TWI819895B - 半導體雷射及半導體雷射製造方法 - Google Patents
半導體雷射及半導體雷射製造方法 Download PDFInfo
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- TWI819895B TWI819895B TW111143537A TW111143537A TWI819895B TW I819895 B TWI819895 B TW I819895B TW 111143537 A TW111143537 A TW 111143537A TW 111143537 A TW111143537 A TW 111143537A TW I819895 B TWI819895 B TW I819895B
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- 238000004519 manufacturing process Methods 0.000 title claims description 116
- 238000005253 cladding Methods 0.000 claims abstract description 392
- 239000000758 substrate Substances 0.000 claims abstract description 154
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- 239000011701 zinc Substances 0.000 claims description 61
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- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 30
- 238000005530 etching Methods 0.000 claims description 23
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- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
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- 239000000969 carrier Substances 0.000 description 5
- AXAZMDOAUQTMOW-UHFFFAOYSA-N dimethylzinc Chemical compound C[Zn]C AXAZMDOAUQTMOW-UHFFFAOYSA-N 0.000 description 5
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- 238000000206 photolithography Methods 0.000 description 4
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- 229910000530 Gallium indium arsenide Inorganic materials 0.000 description 1
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/2205—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers
- H01S5/2206—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers based on III-V materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/12—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/2205—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers
- H01S5/2222—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers having special electric properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/2205—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers
- H01S5/2222—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers having special electric properties
- H01S5/2224—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers having special electric properties semi-insulating semiconductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/227—Buried mesa structure ; Striped active layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/227—Buried mesa structure ; Striped active layer
- H01S5/2275—Buried mesa structure ; Striped active layer mesa created by etching
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Geometry (AREA)
- Semiconductor Lasers (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| WOPCT/JP2021/043737 | 2021-11-30 | ||
| PCT/JP2021/043737 WO2023100214A1 (ja) | 2021-11-30 | 2021-11-30 | 半導体レーザ及び半導体レーザ製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202324864A TW202324864A (zh) | 2023-06-16 |
| TWI819895B true TWI819895B (zh) | 2023-10-21 |
Family
ID=86611642
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW111143537A TWI819895B (zh) | 2021-11-30 | 2022-11-15 | 半導體雷射及半導體雷射製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240413613A1 (https=) |
| JP (1) | JP7612050B2 (https=) |
| CN (1) | CN118266139A (https=) |
| TW (1) | TWI819895B (https=) |
| WO (1) | WO2023100214A1 (https=) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060030065A1 (en) * | 2001-04-18 | 2006-02-09 | Susumu Kondo | Semiconductor optical device and the fabrication method |
