connected electrically to the inspection means.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a contact probe device for performing an electrical inspection by contacting a probing object and a circuit board inspection device provided with the contact probe device.

[0002]

2. Description of the Related Art In general, a circuit board inspection apparatus for performing a predetermined electrical inspection by bringing a contact type probe into contact with a conductor pattern of a circuit board has an X-direction, a Y-direction, and a Z-direction ( A probe guide mechanism for moving the probe in the vertical direction is provided. FIG. 7 shows a contact probe device provided in this type of probe guide mechanism.
Is conventionally known.
The probe unit 51 includes a probe guide mechanism PM1
Connected to an inspection device not shown in the state attached to 1,
It is configured so that it can be brought into contact with a probing target together with another probe unit 51 (not shown) to perform an electrical test by a four-terminal method.

Specifically, the probe unit 51 includes a probe holder 54 detachably fixed to the probe guide mechanism PM11, contact probes 57 and 57 held by the probe holder 54, and a very thin signal cable W1.
1 and W11. The probe holding portion 54 is formed in a flat plate shape of an insulating resin as a whole, and has a central portion in which mounting screws S11 and S11 for mounting to the probe guide mechanism PM11 can be inserted, as shown in FIG. Holes 61, 61 are formed to communicate from the top surface 54a to the bottom surface 54d. Further, screw holes 62, 62 capable of screwing the fixing screws S13, S13 are formed on the side surfaces 54b, 54c of the probe holder 54, respectively.

The contact probe 57 includes a holder 55,
And a probe pin 6 to be brought into contact with the probing target. The holder 55 includes a probe holder 54.
A fixed portion 55a in which horizontally long oval-shaped fixing holes 71, 71 for fixing to the main body are formed, and an elastically deformable square rod-shaped arm 55b are integrally formed. A fixing groove 72 for fixing the probe pin 6 is formed. The probe pin 6
Is held by the holder 55 by being pressed into the fixing groove 72 so that the tip 6a can come into contact with the probing object, and one end of the signal cable W11 is attached to the rear end 6b as shown in FIG. It is bonded with a conductive adhesive.
In this case, the other end of each signal cable W11 (not shown) is connected to the inspection device.

When assembling the probe unit 51, first, the probe pins 6 are pressed into the fixing grooves 72 of the head 55c of the holder 55 to assemble the contact probe 57. Next, the contact probes 57 and 5
7 are fixed to the probe holders 54, respectively. At this time, the fixing screws S1 inserted through the fixing holes 71, 71 are used.
3, after lightly tightening S13 into the screw holes 62, 62, the fixing positions of the contact probes 57, 57 are finely adjusted so that the tips 6a, 6a of the probe pins 6, 6 have a predetermined separation distance. Then, the fixing screws S13 and S13 are strongly tightened. Next, the signal cables W11, W11
Of the probe pins 6 and 6 at the rear ends 6b and 6b.
Are bonded to each other with a conductive adhesive. Thus, the probe unit 51 is completed.

When mounting the probe unit 51 on the probe guide mechanism PM11, the mounting holes 61, 6
1, the mounting screws S11, S11 inserted from below
The upper surface 54a of the probe holder 54 and the probe guide mechanism PM1 are screwed into screw holes (not shown) formed at the lower end of the probe guide mechanism PM11.
1 and tightly fixed to the bottom surface. Next, the signal cable W1
1, the other end of W11 (not shown) is connected to a predetermined portion of the inspection apparatus by, for example, screwing. Thereby, the mounting operation of the probe unit 51 is completed.

