JP2020053534A - 積層板の製造方法、プリント配線板の製造方法及び積層板製造装置 - Google Patents
積層板の製造方法、プリント配線板の製造方法及び積層板製造装置 Download PDFInfo
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- JP2020053534A JP2020053534A JP2018180703A JP2018180703A JP2020053534A JP 2020053534 A JP2020053534 A JP 2020053534A JP 2018180703 A JP2018180703 A JP 2018180703A JP 2018180703 A JP2018180703 A JP 2018180703A JP 2020053534 A JP2020053534 A JP 2020053534A
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- Prior art keywords
- core material
- laminate
- roll
- metal foil
- tension
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
- B29C70/28—Shaping operations therefor
- B29C70/40—Shaping or impregnating by compression not applied
- B29C70/50—Shaping or impregnating by compression not applied for producing articles of indefinite length, e.g. prepregs, sheet moulding compounds [SMC] or cross moulding compounds [XMC]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Mechanical Engineering (AREA)
- Laminated Bodies (AREA)
- Moulding By Coating Moulds (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
2 積層物
3 コア材
4 樹脂シート
5 金属箔
6 ロール
61 第一ロール
62 第二ロール
7 加熱装置
8 張力調整機
10 プリント配線板
31 絶縁層
32 導体配線
33 導体配線
91 第一絶縁層
92 第二絶縁層
511 導体配線(外層配線)
Claims (13)
- シート状のコア材を移動させながら前記コア材に樹脂シート及び金属箔を重ねて積層物を作製し、前記積層物を移動させながら加熱することを含み、
前記コア材を、張力をかけながら移動させ、前記コア材にかかる張力を調整してから、前記積層物を作製する、
積層板の製造方法。 - 前記コア材は、絶縁層と、前記絶縁層に重なる導体配線とを備える、
請求項1に記載の積層板の製造方法。 - 前記樹脂シートはプリプレグである、
請求項1又は2に記載の積層板の製造方法。 - 前記コア材にロールを接触させることで、前記コア材にかかる張力を調整する、
請求項1から3のいずれか一項に記載の積層板の製造方法。 - 前記ロールは、回転駆動する、
請求項4に記載の積層板の製造方法。 - 前記ロールは、前記ロールにおける前記コア材と接する部位が、前記コア材の移動する向きと同じ向きに移動するように、回転駆動する、
請求項5に記載の積層板の製造方法。 - 前記コア材を、前記ロールである第一ロールと、第二ロールとで挟みながら、前記第一ロールと前記第二ロールとの間を通過させることで、前記コア材にかかる張力を調整する、
請求項4から6のいずれか一項に記載の積層板の製造方法。 - 前記第二ロールは、回転駆動する、
請求項7に記載の積層板の製造方法。 - 前記第二ロールは、前記第二ロールにおける前記コア材と接する部位が、前記コア材の移動する向きと同じ向きに移動するように、回転駆動する、
請求項8に記載の積層板の製造方法。 - 前記金属箔を予熱してから、前記コア材に前記樹脂シート及び前記金属箔をこの順に重ねて前記積層物を作製する、
請求項1から9のいずれか一項に記載の積層板の製造方法。 - 前記積層物をダブルベルトプレス方式で加熱する、
請求項1から10のいずれか一項に記載の積層板の製造方法。 - 請求項1から11のいずれか一項に記載の積層板の製造方法で積層板を作製し、
前記積層板の最外層に導体配線を設けることを含む、
プリント配線板の製造方法。 - シート状のコア材を、前記コア材に張力をかけながら移動させる搬送機構と、
前記コア材と樹脂シートと金属箔とが供給され、前記コア材と前記樹脂シートと前記金属箔とをこの順に重ねた積層物を移動させながら加熱する加熱装置と、
前記加熱装置に供給される前の前記コア材にかかる張力を調整する張力調整機とを備える、
積層板製造装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018180703A JP7217423B2 (ja) | 2018-09-26 | 2018-09-26 | 積層板の製造方法、プリント配線板の製造方法及び積層板製造装置 |
PCT/JP2019/036588 WO2020066792A1 (ja) | 2018-09-26 | 2019-09-18 | 積層板の製造方法、プリント配線板の製造方法及び積層板製造装置 |
KR1020217008272A KR20210063337A (ko) | 2018-09-26 | 2019-09-18 | 적층판의 제조 방법, 프린트 배선판의 제조 방법 및 적층판 제조 장치 |
TW108134411A TWI816886B (zh) | 2018-09-26 | 2019-09-24 | 積層板的製造方法、印刷配線板的製造方法及積層板製造裝置 |
Applications Claiming Priority (1)
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JP2018180703A JP7217423B2 (ja) | 2018-09-26 | 2018-09-26 | 積層板の製造方法、プリント配線板の製造方法及び積層板製造装置 |
Publications (2)
Publication Number | Publication Date |
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JP2020053534A true JP2020053534A (ja) | 2020-04-02 |
JP7217423B2 JP7217423B2 (ja) | 2023-02-03 |
