TWI816886B - 積層板的製造方法、印刷配線板的製造方法及積層板製造裝置 - Google Patents

積層板的製造方法、印刷配線板的製造方法及積層板製造裝置 Download PDF

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Publication number
TWI816886B
TWI816886B TW108134411A TW108134411A TWI816886B TW I816886 B TWI816886 B TW I816886B TW 108134411 A TW108134411 A TW 108134411A TW 108134411 A TW108134411 A TW 108134411A TW I816886 B TWI816886 B TW I816886B
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TW
Taiwan
Prior art keywords
core material
tension
roller
manufacturing
laminated board
Prior art date
Application number
TW108134411A
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English (en)
Chinese (zh)
Other versions
TW202029847A (zh
Inventor
松村一輝
岸野光壽
石川陽介
Original Assignee
日商松下知識產權經營股份有限公司
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Application filed by 日商松下知識產權經營股份有限公司 filed Critical 日商松下知識產權經營股份有限公司
Publication of TW202029847A publication Critical patent/TW202029847A/zh
Application granted granted Critical
Publication of TWI816886B publication Critical patent/TWI816886B/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
    • B29C70/28—Shaping operations therefor
    • B29C70/40—Shaping or impregnating by compression not applied
    • B29C70/50—Shaping or impregnating by compression not applied for producing articles of indefinite length, e.g. prepregs, sheet moulding compounds [SMC] or cross moulding compounds [XMC]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Moulding By Coating Moulds (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
TW108134411A 2018-09-26 2019-09-24 積層板的製造方法、印刷配線板的製造方法及積層板製造裝置 TWI816886B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018180703A JP7217423B2 (ja) 2018-09-26 2018-09-26 積層板の製造方法、プリント配線板の製造方法及び積層板製造装置
JP2018-180703 2018-09-26

Publications (2)

Publication Number Publication Date
TW202029847A TW202029847A (zh) 2020-08-01
TWI816886B true TWI816886B (zh) 2023-10-01

Family

ID=69952878

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108134411A TWI816886B (zh) 2018-09-26 2019-09-24 積層板的製造方法、印刷配線板的製造方法及積層板製造裝置

Country Status (4)

Country Link
JP (1) JP7217423B2 (ja)
KR (1) KR20210063337A (ja)
TW (1) TWI816886B (ja)
WO (1) WO2020066792A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102574455B1 (ko) * 2021-09-30 2023-09-06 해성디에스 주식회사 다층 회로 기판의 제조장치

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200621468A (en) * 2004-12-15 2006-07-01 Samsung Electro Mech Apparatus and method for manufacturing copper clad laminate with improved peel strength
US20070034326A1 (en) * 2003-12-26 2007-02-15 Takashi Kikuchi Method for producing flexible laminate
US20100000675A1 (en) * 2008-07-01 2010-01-07 Samsung Techwin Co., Ltd. Method and apparatus for manufacturing multi-layer substrate
TWI549826B (zh) * 2011-08-09 2016-09-21 宇部愛科喜模股份有限公司 疊層體製造裝置及疊層體之製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5811150A (ja) * 1981-07-13 1983-01-21 松下電工株式会社 積層板の製法
JPH01299837A (ja) * 1988-05-26 1989-12-04 Matsushita Electric Works Ltd 積層板の製造方法
JP2008239826A (ja) 2007-03-27 2008-10-09 Matsushita Electric Works Ltd 樹脂フィルム積層プリプレグの製造方法
JP5887561B2 (ja) 2012-11-29 2016-03-16 パナソニックＩｐマネジメント株式会社 金属張積層板の製造方法
JP6354544B2 (ja) 2014-11-26 2018-07-11 アイシン・エィ・ダブリュ株式会社 鋳造用アルミニウム合金の脱リン方法及び脱リン用フラックス

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070034326A1 (en) * 2003-12-26 2007-02-15 Takashi Kikuchi Method for producing flexible laminate
TW200621468A (en) * 2004-12-15 2006-07-01 Samsung Electro Mech Apparatus and method for manufacturing copper clad laminate with improved peel strength
US20100000675A1 (en) * 2008-07-01 2010-01-07 Samsung Techwin Co., Ltd. Method and apparatus for manufacturing multi-layer substrate
TWI549826B (zh) * 2011-08-09 2016-09-21 宇部愛科喜模股份有限公司 疊層體製造裝置及疊層體之製造方法

Also Published As

Publication number Publication date
TW202029847A (zh) 2020-08-01
JP7217423B2 (ja) 2023-02-03
KR20210063337A (ko) 2021-06-01
JP2020053534A (ja) 2020-04-02
WO2020066792A1 (ja) 2020-04-02

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