On the other hand, when the probe pin 6 is replaced due to wear of the tip 6a or the like, the probe unit 51 is usually located in a deep part of the circuit board inspection apparatus.
Removal of the probe pin 6 from the fixing groove 72 of the holder 55, removal of the signal cable W11 from the probe pin 6, press fitting of a new probe pin 6 into the fixing groove 72, and to the probe pin 6 of the signal cable W11. The bonding of
This is a very difficult task. For this reason, first, after removing the other ends of the signal cables W11 and W11 from the inspection device,
Loosen the mounting screws S11, S11 and remove the probe unit 5
1 is removed from the probe guide mechanism PM11. Then
After the new probe unit 51 is mounted on the probe guide mechanism PM11 according to the above-described mounting method, the signal cables W11 and W11 are routed, and the other end is connected to the inspection device. Thereby, the replacement work of the probe unit 51 is completed.

[0008]

However, the conventional probe unit 51 has the following problems. That is, in the conventional probe unit 51, the probe pins 6
In order to replace the cable, the other end of the signal cables W11 and W11 on the inspection device side must be removed and routed. In this case, these tasks
Since the pair of signal cables W11 and W11 must be performed simultaneously, there is a problem that the replacement work of the probe unit 51 is very complicated and requires a long time. In addition, when the signal cable W11 is routed, the extra-fine signal cable W11 is connected to the probe guide mechanism PM.
In some cases, the wire may be hooked to the wire 11 or the like to cause disconnection, so that the replacement operation must be performed carefully, resulting in a problem that a longer time is spent.

Further, in the conventional probe unit 51, the probe unit 51 has a probe guide mechanism PM11.
Two mounting screws S11,
By screwing S11, the probe unit 5
1 is fixed to the probe guide mechanism PM11. For this reason, when the pair of probe units 51, 51 are fixed to the probe guide mechanism PM11 or when the contact probe 57 is replaced, it takes a long time to remove the fixing screws S11, S11... There is also.

The present invention has been made in view of the above problems, and has as its main object to provide a contact probe device and a circuit board inspection device in which probes can be quickly and easily replaced.

[0011]

According to a first aspect of the present invention, there is provided a contact probe device comprising a probe holding means which holds a contact type probe and is detachably fixed to a probe guide mechanism. In a contact probe device in which one end of a connection cable whose other end is electrically connected to the means is connected to the probe, the probe holding means includes a holding means-side electrode to which the other end of the connection cable is connected, The holding means-side electrode is provided so as to be capable of contacting a guide mechanism-side electrode provided on the probe guide mechanism and electrically connected to the inspection means.

According to a second aspect of the present invention, there is provided the contact probe device according to the first aspect, wherein
The probe holding means includes a printed circuit board on which a conductor pattern as a holding means-side electrode is formed.

According to a third aspect of the present invention, there is provided the contact probe device according to the second aspect.
The printed circuit board is composed of a multi-layer board, and on one side,
A conductor pattern as a holding means-side electrode to which one end of the connection cable is connected is formed, and on the other surface, a conductor pattern as a holding means-side electrode that is in contact with the guide mechanism-side electrode is formed. An inner layer conductor pattern as a holding means side electrode for connecting the two conductor patterns to each other is formed, and a shield pattern for shielding the inner layer conductor pattern is formed on at least one of one surface and the other surface. .

According to a fourth aspect of the present invention, there is provided the contact probe device according to the second or third aspect, wherein the printed board has a mounting hole through which a mounting screw for mounting to the probe guide mechanism can be inserted, and a probe. A positioning fitting portion which can be fitted to the positioning projection provided in the guide mechanism is formed.

According to a fifth aspect of the present invention, there is provided a circuit board inspection apparatus, wherein the contact probe device according to any one of the first to fourth aspects, an inspection means, a probe guide mechanism, and a conductor pattern as a guide mechanism side electrode are formed. And a connection cable for connecting the inspection means and the electrode on the guide mechanism side to each other.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of a contact probe device and a circuit board inspection device according to the present invention will be described below with reference to the accompanying drawings.