| US20090001408A1 (en) * | 2007-05-22 | 2009-01-01 | Atsushi Matsumura | Method for forming a semiconductor light-emitting device and a semiconductor light-emitting device |
| CN101593930A (zh) * | 2008-05-26 | 2009-12-02 | 三菱电机株式会社 | 半导体激光器及其制造方法 |
| CN106972345A (zh) * | 2016-01-14 | 2017-07-21 | 住友电工光电子器件创新株式会社 | 形成半导体光学器件的方法及半导体光学器件 |
| US20210044083A1 (en) * | 2019-08-09 | 2021-02-11 | Lumentum Japan, Inc. | Buried-type semiconductor optical device |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS622584A (ja) * | 1985-06-27 | 1987-01-08 | Nec Corp | 埋込み構造半導体レ−ザ及び製造方法 |
| JPH01309393A (ja) * | 1988-06-08 | 1989-12-13 | Hitachi Ltd | 半導体レーザ装置及びその製造方法 |
| JPH03133189A (ja) * | 1989-10-18 | 1991-06-06 | Nec Corp | 高抵抗半導体層埋め込み型半導体レーザ |
| JPH07111361A (ja) * | 1993-10-12 | 1995-04-25 | Hitachi Ltd | 埋込型半導体レーザ素子及びその製造方法 |
| JP2000174390A (ja) * | 1998-12-08 | 2000-06-23 | Fujitsu Ltd | 半導体レーザ及びその製造方法 |
| JP3428501B2 (ja) * | 1999-06-03 | 2003-07-22 | 日本電気株式会社 | 半導体光増幅器およびその製造方法 |
| CA2328641A1 (en) * | 2000-12-15 | 2002-06-15 | Nortel Networks Limited | Confinement layer of buried heterostructure semiconductor laser |
| JP3825652B2 (ja) * | 2001-04-18 | 2006-09-27 | 日本電信電話株式会社 | 半導体光素子 |
| US20040125000A1 (en) * | 2002-12-31 | 2004-07-01 | Lee Yu Long | Low noise keyboard pushbutton structure |
| US20090267195A1 (en) * | 2005-12-20 | 2009-10-29 | Nec Corporation | Semiconductor element and method for manufacturing semiconductor element |
| JP2009266891A (ja) * | 2008-04-22 | 2009-11-12 | Sumitomo Electric Ind Ltd | 半導体レーザおよびその製造方法 |
| JP5660940B2 (ja) * | 2010-04-27 | 2015-01-28 | 住友電工デバイス・イノベーション株式会社 | 光半導体装置の製造方法 |
| JP2014045083A (ja) * | 2012-08-27 | 2014-03-13 | Nippon Telegr & Teleph Corp <Ntt> | 半導体光素子及び半導体光素子の作製方法 |
| JP2016031970A (ja) * | 2014-07-28 | 2016-03-07 | 三菱電機株式会社 | 光半導体装置 |
| JP2016184611A (ja) * | 2015-03-25 | 2016-10-20 | Nttエレクトロニクス株式会社 | 半導体レーザ |
| JP2018101752A (ja) * | 2016-12-21 | 2018-06-28 | 住友電気工業株式会社 | 半導体光素子およびその製造方法 |
| WO2020240644A1 (ja) * | 2019-05-27 | 2020-12-03 | 三菱電機株式会社 | 光半導体装置および光半導体装置の製造方法 |
| JP7457485B2 (ja) * | 2019-08-09 | 2024-03-28 | 日本ルメンタム株式会社 | 埋め込み型半導体光素子 |
| CN111048993B (zh) * | 2019-12-27 | 2025-12-09 | 苏州矩阵光电有限公司 | 一种微碟激光器及其制备方法 |
-
2021
- 2021-11-30 US US18/697,834 patent/US20240413613A1/en active Pending
- 2021-11-30 WO PCT/JP2021/043737 patent/WO2023100214A1/ja not_active Ceased
- 2021-11-30 JP JP2023564276A patent/JP7612050B2/ja active Active
- 2021-11-30 CN CN202180104326.7A patent/CN118266139A/zh active Pending
-
2022
- 2022-11-15 TW TW111143537A patent/TWI819895B/zh active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060030065A1 (en) * | 2001-04-18 | 2006-02-09 | Susumu Kondo | Semiconductor optical device and the fabrication method |
| US20090001408A1 (en) * | 2007-05-22 | 2009-01-01 | Atsushi Matsumura | Method for forming a semiconductor light-emitting device and a semiconductor light-emitting device |
| CN101593930A (zh) * | 2008-05-26 | 2009-12-02 | 三菱电机株式会社 | 半导体激光器及其制造方法 |
| CN106972345A (zh) * | 2016-01-14 | 2017-07-21 | 住友电工光电子器件创新株式会社 | 形成半导体光学器件的方法及半导体光学器件 |
| US20210044083A1 (en) * | 2019-08-09 | 2021-02-11 | Lumentum Japan, Inc. | Buried-type semiconductor optical device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2023100214A1 (https=) | 2023-06-08 |
| JP7612050B2 (ja) | 2025-01-10 |
| WO2023100214A1 (ja) | 2023-06-08 |
| CN118266139A (zh) | 2024-06-28 |
| TW202324864A (zh) | 2023-06-16 |
| US20240413613A1 (en) | 2024-12-12 |
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