TWI820358B - 樹脂成形方法 - Google Patents
樹脂成形方法 Download PDFInfo
- Publication number
- TWI820358B TWI820358B TW109140037A TW109140037A TWI820358B TW I820358 B TWI820358 B TW I820358B TW 109140037 A TW109140037 A TW 109140037A TW 109140037 A TW109140037 A TW 109140037A TW I820358 B TWI820358 B TW I820358B
- Authority
- TW
- Taiwan
- Prior art keywords
- resin
- chamber
- workpiece
- supplied
- nozzle
- Prior art date
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 737
- 239000011347 resin Substances 0.000 title claims abstract description 737
- 238000000465 moulding Methods 0.000 title claims description 154
- 238000000034 method Methods 0.000 title claims description 105
- 238000010438 heat treatment Methods 0.000 claims description 32
- 230000008569 process Effects 0.000 claims description 28
- 239000000758 substrate Substances 0.000 claims description 28
- 238000011049 filling Methods 0.000 claims description 12
- 238000004132 cross linking Methods 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims 2
- 239000007788 liquid Substances 0.000 abstract description 156
- 238000005516 engineering process Methods 0.000 abstract description 9
- 239000003570 air Substances 0.000 description 99
- 239000011797 cavity material Substances 0.000 description 70
- 235000012431 wafers Nutrition 0.000 description 65
- 238000007789 sealing Methods 0.000 description 63
- 238000010586 diagram Methods 0.000 description 58
- 238000000576 coating method Methods 0.000 description 40
- 239000011248 coating agent Substances 0.000 description 37
- 230000007246 mechanism Effects 0.000 description 20
- 238000001816 cooling Methods 0.000 description 11
- 230000007547 defect Effects 0.000 description 10
- 238000005520 cutting process Methods 0.000 description 8
- 238000007599 discharging Methods 0.000 description 8
- 239000000243 solution Substances 0.000 description 7
- 238000012546 transfer Methods 0.000 description 7
- 239000000428 dust Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- 230000000149 penetrating effect Effects 0.000 description 6
- 230000002093 peripheral effect Effects 0.000 description 6
- 230000001681 protective effect Effects 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 238000003860 storage Methods 0.000 description 6
- 230000006837 decompression Effects 0.000 description 5
- 239000012530 fluid Substances 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 239000012080 ambient air Substances 0.000 description 4
- 238000000748 compression moulding Methods 0.000 description 4
- 238000003384 imaging method Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- 238000013459 approach Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 230000035515 penetration Effects 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000002313 adhesive film Substances 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229910001315 Tool steel Inorganic materials 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000001464 adherent effect Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000006194 liquid suspension Substances 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
- B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/22—Component parts, details or accessories; Auxiliary operations
- B29C39/42—Casting under special conditions, e.g. vacuum
