JPH11242065A - Wiring substrate inspection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To facilitate handling and improve workability even in the case where a number of inspection parts exits, by constituting an electrical conductive path derived from a pattern contact of an electrically conductive wiring substrate. SOLUTION: The inspection device inspects a wiring pattern P formed on a wiring substrate to be inspected S such as a printed wring substrate or the like in which the electronic device of a semiconductor chip or the like is mounted, and the inspection result is displayed on an inspection device D. A flat plate-like holding member 10 having substatially the same size as the wiring substrate S being the inspection object, and an electrically conductive wiring substrate 20 making a further larger flat plate than the holding member 10, are provided. An electrically conductive path derived from a pattern contact 30 is constituted of the electrically conductive wiring substrate 20. A through hole 22 is formed at a position corresponding to the mounting hole 11 of the holding member 10 on the electrically conductive wiring substrate 20, and an electrically conductive terminal 23 is disposed at the part of a surface side opposite to the holding member 10 in the through hole 22.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board inspecting apparatus for inspecting an energized state of a wiring pattern by bringing a pattern contact into contact with a wiring pattern formed on the wiring board to be inspected.

[0002]

2. Description of the Related Art Substrates and printed wiring boards for mounting electronic devices such as semiconductor chips (tested wiring boards)
In, a wiring pattern of a predetermined shape is formed, and a plurality of electronic devices are interconnected by this wiring pattern.

In this type of wiring board, it is important that there is no break in the wiring pattern and that there is no short circuit in an unnecessary portion of the wiring pattern in order to ensure the quality of the electronic equipment to be applied. There is no lack of a process of checking the quality of the product.

Conventionally, an inspection apparatus for inspecting such a wiring pattern has been made of a conductive material such as brass plated with tin or gold, or a number of patterns made of a durable noble metal such as platinum. The one in which a contact is fixedly installed on a holding frame and a lead wire is extended from each pattern contact is applied.

In this prior art, a voltage is applied between arbitrary pattern contacts via respective lead wires in a state where the tip of each pattern contact is in contact with a predetermined inspection point of the wiring pattern. On the basis of the energization state between these pattern contacts, electrical inspections such as insulation, continuity, short circuit, disconnection, etc., between inspection locations in the wiring pattern are inspected.

[0006]

In the current situation where further miniaturization, weight reduction and multifunctionalization of electronic devices are required, it is necessary to mount a large number of electronic devices on a wiring board at a high density. As a result, the wiring pattern for interconnecting these electronic devices becomes finer, and the number of inspection locations increases significantly.

In the market, there is a tendency to reduce the number of products and the number of products, so that it is necessary to prepare a wiring board for each electronic device of a different type. And various types with different line intervals.

In such a situation, first, when inspecting a wiring board having a fine wiring pattern, according to the above-mentioned prior art, a large number of lead wires corresponding to the number of inspection points are provided near the wiring board. Will be extended,
Specifically, in the case of a wiring board that requires inspection at several hundred locations, hundreds of lead wires will be extended very close to the wiring board, and the handling becomes extremely complicated, and the workability is greatly increased. There is a possibility that it will have an effect.

On the other hand, when many types of wiring boards are to be inspected, in the above-described prior art, an inspection apparatus provided with pattern contacts and lead wires by the number corresponding to the type of wiring pattern is prepared, and the inspection is performed. Each time, it is necessary to select a corresponding inspection device from among them to perform the inspection, which not only complicates the inspection work, but also significantly increases the number of pattern contacts to be maintained and managed, resulting in a large running cost. Would lead to a significant increase.

The present invention has been made in view of the above circumstances, and has as its object to provide a wiring board inspection apparatus which can be easily handled even when the number of inspection locations is large and which can improve workability. And

Another object of the present invention is to provide a wiring board inspection apparatus capable of reducing running costs even when many types of wiring boards having different wiring patterns are to be inspected.

[0012]

According to the first aspect of the present invention, a wiring pattern is formed by contacting a pattern contact with a wiring pattern formed on a wiring board to be tested to check a current-carrying state of the wiring pattern. In the board inspection device, the conductive path derived from the pattern contact is formed by a conductive wiring board.

According to the second aspect of the present invention, as the conductive wiring board, a conductive terminal is provided on a front surface thereof for contacting the pattern contact, and a conductive wiring pattern is provided on a back surface thereof. The conductive terminal and the conductive wiring pattern are connected to each other through the interposition.

According to a third aspect of the present invention, the apparatus further comprises a holding member that holds the pattern contact and that is detachably attached to the conductive wiring board.

According to the fourth aspect of the present invention, the pattern contact is detachably mounted on the holding member.

In the invention described in claim 5, the pattern contact contacts a contact terminal that contacts a wiring pattern formed on the test wiring board and a conductive wiring pattern that is formed on the conductive wiring board. A connection terminal and a contact body for detachably connecting the contact terminal and the connection terminal are provided.

