TWI813852B - 光硬化性樹脂組成物、包含該組成物的薄膜、使該組成物或該薄膜硬化而得的硬化物、配線構造體、電子構件、及半導體裝置 - Google Patents

光硬化性樹脂組成物、包含該組成物的薄膜、使該組成物或該薄膜硬化而得的硬化物、配線構造體、電子構件、及半導體裝置 Download PDF

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Publication number
TWI813852B
TWI813852B TW109102578A TW109102578A TWI813852B TW I813852 B TWI813852 B TW I813852B TW 109102578 A TW109102578 A TW 109102578A TW 109102578 A TW109102578 A TW 109102578A TW I813852 B TWI813852 B TW I813852B
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TW
Taiwan
Prior art keywords
resin composition
photocurable resin
component
group
present
Prior art date
Application number
TW109102578A
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English (en)
Chinese (zh)
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TW202035597A (zh
Inventor
帕維爾 克巴羅
行
大友政義
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日商納美仕有限公司
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Publication of TW202035597A publication Critical patent/TW202035597A/zh
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C08F290/062—Polyethers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D151/00—Coating compositions based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Coating compositions based on derivatives of such polymers
    • C09D151/08—Coating compositions based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Coating compositions based on derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/106—Esters of polycondensation macromers
    • C08F222/1063—Esters of polycondensation macromers of alcohol terminated polyethers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
    • C09D4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09D159/00 - C09D187/00
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Materials For Photolithography (AREA)
  • Polymerization Catalysts (AREA)
TW109102578A 2019-02-12 2020-01-22 光硬化性樹脂組成物、包含該組成物的薄膜、使該組成物或該薄膜硬化而得的硬化物、配線構造體、電子構件、及半導體裝置 TWI813852B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201962804337P 2019-02-12 2019-02-12
US62/804,337 2019-02-12

Publications (2)

Publication Number Publication Date
TW202035597A TW202035597A (zh) 2020-10-01
TWI813852B true TWI813852B (zh) 2023-09-01

Family

ID=72044068

Family Applications (1)

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TW109102578A TWI813852B (zh) 2019-02-12 2020-01-22 光硬化性樹脂組成物、包含該組成物的薄膜、使該組成物或該薄膜硬化而得的硬化物、配線構造體、電子構件、及半導體裝置

Country Status (7)

Country Link
US (1) US20220144993A1 (https=)
EP (1) EP3925993B1 (https=)
JP (1) JP7401917B2 (https=)
KR (1) KR102801857B1 (https=)
CN (1) CN113423750B (https=)
TW (1) TWI813852B (https=)
WO (1) WO2020166288A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115917433B (zh) * 2020-07-01 2025-09-23 纳美仕有限公司 感光性树脂组合物、其固化物、以及含有其固化物的布线结构体
JP7744268B2 (ja) * 2022-03-08 2025-09-25 日本化薬株式会社 硬化性樹脂組成物、その硬化物および半導体装置
WO2025074949A1 (ja) * 2023-10-04 2025-04-10 ダウ・東レ株式会社 紫外線硬化性組成物

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TW200410623A (en) * 1999-08-12 2004-06-16 Ibiden Co Ltd Multi-layer printed circuit board and semiconductor device
WO2018030112A1 (ja) * 2016-08-10 2018-02-15 パナソニックＩｐマネジメント株式会社 封止用アクリル組成物、シート材、積層シート、硬化物、半導体装置及び半導体装置の製造方法

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US6352782B2 (en) * 1999-12-01 2002-03-05 General Electric Company Poly(phenylene ether)-polyvinyl thermosetting resin
US20040137251A1 (en) * 2003-01-14 2004-07-15 Davis Michael John Poly(phenylene ether)-polyvinyl thermosetting adhesives films, and substrates made therefrom
CN1756655A (zh) * 2003-01-14 2006-04-05 通用电气公司 聚(亚苯基醚)－聚乙烯基热固性粘合剂膜和由其制造的基体
US7413791B2 (en) 2003-01-28 2008-08-19 Matsushita Electric Works, Ltd. Poly (phenylene ether) resin composition, prepreg, and laminated sheet
JP2004294882A (ja) 2003-03-27 2004-10-21 Nippon Steel Chem Co Ltd 感光性樹脂組成物及び硬化物
US7595362B2 (en) * 2004-01-30 2009-09-29 Nippon Steel Chemical Co., Ltd. Curable resin composition
US7329708B2 (en) * 2004-08-18 2008-02-12 General Electric Company Functionalized poly(arylene ether) composition and method
JP5123477B2 (ja) 2005-10-18 2013-01-23 パナソニック株式会社 樹脂組成物、プリプレグ、積層体
JP5078648B2 (ja) 2008-02-08 2012-11-21 旭化成イーマテリアルズ株式会社 感光性樹脂組成物
JP5439075B2 (ja) 2009-07-21 2014-03-12 太陽ホールディングス株式会社 光硬化性樹脂組成物
KR101596897B1 (ko) * 2011-12-06 2016-02-24 가부시키가이샤 가네카 흑색 감광성 수지 조성물 및 그 이용
WO2016104748A1 (ja) * 2014-12-26 2016-06-30 新日鉄住金化学株式会社 末端変性可溶性多官能ビニル芳香族共重合体、硬化性樹脂組成物及びこれを用いた光導波路
JP6550275B2 (ja) * 2015-06-15 2019-07-24 東京応化工業株式会社 ナノインプリント用組成物、硬化物、パターン形成方法及びパターンを含む物品
JP2017047648A (ja) 2015-09-04 2017-03-09 三菱瓦斯化学株式会社 銅張積層板
TWI781918B (zh) * 2016-02-02 2022-11-01 日商三菱瓦斯化學股份有限公司 樹脂組成物、預浸體、覆金屬箔疊層板、樹脂片、印刷電路板及半導體裝置
CN117534954A (zh) 2017-12-28 2024-02-09 松下知识产权经营株式会社 聚苯醚树脂组合物、预浸料、带树脂的膜、带树脂的金属箔、覆金属箔层压板及布线板
TWI686436B (zh) * 2018-08-28 2020-03-01 台燿科技股份有限公司 無鹵素低介電樹脂組合物，以及使用該組合物所製得之預浸漬片、金屬箔積層板與印刷電路板
CN112646350B (zh) * 2019-10-11 2023-04-25 台光电子材料(昆山)有限公司 一种树脂组合物及其制品

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TW200410623A (en) * 1999-08-12 2004-06-16 Ibiden Co Ltd Multi-layer printed circuit board and semiconductor device
WO2018030112A1 (ja) * 2016-08-10 2018-02-15 パナソニックＩｐマネジメント株式会社 封止用アクリル組成物、シート材、積層シート、硬化物、半導体装置及び半導体装置の製造方法

Also Published As

Publication number Publication date
TW202035597A (zh) 2020-10-01
EP3925993B1 (en) 2023-09-13
JP7401917B2 (ja) 2023-12-20
CN113423750B (zh) 2023-11-21
JPWO2020166288A1 (ja) 2021-12-16
KR20210127959A (ko) 2021-10-25
WO2020166288A1 (ja) 2020-08-20
EP3925993A4 (en) 2022-11-09
EP3925993A1 (en) 2021-12-22
KR102801857B1 (ko) 2025-05-02
US20220144993A1 (en) 2022-05-12
CN113423750A (zh) 2021-09-21

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