TWI813950B - 基板處理方法 - Google Patents

基板處理方法 Download PDF

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Publication number
TWI813950B
TWI813950B TW110106261A TW110106261A TWI813950B TW I813950 B TWI813950 B TW I813950B TW 110106261 A TW110106261 A TW 110106261A TW 110106261 A TW110106261 A TW 110106261A TW I813950 B TWI813950 B TW I813950B
Authority
TW
Taiwan
Prior art keywords
substrate
processing liquid
nozzle
peripheral
processing
Prior art date
Application number
TW110106261A
Other languages
English (en)
Chinese (zh)
Other versions
TW202201522A (zh
Inventor
山口貴大
澤島隼
東克栄
小林健司
Original Assignee
日商斯庫林集團股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商斯庫林集團股份有限公司 filed Critical 日商斯庫林集團股份有限公司
Publication of TW202201522A publication Critical patent/TW202201522A/zh
Application granted granted Critical
Publication of TWI813950B publication Critical patent/TWI813950B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/02—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape
    • B05B1/04—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape in flat form, e.g. fan-like, sheet-like
    • B05B1/044—Slits, i.e. narrow openings defined by two straight and parallel lips; Elongated outlets for producing very wide discharges, e.g. fluid curtains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B05B13/04—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation
    • B05B13/0405—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation with reciprocating or oscillating spray heads
    • B05B13/041—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation with reciprocating or oscillating spray heads with spray heads reciprocating along a straight line
    • B05B13/0415—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation with reciprocating or oscillating spray heads with spray heads reciprocating along a straight line the angular position of the spray heads relative to the straight line being modified during the reciprocating movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B3/00—Spraying or sprinkling apparatus with moving outlet elements or moving deflecting elements
    • B05B3/02—Spraying or sprinkling apparatus with moving outlet elements or moving deflecting elements with rotating elements
    • B05B3/021—Spraying or sprinkling apparatus with moving outlet elements or moving deflecting elements with rotating elements with means for regulating the jet relative to the horizontal angular position of the nozzle, e.g. for spraying non circular areas by changing the elevation of the nozzle or by varying the nozzle flow-rate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02021—Edge treatment, chamfering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30604—Chemical etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW110106261A 2020-03-06 2021-02-23 基板處理方法 TWI813950B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020038822A JP7453020B2 (ja) 2020-03-06 2020-03-06 基板処理方法
JP2020-038822 2020-03-06

Publications (2)

Publication Number Publication Date
TW202201522A TW202201522A (zh) 2022-01-01
TWI813950B true TWI813950B (zh) 2023-09-01

Family

ID=77524884

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110106261A TWI813950B (zh) 2020-03-06 2021-02-23 基板處理方法

Country Status (4)

Country Link
JP (2) JP7453020B2 (ko)
KR (2) KR20210113061A (ko)
CN (1) CN113363180A (ko)
TW (1) TWI813950B (ko)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6267853B1 (en) * 1999-07-09 2001-07-31 Applied Materials, Inc. Electro-chemical deposition system
US20100203250A1 (en) * 2009-02-06 2010-08-12 Tokyo Electron Limited Developing device, developing method and storage medium

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6064875U (ja) 1983-10-13 1985-05-08 小瀬木　進 名刺用紙
JPH08195370A (ja) * 1995-01-13 1996-07-30 Sony Corp エッジクリーン方法
JP3641156B2 (ja) * 1999-03-15 2005-04-20 株式会社東芝 新規微生物および海生物の生物処理法
JP4584385B2 (ja) * 1999-08-10 2010-11-17 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP4089809B2 (ja) 2002-03-13 2008-05-28 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 半導体ウェーハのエッジ部の酸化膜除去装置
JP2003203900A (ja) * 2002-10-17 2003-07-18 Nec Electronics Corp ウェハ処理装置およびウェハ処理方法
JP4708243B2 (ja) 2006-03-28 2011-06-22 東京エレクトロン株式会社 液処理装置および液処理方法ならびにコンピュータ読取可能な記憶媒体
JP2007299960A (ja) * 2006-04-28 2007-11-15 Toshiba Corp 半導体装置及びその製造方法
JP5373498B2 (ja) 2009-07-27 2013-12-18 芝浦メカトロニクス株式会社 基板の処理装置及び処理方法
US9704730B2 (en) * 2013-05-28 2017-07-11 Tokyo Electron Limited Substrate cleaning apparatus, substrate cleaning method and non-transitory storage medium
KR102065973B1 (ko) 2013-07-12 2020-01-15 삼성전자 주식회사 반도체 장치 및 그 제조 방법
JP6064875B2 (ja) 2013-11-25 2017-01-25 東京エレクトロン株式会社 液処理装置、液処理方法及び記憶媒体
JP6932597B2 (ja) 2017-09-25 2021-09-08 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6933960B2 (ja) 2017-11-15 2021-09-08 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6267853B1 (en) * 1999-07-09 2001-07-31 Applied Materials, Inc. Electro-chemical deposition system
US20100203250A1 (en) * 2009-02-06 2010-08-12 Tokyo Electron Limited Developing device, developing method and storage medium

Also Published As

Publication number Publication date
JP2021141241A (ja) 2021-09-16
CN113363180A (zh) 2021-09-07
KR20230062497A (ko) 2023-05-09
TW202201522A (zh) 2022-01-01
KR20210113061A (ko) 2021-09-15
KR20230062498A (ko) 2023-05-09
JP2024053042A (ja) 2024-04-12
JP7453020B2 (ja) 2024-03-19
KR102643412B1 (ko) 2024-03-05

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