CN201960464U - 一种化学机械研磨垫及化学机械研磨设备 - Google Patents
一种化学机械研磨垫及化学机械研磨设备 Download PDFInfo
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- CN201960464U CN201960464U CN2010206943533U CN201020694353U CN201960464U CN 201960464 U CN201960464 U CN 201960464U CN 2010206943533 U CN2010206943533 U CN 2010206943533U CN 201020694353 U CN201020694353 U CN 201020694353U CN 201960464 U CN201960464 U CN 201960464U
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- mechanical polishing
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
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CN2010206943533U CN201960464U (zh) | 2010-12-30 | 2010-12-30 | 一种化学机械研磨垫及化学机械研磨设备 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102441839A (zh) * | 2011-11-11 | 2012-05-09 | 上海华力微电子有限公司 | 提高固定研磨料在研磨垫上进行cmp工艺稳定性的方法 |
CN110026881A (zh) * | 2018-01-09 | 2019-07-19 | 信越半导体株式会社 | 研磨装置及研磨方法 |
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2010
- 2010-12-30 CN CN2010206943533U patent/CN201960464U/zh not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102441839A (zh) * | 2011-11-11 | 2012-05-09 | 上海华力微电子有限公司 | 提高固定研磨料在研磨垫上进行cmp工艺稳定性的方法 |
CN102441839B (zh) * | 2011-11-11 | 2014-06-04 | 上海华力微电子有限公司 | 提高固定研磨料在研磨垫上进行cmp工艺稳定性的方法 |
CN110026881A (zh) * | 2018-01-09 | 2019-07-19 | 信越半导体株式会社 | 研磨装置及研磨方法 |
CN110026881B (zh) * | 2018-01-09 | 2022-04-01 | 信越半导体株式会社 | 研磨装置及研磨方法 |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Free format text: FORMER OWNER: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION Effective date: 20130328 |
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C41 | Transfer of patent application or patent right or utility model | ||
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Free format text: CORRECT: ADDRESS; FROM: 201203 PUDONG NEW AREA, SHANGHAI TO: 100176 DAXING, BEIJING |
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TR01 | Transfer of patent right |
Effective date of registration: 20130328 Address after: 100176 No. 18, Wenchang Avenue, Beijing economic and Technological Development Zone, Beijing Patentee after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110907 Termination date: 20181230 |
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CF01 | Termination of patent right due to non-payment of annual fee |