According to the sixth aspect of the present invention, a wiring board inspection is carried out in which a pattern contact is brought into contact with each of the wiring patterns formed on a plurality of wiring boards to be tested to check the energization state of the wiring patterns. In the apparatus, a plurality of holding members for detachably holding the pattern contact according to each wiring pattern formed on the plurality of wiring boards to be tested, and a corresponding holding member are detachably arranged, and the holding is performed. A plurality of conductive wiring boards constituting conductive paths derived from the pattern contacts held by the member are provided.

[0018]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the drawings showing one embodiment. FIG. 1 conceptually shows one embodiment of a wiring board inspection apparatus according to the present invention. The inspection apparatus exemplified here targets a wiring pattern P formed on a wiring board S to be tested such as a substrate or a printed wiring board on which an electronic device such as a semiconductor chip is mounted, and sends the inspection result to an inspection device D. A flat holding member 10 for displaying and having substantially the same size as the substrate S to be inspected, and a conductive wiring board 2 having a flat plate shape larger than the holding member 10
0.

The holding member 10 comprises a first insulating plate 10a and a second insulating plate 10b, each formed of a relatively hard member having an insulating property, which are detachably joined to each other. In addition to having mounting holes 11 at a plurality of locations facing the wiring pattern P formed at the same time, a pin fitting hole 12 is provided at an appropriate location. The mounting hole 11 is for holding a pattern contact 30 described later in a detachable manner, and includes a large-diameter portion 11a formed at a joint between the first insulating plate 10a and the second insulating plate 10b, and a first insulating plate 10a. And second insulating plate 1
0b, a pair of small-diameter portions 11b opened on each outer surface, and a pair of tapered portions 11c connecting the large-diameter portion 11a and the small-diameter portion 11b to each other. The pin fitting hole 12 is formed so as to penetrate the first insulating plate 10a and the second insulating plate 10b, and the positioning pin 13 is fitted and held in each of the holes.

Reference numeral 10c shown in FIG. 1 denotes a holding frame for holding the holding member 10.

The conductive wiring board 20 is formed of a relatively hard member having an insulating property, similarly to the above-described holding member 10, and is formed at a portion of the holding member 10 opposed to the pin fitting hole 12. It has pin fitting holes 21, and the positioning pins 13 are fitted into each of the pin fitting holes 21, so that the holding members 10 are arranged in parallel to each other at a portion facing the second insulating plate 10 b.

As is apparent from the drawing, through holes 22 are formed in the conductive wiring board 20 at portions corresponding to the mounting holes 11 of the holding member 10, respectively. The conductive terminals 23 are arranged on the front surface side facing the surface 10, while individual conductive wiring patterns 24 are formed on the rear surface side portion of the through hole 22. The conductive terminals 23 are each formed of a conductive material, and
0 has a larger diameter than the mounting hole 11. The conductive wiring pattern 24 individually forms a conductive path from each through hole 22 to the above-described inspection device D, and is connected to a lead wire L extending from the inspection device D at an end of the conductive wiring substrate 20. It is connected. Here, the conductive wiring board 20 is not limited to the structure of this embodiment, but may be one in which the conductive wiring pattern 24 is formed through the through hole 22 to the surface side.

The holding member 10 and the conductive wiring board 20 have the same positions and numbers of the mounting holes 11 and the positions and the numbers of the conductive terminals 23 and the conductive wiring patterns 24.
Each of them is an individual one corresponding to the wiring pattern P formed on the substrate S, and a plurality of pairs corresponding to the number of the substrates S to be inspected are prepared.

On the other hand, the inspection device is a
0 is provided. As shown in FIG. 2, the pattern contact 30 has a hollow cylindrical shape, and has a contact body 32 having insertion holes 31 at both end surfaces thereof, and a pressing spring 33 interposed therebetween. A pair of cylindrical movable pieces 34 movably fitted inside the contact body 32;
4 that is provided with a contact terminal 35 and a connection terminal 36 which are detachably attached to each other, protrude to the outside through the insertion hole 31 of the contact body 32, and each end has a smaller diameter toward the end. , And both are formed of a conductive material.

As shown in FIG. 1, this pattern contact 3
0 has a length such that the contactor main body 32 is sandwiched between the tapered portions 11c in the large-diameter portion 11a of the mounting hole 11 when disposed inside the mounting hole 11 of the holding member 10 described above; In addition, the contact terminal 35 and the connection terminal 36 each have a length protruding outside through the small-diameter portion 11b.

As the structure for detachably attaching the contact terminal 35 and the connection terminal 36 to the movable piece 34, for example, the structure illustrated in FIG. 3 or the structure illustrated in FIG. 4 can be applied.

