TWI802711B - 環氧樹脂組成物及其硬化物 - Google Patents

環氧樹脂組成物及其硬化物 Download PDF

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Publication number
TWI802711B
TWI802711B TW108120842A TW108120842A TWI802711B TW I802711 B TWI802711 B TW I802711B TW 108120842 A TW108120842 A TW 108120842A TW 108120842 A TW108120842 A TW 108120842A TW I802711 B TWI802711 B TW I802711B
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TW
Taiwan
Prior art keywords
epoxy resin
resin composition
naphthol
active ester
group
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Application number
TW108120842A
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English (en)
Chinese (zh)
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TW202006003A (zh
Inventor
迫雅樹
佐藤泰
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日商Ｄｉｃ股份有限公司
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Publication of TW202006003A publication Critical patent/TW202006003A/zh
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW108120842A 2018-06-27 2019-06-17 環氧樹脂組成物及其硬化物 TWI802711B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-121553 2018-06-27
JP2018121553 2018-06-27

Publications (2)

Publication Number Publication Date
TW202006003A TW202006003A (zh) 2020-02-01
TWI802711B true TWI802711B (zh) 2023-05-21

Family

ID=68986399

Family Applications (1)

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TW108120842A TWI802711B (zh) 2018-06-27 2019-06-17 環氧樹脂組成物及其硬化物

Country Status (4)

Country Link
JP (1) JP7049605B2 (ja)
CN (1) CN112313260A (ja)
TW (1) TWI802711B (ja)
WO (1) WO2020003824A1 (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114195981B (zh) * 2021-12-24 2023-10-13 广东省科学院化工研究所 一种联苯型环氧树脂及其合成方法和应用
JPWO2023157780A1 (ja) 2022-02-16 2023-08-24
JPWO2023157777A1 (ja) 2022-02-16 2023-08-24
CN118696075A (zh) 2022-02-16 2024-09-24 三菱瓦斯化学株式会社 固化性树脂及其固化物和树脂组合物
CN114805801B (zh) * 2022-06-08 2023-07-25 黑龙江省科学院石油化学研究院 一种具有低吸湿性的氰酸酯树脂及其制备方法
CN115466373B (zh) * 2022-10-20 2024-01-30 湖南嘉盛德材料科技股份有限公司 一种萘酚联苯芳烷基型环氧树脂的制备方法
CN115819317B (zh) * 2022-12-27 2024-03-08 苏州生益科技有限公司 活性酯化合物、树脂组合物

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1106194A (zh) * 1993-03-22 1995-08-02 日本化药株式会社 含萘环的树脂、树脂组合物及其固化产品
JP2016028135A (ja) * 2014-07-08 2016-02-25 Dic株式会社 エポキシ樹脂組成物、硬化性樹脂組成物、活性エステル、硬化物、半導体封止材料、半導体装置、プレプリグ、フレキシルブル配線基板、回路基板、ビルドアップフィルム、ビルドアップ基板、繊維強化複合材料、成形品

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2856565B2 (ja) * 1991-04-01 1999-02-10 日本化薬株式会社 樹脂の製造方法
JP2002220359A (ja) * 2001-01-26 2002-08-09 Nippon Shokubai Co Ltd 多価フェノール及びそれから誘導されたエポキシ樹脂
JP2009242559A (ja) * 2008-03-31 2009-10-22 Dic Corp エポキシ樹脂組成物、及びその硬化物
TWI621638B (zh) * 2008-11-28 2018-04-21 味之素股份有限公司 Resin composition
JP2011252037A (ja) * 2010-05-31 2011-12-15 Meiwa Kasei Kk エポキシ樹脂組成物、該エポキシ樹脂組成物を用いた半導体封止材料及び積層板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1106194A (zh) * 1993-03-22 1995-08-02 日本化药株式会社 含萘环的树脂、树脂组合物及其固化产品
JP2016028135A (ja) * 2014-07-08 2016-02-25 Dic株式会社 エポキシ樹脂組成物、硬化性樹脂組成物、活性エステル、硬化物、半導体封止材料、半導体装置、プレプリグ、フレキシルブル配線基板、回路基板、ビルドアップフィルム、ビルドアップ基板、繊維強化複合材料、成形品

Also Published As

Publication number Publication date
CN112313260A (zh) 2021-02-02
TW202006003A (zh) 2020-02-01
JP7049605B2 (ja) 2022-04-07
JPWO2020003824A1 (ja) 2021-05-20
WO2020003824A1 (ja) 2020-01-02

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