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016105600A JP6721412B2 (ja) | 2016-05-26 | 2016-05-26 | 樹脂セット方法および樹脂成形方法 |
JP2016-105543 | 2016-05-26 | ||
JP2016105543A JP6431871B2 (ja) | 2016-05-26 | 2016-05-26 | 樹脂供給方法および樹脂供給装置 |
JP2016-105600 | 2016-05-26 | ||
JP2017-032726 | 2017-02-23 | ||
JP2017032726A JP6730206B2 (ja) | 2017-02-23 | 2017-02-23 | 樹脂供給装置、樹脂供給方法および樹脂成形装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202108334A TW202108334A (zh) | 2021-03-01 |
TWI820358B true TWI820358B (zh) | 2023-11-01 |
Family
ID=60411317
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW109140035A TWI746268B (zh) | 2016-05-26 | 2017-05-18 | 樹脂供給裝置及樹脂成形裝置 |
TW109140037A TWI820358B (zh) | 2016-05-26 | 2017-05-18 | 樹脂成形方法 |
TW106116410A TWI724166B (zh) | 2016-05-26 | 2017-05-18 | 樹脂供給方法、樹脂供給裝置及樹脂封止方法 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW109140035A TWI746268B (zh) | 2016-05-26 | 2017-05-18 | 樹脂供給裝置及樹脂成形裝置 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW106116410A TWI724166B (zh) | 2016-05-26 | 2017-05-18 | 樹脂供給方法、樹脂供給裝置及樹脂封止方法 |
Country Status (2)
Country | Link |
---|---|
TW (3) | TWI746268B (ja) |
WO (1) | WO2017203888A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7258906B2 (ja) * | 2018-03-15 | 2023-04-17 | アプライド マテリアルズ インコーポレイテッド | 半導体素子パッケージ製造プロセスための平坦化 |
JP2022061238A (ja) * | 2020-10-06 | 2022-04-18 | アピックヤマダ株式会社 | 樹脂封止装置及び樹脂封止方法 |
JP7470982B2 (ja) * | 2020-11-17 | 2024-04-19 | アピックヤマダ株式会社 | 樹脂供給装置、樹脂封止装置、及び樹脂封止品の製造方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007307843A (ja) * | 2006-05-20 | 2007-11-29 | Apic Yamada Corp | 樹脂モールド方法および樹脂モールド装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3791578B2 (ja) * | 1999-02-15 | 2006-06-28 | Nok株式会社 | 成形装置 |
JP4393244B2 (ja) * | 2004-03-29 | 2010-01-06 | キヤノン株式会社 | インプリント装置 |
DE102004043385B3 (de) * | 2004-09-08 | 2006-05-18 | Seereal Technologies Gmbh | Verfahren und Einrichtung zur Replikation fein strukturierter Flachoptiken und optischen Masken mit derartigen strukturierten Optiken |
JP5655237B2 (ja) * | 2010-12-17 | 2015-01-21 | アピックヤマダ株式会社 | 液状樹脂供給装置及び樹脂モールド装置 |
JP5817044B2 (ja) * | 2011-12-14 | 2015-11-18 | アピックヤマダ株式会社 | 樹脂封止装置および樹脂封止方法 |
JP6058431B2 (ja) * | 2013-03-08 | 2017-01-11 | アピックヤマダ株式会社 | 樹脂モールド装置、および樹脂モールド方法 |
WO2015159743A1 (ja) * | 2014-04-18 | 2015-10-22 | アピックヤマダ株式会社 | 樹脂モールド金型および樹脂モールド方法 |
CN105599976B (zh) * | 2015-11-06 | 2018-12-07 | 上海福帝包装机械有限公司 | 一种气调保鲜包装机 |
CN105459397B (zh) * | 2015-12-16 | 2018-01-30 | 浙江大学 | 一种用于熔融沉积成型3d打印机的防滴漏喷头 |
CN105583402A (zh) * | 2016-02-19 | 2016-05-18 | 珠海天威飞马打印耗材有限公司 | 三维打印材料、fdm三维打印机及其打印方法 |
-
2017
- 2017-04-14 WO PCT/JP2017/015360 patent/WO2017203888A1/ja active Application Filing
- 2017-05-18 TW TW109140035A patent/TWI746268B/zh active
- 2017-05-18 TW TW109140037A patent/TWI820358B/zh active
- 2017-05-18 TW TW106116410A patent/TWI724166B/zh active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007307843A (ja) * | 2006-05-20 | 2007-11-29 | Apic Yamada Corp | 樹脂モールド方法および樹脂モールド装置 |
Also Published As
Publication number | Publication date |
---|---|
WO2017203888A1 (ja) | 2017-11-30 |
TWI746268B (zh) | 2021-11-11 |
TW201801880A (zh) | 2018-01-16 |
TWI724166B (zh) | 2021-04-11 |
TW202114844A (zh) | 2021-04-16 |
TW202108334A (zh) | 2021-03-01 |
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