That is, in the structure illustrated in FIG. 3, a pair of protrusions 35a 'and 36a' are formed on the outer peripheral surface of the base end of the contact terminal 35 'and the connection terminal 36', while the movable piece 3
A pair of insertion grooves 3 along the axial direction is formed in the center hole 34a 'of the 4'.
4b 'and an annular groove 34 communicating with the insertion groove 34b'
c '.

In the structure illustrated in FIG. 3, for example, when the contact terminal 35 'is mounted on the moving piece 34', the base 35 of the contact terminal 35 'is fitted with its projection 35a' in alignment with the insertion groove 34b '. The end is the center hole 34a 'of the moving piece 34'.
When the projection 35a 'reaches the annular groove 34c', the contact terminal 35 'may be rotated by a predetermined angle with respect to the moving piece 34'.
When removing 5 ', the contact terminal 35' is
4 ', and when the projection 35a' coincides with the insertion groove 34b ', the contact terminal 35' is moved to the movable piece 3 '.
You just have to pull it out of 4 '.

On the other hand, in the structure illustrated in FIG. 4, the male screw 3 is attached to the outer peripheral surface of the base end of the contact terminal 35 ″ and the connection terminal 36 ″.
5a "and 36a" are formed, while a female screw 34b "is formed in the center hole 34a" of the moving piece 34 ".

In the structure illustrated in FIG. 4, for example, when the contact terminal 35 "is mounted on the moving piece 34", the male screw 35a "may be screwed into the female screw 34b" of the moving piece 34 ". Conversely, the moving piece 34 "to the contact terminal 35"
To remove the contact terminal 3 against the moving piece 34 ".
5 "may be appropriately rotated to release the female screw 34b" and the male screw 35a "that are screwed together.

When the structure shown in FIGS. 3 and 4 is applied, the rotation of the movable pieces 34 ', 34 "with respect to the contact body 32 is restricted.
4 ', 34 "must be moved in the longitudinal direction of the contact body 32.

When inspecting the wiring pattern P of the substrate S shown in FIG. 1 by applying the inspection apparatus configured as described above, first, the holding member 10 and the conductive wiring corresponding to the wiring pattern P are inspected. The substrate 20 is selected, and the pattern contacts 30 are respectively inserted into the mounting holes 11 of the holding member 10.
Attach.

From this state, only the holding member 10 is positioned and arranged with respect to the substrate S via the holding frame 10c, and the tip of the contact terminal 35 of each pattern contact 30 is opposed to the wiring pattern P.

Next, the positioning pins 13 protruding from the holding member 10 are fitted in the pin fitting holes 21 of the conductive wiring board 20 to position them, that is, the pattern contacts held in the mounting holes 11 of the holding member 10. The 30 connection terminals 36 are held in contact with the conductive terminals 23 of the conductive wiring board 20, respectively.

Further, at the end of the conductive wiring board 20, the corresponding lead wire L of the inspection device D is connected to the conductive wiring pattern 24 formed on the back surface thereof, and the substrate is connected to the contact terminal 35 of the pattern contact 30. If a predetermined voltage is sequentially applied between the pattern contacts 30 to be inspected in a state where the S wiring pattern P is in contact with each other, the inspection points in the wiring pattern P are Is displayed on the display.

During the operation described above, according to the inspection apparatus, regardless of the number of inspection locations, the substrate S
Only the holding member 10 and the conductive wiring board 20 are arranged in the vicinity of the substrate S, and there is no need to handle a large number of lead wires L in accordance with the number of inspection locations in the vicinity of the substrate S. This can be performed very easily.

In addition, according to the above-described inspection apparatus, the holding member 10 and the conductive wiring board 20 may be separately arranged on the substrate S. The inspection work of the straight S is further facilitated.

Further, a pressing spring 33 is interposed between the contact terminal 35 that contacts the wiring pattern P of the substrate S and the connection terminal 36 that contacts the conductive terminal 23 of the conductive wiring board 20. Therefore, this pressing spring 3
By appropriately selecting the spring constant of No. 3, the damage between the substrate S and the wiring substrate 20 for conduction is not caused, and the number of contact terminals 35 and the wiring pattern P of the substrate S and the number of connection terminals are reduced. 36 and the conductive terminals 23 of the conductive wiring board 20 can be reliably brought into contact with each other, and the reliability of the display result displayed on the inspection device D can be sufficiently ensured.

On the other hand, as shown in FIG. 5, when an inspection is performed on a substrate S 'having a wiring pattern P different from that of the substrate S shown in FIG. 1, the holding member 10 shown in FIG. Instead of the conductive wiring board 20, a holding member 10 'and a conductive wiring board 20' corresponding to the wiring pattern P 'are selected, that is, a holding member having a mounting hole 11' at a portion corresponding to the wiring pattern P '. A member 11 ';
A through hole 22 'is provided at a position corresponding to the wiring pattern P'.
And a conductive terminal 2 on the surface side of the through hole 22 '.
3 'and a conductive wiring board 2 having a conductive wiring pattern 24' on the back side of the through hole 22 '.
0 'is selected, the pattern contacts 30 are mounted in the mounting holes 11' of the holding member 10 ', and the above-described operation is repeated.