As shown in FIG. 1, the circuit board inspection apparatus S includes a probe guide mechanism PM1 on which a printed circuit board 8 for mounting the probe unit 1 is disposed, and a probe unit 1 corresponding to a contact probe apparatus according to the present invention. And

As shown in FIG. 1, the probe unit 1 includes a probe holder 4, contact probes 7, 7 corresponding to the probe of the present invention, and signal cables W1, W1 corresponding to the connection cable of the present invention. The probe guide mechanism P is controlled by one mounting screw S1.
It is fixed to M1. The probe holding unit 4 corresponds to a probe holding unit in the present invention, and as shown in FIG.
A printed board 2 and a base 3 are provided.

The printed board 2 has a probe guide mechanism PM
1 and has a function of connecting and fixing the base part 3 and a function of relaying the signal cables W1 and W1, and as shown in FIG. 4A, is constituted by a thick multilayer board. On the front surface 2a, connection patterns 11a and 11b corresponding to the conductor pattern as the holding means side electrode in the present invention and to which the signal cables W1 and W1 are soldered, and the shield pattern 12 are formed. FIG. 2 (b)
As shown in FIG. 3, connection patterns 13a and 13b corresponding to conductor patterns as holding means-side electrodes in the present invention.
And a shield pattern 14 are formed. In this case, between the connection patterns 11a and 13a, between the connection patterns 11b and 13b, and between the shield patterns 12 and 14.
The spaces are electrically connected to each other by an inner conductor pattern (not shown). Further, the printed circuit board 2 has a mounting hole 15 through which a mounting screw S1 for fixing to the probe guide mechanism PM1 can be inserted, positioning holes 16 and 16 corresponding to a positioning fitting portion in the present invention, Base part 3
And fixing holes 17, 17 through which fixing screws S 2, S 2 (see FIG. 3) for connecting and fixing are connected to each other from the front surface 2 a to the back surface 2 b.

As shown in FIG. 3, the base portion 3 is entirely formed of an insulating resin, and has screw holes 21 and 21 for connecting and fixing to the printed circuit board 2 on its front surface 3a. Side 3 to which 7, 7 is fixed
Screw holes 22 and 22 are formed in b and 3c, respectively, where the fixing screws S3 and S3 can be screwed. On the other hand, the contact probe 7 includes a holder 5 to be attached to the base 3 and a probe pin 6. Holder 5
Is a mounting hole 2 through which fixing screws S3 and S3 can be inserted.
A fixing groove 5 for fixing the probe pin 6 and connecting the arms 5b and 5c so as to be able to move up and down relatively to the fixing part 5a is formed. And a head section 5d, which constitutes a four-bar rotating link mechanism as a whole. The probe pin 6
Is fixed to the holder 5 by being press-fitted into the fixing groove 24, and a signal cable W1 (FIG.
) Is connected by a conductive adhesive.
In this case, the other ends of the signal cables W1 and W1 are connected to the connection patterns 11a and 11b of the printed circuit board 2 as shown in FIG.
11b.

On the other hand, the probe guide mechanism PM1 is made of metal as a whole, and as shown in FIG. 5, a screw hole 31 capable of screwing the mounting screw S1 is formed in the mounting portion of the probe unit 1, as shown in FIG. Above and below the screw holes 31, positioning pins 32, 32, which correspond to positioning protrusions in the present invention and can be inserted into the positioning holes 16, 16 of the printed circuit board 2, are provided upright.
Further, on the upper right side, screw holes 33, 33 for mounting the printed circuit board 8 of a multilayer board are formed. The printed board 8 attached to the probe guide mechanism PM1 is different from the printed board 2 only in the thickness.
The pattern arrangement and the positions where the various holes are formed are identical. As shown in FIG. 6A, connection patterns 41a and 41b corresponding to a conductor pattern as a guide mechanism side electrode in the present invention and a shield pattern 42 are formed on the front surface 8a, and the back surface thereof is formed. 8b, connection patterns 43a and 43b for soldering the signal cables W2 and W2 and a shield pattern 44 are formed as shown in FIG. In this case, between the connection patterns 41a, 43a, the connection patterns 41b,
43b and between the shield patterns 42 and 44 are electrically connected to each other by an inner conductor pattern (not shown). Further, as shown in FIG. 5, the mounting hole 45 through which the mounting screw S1 can be inserted, and the positioning holes 46 through which the positioning pins 32 of the probe guide mechanism PM1 can be inserted. And fixing holes 47, 47 through which fixing screws S4, S4 for fixing to the probe guide mechanism PM1 can be inserted.

