TWI806944B - 研磨裝置及研磨方法 - Google Patents

研磨裝置及研磨方法 Download PDF

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Publication number
TWI806944B
TWI806944B TW107145735A TW107145735A TWI806944B TW I806944 B TWI806944 B TW I806944B TW 107145735 A TW107145735 A TW 107145735A TW 107145735 A TW107145735 A TW 107145735A TW I806944 B TWI806944 B TW I806944B
Authority
TW
Taiwan
Prior art keywords
roller
top wheel
grinding
guide roller
center
Prior art date
Application number
TW107145735A
Other languages
English (en)
Chinese (zh)
Other versions
TW201930009A (zh
Inventor
山田健人
田中忠雄
中村正三
神頭宏俊
Original Assignee
日商信越半導體股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商信越半導體股份有限公司 filed Critical 日商信越半導體股份有限公司
Publication of TW201930009A publication Critical patent/TW201930009A/zh
Application granted granted Critical
Publication of TWI806944B publication Critical patent/TWI806944B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Disintegrating Or Milling (AREA)
TW107145735A 2018-01-09 2018-12-18 研磨裝置及研磨方法 TWI806944B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP2018-001412 2018-01-09
JP2018001412A JP6924710B2 (ja) 2018-01-09 2018-01-09 研磨装置および研磨方法

Publications (2)

Publication Number Publication Date
TW201930009A TW201930009A (zh) 2019-08-01
TWI806944B true TWI806944B (zh) 2023-07-01

Family

ID=67235393

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107145735A TWI806944B (zh) 2018-01-09 2018-12-18 研磨裝置及研磨方法

Country Status (4)

Country Link
JP (2) JP6924710B2 (ja)
KR (1) KR102661312B1 (ja)
CN (1) CN110026881B (ja)
TW (1) TWI806944B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6927617B1 (ja) * 2020-11-19 2021-09-01 不二越機械工業株式会社 ワーク研磨装置およびトップリング用樹脂マット体
CN112440158A (zh) * 2020-11-24 2021-03-05 深圳市安能石油化工有限公司 一种车载空调金属连接件表面处理方法
CN112454035A (zh) * 2020-11-24 2021-03-09 深圳市安能石油化工有限公司 一种车载空调连接件表面处理系统
KR102548957B1 (ko) * 2021-01-21 2023-06-29 에스케이실트론 주식회사 파이널 폴리싱 장치 및 이의 동작 방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3930343A (en) * 1974-03-04 1976-01-06 Veb Rathenower Optische Werke Device for mounting specimens
JPH0569313A (ja) * 1991-09-03 1993-03-23 Takahiro Imahashi 高精度平面創成方法及び装置
TW330881B (en) * 1996-04-26 1998-05-01 Memc Electronic Materials Spa The apparatus & method for shaping a polishing pad & polishing semiconductor wafers
JP2004148457A (ja) * 2002-10-31 2004-05-27 Showa Denko Kk ウェーハの研磨方法および研磨装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE8315632U1 (de) * 1982-06-01 1988-05-11 General Signal Corp., Stamford, Conn. Aufnahmevorrichtung für dünne scheibchenförmige Werkstücke
JP2612012B2 (ja) * 1987-11-16 1997-05-21 三菱マテリアル株式会社 研磨装置
JP2539753B2 (ja) * 1993-09-21 1996-10-02 住友シチックス株式会社 半導体基板の鏡面研磨装置
JPH10249716A (ja) * 1997-03-07 1998-09-22 Super Silicon Kenkyusho:Kk ウェーハ研磨装置
JPH11300607A (ja) * 1998-04-16 1999-11-02 Speedfam-Ipec Co Ltd 研磨装置
JP3058274B1 (ja) * 1999-02-26 2000-07-04 日本電気株式会社 平面研磨装置
JP2000135669A (ja) * 1998-10-30 2000-05-16 Shin Etsu Handotai Co Ltd ウェーハ研磨装置及び方法
JP2000308963A (ja) * 1999-04-27 2000-11-07 Speedfam-Ipec Co Ltd 片面ラッピング装置
JP3085948B1 (ja) * 1999-05-10 2000-09-11 株式会社東京精密 ウェーハ研磨装置
JP2001338901A (ja) * 2000-05-26 2001-12-07 Hitachi Ltd 平坦化加工方法及び、装置並びに，半導体装置の製造方法
JP2005305609A (ja) * 2004-04-23 2005-11-04 Hiihaisuto Seiko Kk ラップ盤
JP2007027488A (ja) * 2005-07-19 2007-02-01 Komatsu Electronic Metals Co Ltd 半導体ウェーハの研磨方法
JP5472911B2 (ja) * 2010-02-05 2014-04-16 浜井産業株式会社 研磨装置
CN201960464U (zh) * 2010-12-30 2011-09-07 中芯国际集成电路制造(上海)有限公司 一种化学机械研磨垫及化学机械研磨设备
JP5674145B2 (ja) * 2011-03-29 2015-02-25 浜井産業株式会社 片面研磨装置
CN104440516B (zh) * 2014-04-22 2017-03-15 上海华力微电子有限公司 一种研磨盘装置
JP2016159384A (ja) * 2015-02-27 2016-09-05 住友金属鉱山株式会社 研磨装置及び研磨方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3930343A (en) * 1974-03-04 1976-01-06 Veb Rathenower Optische Werke Device for mounting specimens
JPH0569313A (ja) * 1991-09-03 1993-03-23 Takahiro Imahashi 高精度平面創成方法及び装置
TW330881B (en) * 1996-04-26 1998-05-01 Memc Electronic Materials Spa The apparatus & method for shaping a polishing pad & polishing semiconductor wafers
JP2004148457A (ja) * 2002-10-31 2004-05-27 Showa Denko Kk ウェーハの研磨方法および研磨装置

Also Published As

Publication number Publication date
CN110026881B (zh) 2022-04-01
JP7087166B2 (ja) 2022-06-20
JP2019119023A (ja) 2019-07-22
JP6924710B2 (ja) 2021-08-25
JP2021137960A (ja) 2021-09-16
KR102661312B1 (ko) 2024-04-30
KR20190084871A (ko) 2019-07-17
CN110026881A (zh) 2019-07-19
TW201930009A (zh) 2019-08-01

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