TWI820147B - 靜電夾盤及其製造方法 - Google Patents

靜電夾盤及其製造方法 Download PDF

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Publication number
TWI820147B
TWI820147B TW108119861A TW108119861A TWI820147B TW I820147 B TWI820147 B TW I820147B TW 108119861 A TW108119861 A TW 108119861A TW 108119861 A TW108119861 A TW 108119861A TW I820147 B TWI820147 B TW I820147B
Authority
TW
Taiwan
Prior art keywords
insulating member
cylindrical insulating
primer
electrostatic chuck
mentioned
Prior art date
Application number
TW108119861A
Other languages
English (en)
Chinese (zh)
Other versions
TW202002154A (zh
Inventor
吉川隆正
柳澤啓晴
飯島信行
Original Assignee
日商新光電氣工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商新光電氣工業股份有限公司 filed Critical 日商新光電氣工業股份有限公司
Publication of TW202002154A publication Critical patent/TW202002154A/zh
Application granted granted Critical
Publication of TWI820147B publication Critical patent/TWI820147B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Jigs For Machine Tools (AREA)
TW108119861A 2018-06-15 2019-06-10 靜電夾盤及其製造方法 TWI820147B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-114381 2018-06-15
JP2018114381A JP7090481B2 (ja) 2018-06-15 2018-06-15 静電チャック及びその製造方法

Publications (2)

Publication Number Publication Date
TW202002154A TW202002154A (zh) 2020-01-01
TWI820147B true TWI820147B (zh) 2023-11-01

Family

ID=68840316

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108119861A TWI820147B (zh) 2018-06-15 2019-06-10 靜電夾盤及其製造方法

Country Status (4)

Country Link
US (1) US11088006B2 (https=)
JP (1) JP7090481B2 (https=)
KR (1) KR102744643B1 (https=)
TW (1) TWI820147B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019146796A1 (ja) * 2018-01-29 2019-08-01 京セラ株式会社 試料保持具
WO2021192935A1 (ja) * 2020-03-26 2021-09-30 株式会社巴川製紙所 静電チャック装置、静電チャック装置用スリーブ
KR20220103046A (ko) 2021-01-14 2022-07-21 신꼬오덴기 고교 가부시키가이샤 기판 고정 장치
US20260090330A1 (en) * 2022-09-14 2026-03-26 Kyocera Corporation Adsorption substrate

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012512953A (ja) * 2008-12-19 2012-06-07 アプライド マテリアルズ インコーポレイテッド 高温静電チャック接着剤
JP2013229464A (ja) * 2012-04-26 2013-11-07 Shinko Electric Ind Co Ltd 静電チャック

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6071630A (en) * 1996-03-04 2000-06-06 Shin-Etsu Chemical Co., Ltd. Electrostatic chuck
US6151203A (en) * 1998-12-14 2000-11-21 Applied Materials, Inc. Connectors for an electrostatic chuck and combination thereof
US20050042881A1 (en) * 2003-05-12 2005-02-24 Tokyo Electron Limited Processing apparatus
JP5053696B2 (ja) * 2007-04-26 2012-10-17 信越化学工業株式会社 静電チャック
JP5567494B2 (ja) * 2007-12-19 2014-08-06 ラム リサーチ コーポレーション 半導体真空処理装置用のコンポーネント・アセンブリ、アセンブリを結合する方法、及び、半導体基板を処理する方法
JP5936361B2 (ja) * 2012-01-12 2016-06-22 株式会社日立ハイテクノロジーズ プラズマ処理装置
JP6162428B2 (ja) 2013-02-27 2017-07-12 日本特殊陶業株式会社 支持装置
JP6493518B2 (ja) * 2016-01-19 2019-04-03 住友大阪セメント株式会社 静電チャック装置
WO2019131115A1 (ja) * 2017-12-28 2019-07-04 住友大阪セメント株式会社 静電チャック装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012512953A (ja) * 2008-12-19 2012-06-07 アプライド マテリアルズ インコーポレイテッド 高温静電チャック接着剤
JP2013229464A (ja) * 2012-04-26 2013-11-07 Shinko Electric Ind Co Ltd 静電チャック

Also Published As

Publication number Publication date
KR102744643B1 (ko) 2024-12-20
US20190385883A1 (en) 2019-12-19
KR20190142215A (ko) 2019-12-26
JP7090481B2 (ja) 2022-06-24
TW202002154A (zh) 2020-01-01
JP2019220503A (ja) 2019-12-26
US11088006B2 (en) 2021-08-10

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