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JP2018180703A Active JP7217423B2 (ja) | 2018-09-26 | 2018-09-26 | 積層板の製造方法、プリント配線板の製造方法及び積層板製造装置 |
Country Status (4)
Country | Link |
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JP (1) | JP7217423B2 (ja) |
KR (1) | KR20210063337A (ja) |
TW (1) | TWI816886B (ja) |
WO (1) | WO2020066792A1 (ja) |
Cited By (1)
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KR20230046810A (ko) * | 2021-09-30 | 2023-04-06 | 해성디에스 주식회사 | 다층 회로 기판의 제조장치 |
Families Citing this family (1)
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KR102537560B1 (ko) * | 2021-09-30 | 2023-06-01 | 해성디에스 주식회사 | 다층 회로 기판의 제조장치 및 다층 회로 기판의 제조방법 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6354544B2 (ja) * | 1981-07-13 | 1988-10-28 | Matsushita Electric Works Ltd | |
JPH0424373B2 (ja) * | 1988-05-26 | 1992-04-24 | Matsushita Electric Works Ltd | |
JP2008239826A (ja) * | 2007-03-27 | 2008-10-09 | Matsushita Electric Works Ltd | 樹脂フィルム積層プリプレグの製造方法 |
US20100000675A1 (en) * | 2008-07-01 | 2010-01-07 | Samsung Techwin Co., Ltd. | Method and apparatus for manufacturing multi-layer substrate |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
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US20070034326A1 (en) * | 2003-12-26 | 2007-02-15 | Takashi Kikuchi | Method for producing flexible laminate |
KR100688824B1 (ko) * | 2004-12-15 | 2007-03-02 | 삼성전기주식회사 | 접착강도가 개선된 동박적층판의 제조 장치 및 그 방법 |
WO2013021893A1 (ja) * | 2011-08-09 | 2013-02-14 | 宇部日東化成株式会社 | 積層体製造装置及び積層体の製造方法 |
JP5887561B2 (ja) | 2012-11-29 | 2016-03-16 | パナソニックIpマネジメント株式会社 | 金属張積層板の製造方法 |
JP6354544B2 (ja) | 2014-11-26 | 2018-07-11 | アイシン・エィ・ダブリュ株式会社 | 鋳造用アルミニウム合金の脱リン方法及び脱リン用フラックス |
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- 2018-09-26 JP JP2018180703A patent/JP7217423B2/ja active Active
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2019
- 2019-09-18 KR KR1020217008272A patent/KR20210063337A/ko not_active Application Discontinuation
- 2019-09-18 WO PCT/JP2019/036588 patent/WO2020066792A1/ja active Application Filing
- 2019-09-24 TW TW108134411A patent/TWI816886B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6354544B2 (ja) * | 1981-07-13 | 1988-10-28 | Matsushita Electric Works Ltd | |
JPH0424373B2 (ja) * | 1988-05-26 | 1992-04-24 | Matsushita Electric Works Ltd | |
JP2008239826A (ja) * | 2007-03-27 | 2008-10-09 | Matsushita Electric Works Ltd | 樹脂フィルム積層プリプレグの製造方法 |
US20100000675A1 (en) * | 2008-07-01 | 2010-01-07 | Samsung Techwin Co., Ltd. | Method and apparatus for manufacturing multi-layer substrate |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20230046810A (ko) * | 2021-09-30 | 2023-04-06 | 해성디에스 주식회사 | 다층 회로 기판의 제조장치 |
KR102574455B1 (ko) * | 2021-09-30 | 2023-09-06 | 해성디에스 주식회사 | 다층 회로 기판의 제조장치 |
Also Published As
Publication number | Publication date |
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WO2020066792A1 (ja) | 2020-04-02 |
TW202029847A (zh) | 2020-08-01 |
JP7217423B2 (ja) | 2023-02-03 |
KR20210063337A (ko) | 2021-06-01 |
TWI816886B (zh) | 2023-10-01 |
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