KR102744643B1 - 정전 척 및 그 제조 방법 - Google Patents

정전 척 및 그 제조 방법 Download PDF

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Publication number
KR102744643B1
KR102744643B1 KR1020190066516A KR20190066516A KR102744643B1 KR 102744643 B1 KR102744643 B1 KR 102744643B1 KR 1020190066516 A KR1020190066516 A KR 1020190066516A KR 20190066516 A KR20190066516 A KR 20190066516A KR 102744643 B1 KR102744643 B1 KR 102744643B1
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KR
South Korea
Prior art keywords
primer
adhesive layer
electrostatic chuck
mentioned
power supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020190066516A
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English (en)
Korean (ko)
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KR20190142215A (ko
Inventor
다카마사 요시카와
히로하루 야나기사와
노부유키 이이지마
Original Assignee
신꼬오덴기 고교 가부시키가이샤
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Publication of KR20190142215A publication Critical patent/KR20190142215A/ko
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Publication of KR102744643B1 publication Critical patent/KR102744643B1/ko
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Classifications

    • H01L21/6833—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • H01L21/67103—
    • H01L21/6835—
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Jigs For Machine Tools (AREA)
KR1020190066516A 2018-06-15 2019-06-05 정전 척 및 그 제조 방법 Active KR102744643B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018114381A JP7090481B2 (ja) 2018-06-15 2018-06-15 静電チャック及びその製造方法
JPJP-P-2018-114381 2018-06-15

Publications (2)

Publication Number Publication Date
KR20190142215A KR20190142215A (ko) 2019-12-26
KR102744643B1 true KR102744643B1 (ko) 2024-12-20

Family

ID=68840316

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020190066516A Active KR102744643B1 (ko) 2018-06-15 2019-06-05 정전 척 및 그 제조 방법

Country Status (4)

Country Link
US (1) US11088006B2 (https=)
JP (1) JP7090481B2 (https=)
KR (1) KR102744643B1 (https=)
TW (1) TWI820147B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019146796A1 (ja) * 2018-01-29 2019-08-01 京セラ株式会社 試料保持具
WO2021192935A1 (ja) * 2020-03-26 2021-09-30 株式会社巴川製紙所 静電チャック装置、静電チャック装置用スリーブ
KR20220103046A (ko) 2021-01-14 2022-07-21 신꼬오덴기 고교 가부시키가이샤 기판 고정 장치
US20260090330A1 (en) * 2022-09-14 2026-03-26 Kyocera Corporation Adsorption substrate

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000188321A (ja) 1998-12-14 2000-07-04 Applied Materials Inc 静電チャックコネクタとそのコンビネ―ション
JP2011508419A (ja) 2007-12-19 2011-03-10 ラム リサーチ コーポレーション 半導体真空処理装置用のフィルム接着剤
JP2013143512A (ja) 2012-01-12 2013-07-22 Hitachi High-Technologies Corp プラズマ処理装置
JP2013229464A (ja) * 2012-04-26 2013-11-07 Shinko Electric Ind Co Ltd 静電チャック

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6071630A (en) * 1996-03-04 2000-06-06 Shin-Etsu Chemical Co., Ltd. Electrostatic chuck
US20050042881A1 (en) * 2003-05-12 2005-02-24 Tokyo Electron Limited Processing apparatus
JP5053696B2 (ja) * 2007-04-26 2012-10-17 信越化学工業株式会社 静電チャック
US9520314B2 (en) * 2008-12-19 2016-12-13 Applied Materials, Inc. High temperature electrostatic chuck bonding adhesive
JP6162428B2 (ja) 2013-02-27 2017-07-12 日本特殊陶業株式会社 支持装置
JP6493518B2 (ja) * 2016-01-19 2019-04-03 住友大阪セメント株式会社 静電チャック装置
WO2019131115A1 (ja) * 2017-12-28 2019-07-04 住友大阪セメント株式会社 静電チャック装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000188321A (ja) 1998-12-14 2000-07-04 Applied Materials Inc 静電チャックコネクタとそのコンビネ―ション
JP2011508419A (ja) 2007-12-19 2011-03-10 ラム リサーチ コーポレーション 半導体真空処理装置用のフィルム接着剤
JP2013143512A (ja) 2012-01-12 2013-07-22 Hitachi High-Technologies Corp プラズマ処理装置
JP2013229464A (ja) * 2012-04-26 2013-11-07 Shinko Electric Ind Co Ltd 静電チャック

Also Published As

Publication number Publication date
US20190385883A1 (en) 2019-12-19
KR20190142215A (ko) 2019-12-26
JP7090481B2 (ja) 2022-06-24
TWI820147B (zh) 2023-11-01
TW202002154A (zh) 2020-01-01
JP2019220503A (ja) 2019-12-26
US11088006B2 (en) 2021-08-10

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