Next, a method of assembling the probe unit 1 and a method of attaching the probe unit 1 to the probe guide mechanism PM1 will be described.

When assembling the probe unit 1,
First, the contact probe 7 is manufactured by press-fitting the probe pin 6 into the fixing groove 24 of the head 5d of the holder 5. Next, the mounting holes 23 of the holder 5,
The two contact probes 7, 7 are fixed to the base 3 by screwing the fixing screws S3, S3 inserted through the screw holes 23, 22 into the screw holes 22, 22 of the base 3. Then
The fixing screws S2 and S2 are inserted through the fixing holes 17 and 17 from the front surface 2a side of the printed circuit board 2 and screwed into the screw holes 21 and 21 of the base portion 3 so that the printed circuit board 2
And the base part 3 are connected and fixed. Subsequently, one ends of the signal cables W1 and W1 are connected to the rear ends 6b of the probe pins 6 and 6, respectively.
After each of the signal cables W1 and W1 is connected to the connection patterns 11a and 11b of the printed circuit board 2 by soldering, respectively. As a result, the contact probes 7, 7 are fixed to the probe holding unit 4, and the probe pins 6, 6 are connected to the connection pattern 1.
The probe unit 1 is electrically connected to the probe units 3a and 13b.
Is completed.

Next, when attaching the probe unit 1 to the probe guide mechanism PM1, as shown in FIG.
The printed circuit board 8 is fixed to the probe guide mechanism PM1 in advance. In this case, one end of each of the signal cables W2 and W2 is soldered to the connection patterns 43a and 43b, and then the positioning pins 32 and 32 of the probe guide mechanism PM1 are inserted into the positioning holes 46 and 46. The printed board 8 is attached to the probe guide mechanism PM1. Next, the printed circuit board 8 is fixed to the probe guide mechanism PM1 by inserting the fixing screws S4, S4 into the fixing holes 47, 47 and screwing them into the screw holes 33, 33. Then
The other ends of the signal cables W2 and W2 (not shown) are connected to an inspection unit corresponding to an inspection unit in the present invention. In this state, the shield pattern 44 of the printed circuit board 8 comes into close contact with the probe guide mechanism PM1, and as a result, the shield pattern 42
Are electrically connected to the ground potential.

Next, when mounting the probe unit 1, the positioning pins 32, 32 are inserted into the positioning holes 16,
16, the probe unit 1 is mounted on the probe guide mechanism PM1, and then the mounting screws S
1 is inserted into the screw hole 31 through the mounting hole 15 of the printed circuit board 2.
Screw. At this time, the connection pattern 13a of the printed circuit board 2 and the connection pattern 41 of the printed circuit board 8 are connected.
a makes surface contact, and the connection pattern 13b and the connection pattern 41b make surface contact, and are electrically connected to each other. Similarly, shield patterns 14 and 4
2 are in surface contact and the positioning holes 4 of the printed circuit board 8 are
6 is in surface contact with the surface of the probe guide mechanism PM1, so that the shield patterns 12, 14, 42, 44 are electrically connected to the ground potential of the probe guide mechanism PM1. Thereby, the mounting operation of the probe unit 1 is completed. In this state, the connection patterns 11a, 1
An inner conductor pattern connecting between 3a and an inner conductor pattern connecting between the connection patterns 11b and 13b are sandwiched by the shield patterns 12 and 14, and an inner conductor pattern connecting between the connection patterns 41a and 43a, and a connection. Since the inner conductor pattern connecting between the use patterns 41b and 43b is sandwiched between the shield patterns 42 and 44, the mixing of noise into the signal detected by the probe pin 6 is effectively prevented.