In this case, as the pattern contact 30,
1 can be used, that is, a plurality of holding members 10, 10 having mounting holes 11, 11 'at different positions according to the wiring patterns P, P'. , A common pattern contact 30 can be applied to the substrate, so that many types of substrates S, S 'having different wiring patterns P, P' from each other can be used.
In the case of inspection, the holding members 10 and 10 'and the conductive wiring boards 20 and 20' may be prepared, and the running cost is not significantly increased.

Even when the same holding member 10 and the conductive wiring board 20 are applied, the number of the pattern contacts 30 mounted on the mounting holes 11 of the holding member 10 can be increased or decreased as needed to obtain the wiring pattern P. It is also possible to inspect different wiring boards.

[0042]

As described above, according to the present invention,
Since it is not necessary to handle a large number of lead wires in the vicinity of the wiring board to be tested, the handling becomes extremely easy, and the inspection work of the wiring board to be tested can be easily performed.

In this case, if the holding member for holding the pattern contact is configured to be detachable from the conductive wiring board,
The holding member and the conductive wiring board can be separately arranged on the wiring board to be tested, and the handling thereof can be further facilitated.

Further, if the pattern contacts are removably provided to the holding member, the pattern contacts can be appropriately attached and detached, whereby an inspection apparatus for a wiring board having a different wiring pattern can be constituted. Thus, various types of wiring boards can be inspected without increasing running costs.

Further, according to the present invention, a holding member and a conductive wiring board are prepared for each wiring board having a different wiring pattern, and the pattern contacts are detachably held on each holding member. As a result, the pattern contacts can be shared by the plurality of holding members, and even when inspecting various types of wiring boards having different wiring patterns from each other, an increase in running costs can be suppressed as much as possible. Becomes

[Brief description of the drawings]

FIG. 1 is a sectional view of a principal part conceptually showing an embodiment of a wiring board inspection apparatus according to the present invention.

FIG. 2 is a sectional view conceptually showing a pattern contact applied to the wiring board inspection apparatus shown in FIG.

FIG. 3 is an exploded perspective view of a main part conceptually showing a pattern contact applied to the wiring board inspection apparatus shown in FIG. 1;

FIG. 4 is an exploded perspective view of a main part conceptually showing a modified example of the pattern contact applied to the wiring board inspection apparatus shown in FIG. 1;

FIG. 5 is a cross-sectional view of an essential part showing an inspection apparatus for inspecting a wiring board having a different wiring pattern from the wiring board inspection apparatus shown in FIG. 1;

[Explanation of symbols]

10, 10 ': holding member, 13: positioning pin, 20,
20 ': conductive wiring board, 22, 22': through hole, 23, 23 ': conductive terminal, 24, 24': conductive wiring pattern, 30: pattern contact, 32: contact body, 35: contact Terminals, 36 ... connection terminals, P, P '... wiring patterns, S, S' ... wiring boards to be tested.

Claims (6)

[Claims] 1. A wiring board inspection apparatus configured to inspect a conduction state of a wiring pattern by bringing a pattern contact into contact with a wiring pattern formed on a wiring board to be inspected. A wiring board inspection apparatus, wherein the conductive path is formed by a conductive wiring board. 2. The conductive wiring board includes a conductive terminal on a surface thereof, which is in contact with the pattern contact, a conductive wiring pattern on a back surface thereof, and further includes a conductive terminal through a through hole. 2. The wiring board inspection apparatus according to claim 1, wherein the conductive wiring patterns are connected to each other. 3. The wiring board inspection apparatus according to claim 1, further comprising a holding member that holds the pattern contact and that is detachably attached to the conductive wiring board. . 4. The wiring board inspection device according to claim 3, wherein the pattern contact is detachably mounted on the holding member. 5. The pattern contact includes: a contact terminal that contacts a wiring pattern formed on the test wiring board; a connection terminal that contacts a conductive wiring pattern formed on the conductive wiring board; The wiring board inspection apparatus according to any one of claims 1 to 4, further comprising a contact body for detachably connecting the connection terminals. 6. A wiring board inspection apparatus wherein a pattern contact is brought into contact with each wiring pattern formed on a plurality of wiring boards to be tested to check an energized state of the wiring pattern. A plurality of holding members for detachably holding the pattern contacts according to the respective wiring patterns formed on the inspection wiring board; and a pattern contact holding the corresponding holding members detachably and holding the holding members. A wiring board inspection device, comprising: a plurality of conductive wiring boards that form conductive paths derived from the terminals.