TWI822901B - 洗淨模組以及具備洗淨模組之基板處理裝置 - Google Patents

洗淨模組以及具備洗淨模組之基板處理裝置 Download PDF

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Publication number
TWI822901B
TWI822901B TW108140562A TW108140562A TWI822901B TW I822901 B TWI822901 B TW I822901B TW 108140562 A TW108140562 A TW 108140562A TW 108140562 A TW108140562 A TW 108140562A TW I822901 B TWI822901 B TW I822901B
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TW
Taiwan
Prior art keywords
substrate
roller
cleaning
edge
polishing
Prior art date
Application number
TW108140562A
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English (en)
Chinese (zh)
Other versions
TW202027867A (zh
Inventor
水野稔夫
檜森洋輔
馬場枝里奈
石橋知淳
小畠厳貴
Original Assignee
日商荏原製作所股份有限公司
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Application filed by 日商荏原製作所股份有限公司 filed Critical 日商荏原製作所股份有限公司
Publication of TW202027867A publication Critical patent/TW202027867A/zh
Application granted granted Critical
Publication of TWI822901B publication Critical patent/TWI822901B/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/50—Cleaning of wafers, substrates or parts of devices characterised by the part to be cleaned
    • H10P70/54—Cleaning of wafer edges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3202—Mechanical details, e.g. rollers or belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW108140562A 2018-11-16 2019-11-08 洗淨模組以及具備洗淨模組之基板處理裝置 TWI822901B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018215456A JP7265858B2 (ja) 2018-11-16 2018-11-16 洗浄モジュール、洗浄モジュールを備える基板処理装置と洗浄方法
JP2018-215456 2018-11-16

Publications (2)

Publication Number Publication Date
TW202027867A TW202027867A (zh) 2020-08-01
TWI822901B true TWI822901B (zh) 2023-11-21

Family

ID=70730502

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108140562A TWI822901B (zh) 2018-11-16 2019-11-08 洗淨模組以及具備洗淨模組之基板處理裝置

Country Status (7)

Country Link
US (1) US12033847B2 (https=)
JP (1) JP7265858B2 (https=)
KR (1) KR102778937B1 (https=)
CN (1) CN113165142B (https=)
SG (1) SG11202105091PA (https=)
TW (1) TWI822901B (https=)
WO (1) WO2020100609A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12138732B2 (en) 2020-12-14 2024-11-12 Applied Materials, Inc. Polishing system apparatus and methods for defect reduction at a substrate edge
CN112976266A (zh) * 2021-03-04 2021-06-18 王仕英 一种陶瓷生产用胚体修复装置
JP7623225B2 (ja) * 2021-06-11 2025-01-28 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置
CN116689340B (zh) * 2022-02-28 2026-01-23 秦皇岛烟草机械有限责任公司 一种浸渍器端盖用维护装置及其控制方法
CN114887976B (zh) * 2022-05-25 2024-01-23 宁波芯丰精密科技有限公司 一种清洁装置
CN119609909B (zh) * 2024-08-06 2026-03-24 浙江创芯集成电路有限公司 晶圆研磨装置以及晶圆研磨设备

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010040943A (ja) * 2008-08-07 2010-02-18 Tokyo Electron Ltd 基板洗浄装置及び基板洗浄方法
JP2018113393A (ja) * 2017-01-13 2018-07-19 株式会社ディスコ ウエーハ洗浄装置

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DE2415580A1 (de) 1974-03-30 1975-10-02 Schleifenbaum & Steinmetz Verfahren zum reinigen von blechen und reinigungsmaschine zur durchfuehrung des verfahrens
JP3030796B2 (ja) * 1992-07-24 2000-04-10 東京エレクトロン株式会社 洗浄処理方法
US5861066A (en) 1996-05-01 1999-01-19 Ontrak Systems, Inc. Method and apparatus for cleaning edges of contaminated substrates
JP3577173B2 (ja) * 1996-09-09 2004-10-13 昭和電工株式会社 ディスク基板の洗浄ユニット及び連続洗浄装置
JPH10335279A (ja) 1997-05-30 1998-12-18 Shibaura Eng Works Co Ltd 洗浄装置
JP4843167B2 (ja) 2001-09-20 2011-12-21 株式会社東芝 ローラ清掃装置
JP2003151925A (ja) 2001-11-12 2003-05-23 Yac Co Ltd ウェーハエッジ研磨処理装置
JP2003151943A (ja) 2001-11-19 2003-05-23 Speedfam Clean System Co Ltd スクラブ洗浄装置
JP2003317703A (ja) 2002-04-24 2003-11-07 Sony Corp 電池およびその製造方法
JP3933670B2 (ja) * 2005-03-29 2007-06-20 東京エレクトロン株式会社 基板洗浄方法及び基板洗浄装置
JP2007317703A (ja) 2006-05-23 2007-12-06 Fujifilm Corp ブラシ洗浄方法、半導体の製造方法及びブラシ洗浄装置
JP4858042B2 (ja) 2006-09-26 2012-01-18 ミツミ電機株式会社 半導体基板の洗浄方法
KR100853378B1 (ko) * 2006-10-24 2008-08-21 주식회사 케이씨텍 대면적 기판의 접촉식 세정장치
SG10201906815XA (en) * 2014-08-26 2019-08-27 Ebara Corp Substrate processing apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010040943A (ja) * 2008-08-07 2010-02-18 Tokyo Electron Ltd 基板洗浄装置及び基板洗浄方法
JP2018113393A (ja) * 2017-01-13 2018-07-19 株式会社ディスコ ウエーハ洗浄装置

Also Published As

Publication number Publication date
US20220013352A1 (en) 2022-01-13
SG11202105091PA (en) 2021-06-29
CN113165142A (zh) 2021-07-23
JP2020088000A (ja) 2020-06-04
TW202027867A (zh) 2020-08-01
CN113165142B (zh) 2023-12-22
KR20210089671A (ko) 2021-07-16
JP7265858B2 (ja) 2023-04-27
KR102778937B1 (ko) 2025-03-11
US12033847B2 (en) 2024-07-09
WO2020100609A1 (ja) 2020-05-22

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