When replacing the probe unit 1 already mounted on the probe guide mechanism PM1,
By loosening one mounting screw S1, the probe unit 1 can be quickly and easily removed from the probe guide mechanism PM1. Next, the probe unit 1 is replaced with a new probe unit 1 and the mounting screw S1 is screwed. Thereby, the replacement operation of the probe unit 1 is completed. Thus, in the probe unit 1, the signal cable W
By exchanging by unit including W1, W1,
The replacement work of the probe unit 1 can be completed quickly and easily. Further, the positioning pins 32, 32 are fitted into the positioning holes 16 so that the printed circuit board 2 is formed.
Can be accurately positioned at a predetermined mounting position and the rotation of the probe unit 1 can be prevented, so that the conventional probe unit 51 which needs to be screwed with two mounting screws is used.
The probe unit 1 can be easily attached and detached in a short time as compared with the case of FIG.

The present invention is not limited to the configuration shown in the embodiment of the present invention. For example, in the embodiment of the present invention, an example in which a printed circuit board is used as a part of the probe holding means in the present invention has been described, but the probe holding means has, for example, a metal piece embedded as a holding means side electrode. Then, the base portion 3 can be configured to be attachable to the probe guide mechanism PM1 by insert molding. Similarly, the configuration of the guide mechanism-side electrode can be appropriately changed as long as the electrode to which the holding means-side electrode can contact is provided in the probe guide mechanism PM1. Further, the holding means side electrode is not limited to a multilayer substrate, and may be a single-layer double-sided substrate. In this case, an insulating layer such as an insulating sheet may be provided on the front and back surfaces of the double-sided substrate, and the surface of the insulating layer may be shielded by attaching a shield sheet or the like. Furthermore, the connection of the connection cable to the holding means side electrode is not limited to soldering, and may be a method of connecting using a connector.

Further, in the embodiment of the present invention, the example in which the printed circuit board 8 is fixed to the probe guide mechanism PM1 by the fixing screws S4 and S4 has been described, but the fixing screws S4 and S4 are not necessarily required. For example, the positioning pins 32, 32 are positioned in the positioning holes 46, 46, 16,
The printed circuit boards 8 and 2 inserted into the printed circuit board 16 may be fixed together with the mounting screws S1. Further, the probe in the present invention is not limited to the shape of the contact probe 7, but can be formed in any shape such as an independent pin type probe. In the embodiment of the present invention,
Although the configuration including the pair of contact probes 7 has been described, the number of probes in the present invention is not limited to this, and one or three or more contact probes 7 are provided.
The (probe) may be fixed to the base 3. In this case, the number of the holding means-side electrodes according to the present invention is arranged according to the number of the contact probes 7 (probes).

[0029]

As described above, according to the contact probe device of the first aspect, connection is achieved by attaching the contact probe device to the probe guide mechanism so that the holding means side electrode and the guide mechanism side electrode are in contact with each other. Since the probe can be electrically connected to the inspection means via the connection cable without removing or routing the cable for use, the probe can be replaced quickly and easily.

Further, according to the contact probe device of the present invention, since the holding means side electrode is formed by the conductor pattern of the printed circuit board, compared with the case where the holding means side electrode is formed by a metal piece or the like, Since the connection of the connection cable is easy and the function as a member for fixing to the probe guide mechanism can also be used, the manufacturing cost of the contact probe device can be reduced.

Further, according to the contact probe device of the third aspect, since the shield pattern is formed on the printed circuit board, it is possible to prevent noise from being mixed into the detection signal of the probe.

According to the contact probe device of the fourth aspect, the mounting hole and the positioning fitting portion are formed on the printed circuit board, so that the positioning when fixing the contact probe device to the probe guide mechanism can be performed. Easy,
In addition, for example, the contact probe device can be attached to the probe guide mechanism using a single attachment screw, so that the contact probe device can be fixed to the probe guide mechanism more quickly and easily.

Further, according to the circuit board inspection apparatus of the fifth aspect, it is possible to provide a circuit board inspection apparatus which is easy to perform maintenance and inspection.

[Brief description of the drawings]

FIG. 1 shows a probe unit 1 according to an embodiment of the present invention.
FIG. 5 is an external perspective view of a state where the device is attached to a probe guide mechanism PM1.

FIG. 2 shows a probe unit 1 and a probe guide mechanism PM1.
FIG. 2 is an external perspective view of a state in which the and are separated.

FIG. 3 is an exploded perspective view of the probe unit 1. FIG.

4A is an external perspective view of the printed circuit board 2 viewed from a front surface 2a side, and FIG. 4B is an external perspective view of the printed circuit board 2 viewed from a back surface 2b side.

FIG. 5 shows a probe guide mechanism P according to an embodiment of the present invention.
FIG. 3 is an external perspective view of a state in which a printed circuit board 8 is separated from M1.

6A is an external perspective view of the printed circuit board 8 as viewed from the front surface 8a side, and FIG. 6B is an external perspective view of the printed circuit board 8 viewed from the back surface 8b side.

FIG. 7 is an external perspective view of a state in which a conventional probe unit 51 is attached to a probe guide mechanism PM11.

FIG. 8 is an exploded perspective view of the probe unit 51.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Probe unit 2 Printed circuit board 3 Base part 4 Probe holding part 5 Holder 6 Probe pin 7 Contact probe 8 Printed circuit board 11a, 11b, 13a, 13b Connection pattern 12, 14 Shield pattern 15 Mounting hole 16 Positioning hole 32 Positioning hole Pins 41a, 41b, 43a, 43b Connection pattern 42, 44 Shield pattern 45 Mounting hole 46 Positioning hole PM1 Probe guide mechanism S Circuit board inspection device W1, W2 Signal cable

Claims (5)

[Claims] 1. A probe comprising a probe holding means for holding a contact type probe and being detachably fixed to a probe guide mechanism, wherein one end of a connection cable electrically connected to the other end of the probe is connected to the probe. In the connected contact probe device, the probe holding unit includes a holding unit side electrode to which the other end of the connection cable is connected, and the holding unit side electrode is provided in the probe guide mechanism. A contact probe device which is configured to be able to contact a guide mechanism side electrode electrically connected to the inspection means. 2. The contact probe device according to claim 1, wherein said probe holding means includes a printed circuit board on which a conductor pattern is formed as said holding means-side electrode. 3. The printed board is formed of a multilayer board, on one surface of which a conductor pattern is formed as the holding means side electrode to which the one end of the connection cable is connected, and on the other surface, A conductor pattern as the holding unit side electrode that contacts the guide mechanism side electrode is formed, and an inner layer thereof is formed with an inner layer conductor pattern as the holding unit side electrode that connects the two conductor patterns to each other.
3. The contact probe device according to claim 2, wherein a shield pattern for shielding the inner conductor pattern is formed on at least one of the one surface and the other surface. 4. A mounting hole through which a mounting screw for mounting to the probe guide mechanism can be inserted in the printed circuit board, and a positioning hole which can be fitted into a positioning projection provided in the probe guide mechanism. The contact probe device according to claim 2, wherein a contact fitting portion is formed. 5. The contact probe device according to claim 1, wherein said inspection means, said probe guide mechanism, and a conductor pattern as said guide mechanism side electrode are formed, and said probe holding means is provided. A circuit board inspection apparatus, comprising: a printed board to be attached; and a connection cable for connecting the inspection means and the guide mechanism side electrode to each other.