TWI800995B - 半導體記憶裝置 - Google Patents
半導體記憶裝置 Download PDFInfo
- Publication number
- TWI800995B TWI800995B TW110143000A TW110143000A TWI800995B TW I800995 B TWI800995 B TW I800995B TW 110143000 A TW110143000 A TW 110143000A TW 110143000 A TW110143000 A TW 110143000A TW I800995 B TWI800995 B TW I800995B
- Authority
- TW
- Taiwan
- Prior art keywords
- memory device
- semiconductor memory
- semiconductor
- memory
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/10—Programming or data input circuits
- G11C16/14—Circuits for erasing electrically, e.g. erase voltage switching circuits
- G11C16/16—Circuits for erasing electrically, e.g. erase voltage switching circuits for erasing blocks, e.g. arrays, words, groups
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C8/00—Arrangements for selecting an address in a digital store
- G11C8/08—Word line control circuits, e.g. drivers, boosters, pull-up circuits, pull-down circuits, precharging circuits, for word lines
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/34—Determination of programming status, e.g. threshold voltage, overprogramming or underprogramming, retention
- G11C16/3436—Arrangements for verifying correct programming or erasure
- G11C16/344—Arrangements for verifying correct erasure or for detecting overerased cells
- G11C16/3445—Circuits or methods to verify correct erasure of nonvolatile memory cells
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
- G11C7/12—Bit line control circuits, e.g. drivers, boosters, pull-up circuits, pull-down circuits, precharging circuits, equalising circuits, for bit lines
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
- G11C16/0483—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells having several storage transistors connected in series
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/20—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by three-dimensional arrangements, e.g. with cells on different height levels
- H10B41/23—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels
- H10B41/27—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B43/00—EEPROM devices comprising charge-trapping gate insulators
- H10B43/20—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels
- H10B43/23—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels
- H10B43/27—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B43/00—EEPROM devices comprising charge-trapping gate insulators
- H10B43/30—EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region
- H10B43/35—EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region with cell select transistors, e.g. NAND
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Volatile Memory (AREA)
- Semiconductor Memories (AREA)
- Read Only Memory (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021-102805 | 2021-06-21 | ||
JP2021102805A JP2023001828A (ja) | 2021-06-21 | 2021-06-21 | 半導体記憶装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202301355A TW202301355A (zh) | 2023-01-01 |
TWI800995B true TWI800995B (zh) | 2023-05-01 |
Family
ID=84490356
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW110143000A TWI800995B (zh) | 2021-06-21 | 2021-11-18 | 半導體記憶裝置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US11929123B2 (zh) |
JP (1) | JP2023001828A (zh) |
CN (1) | CN115579034A (zh) |
TW (1) | TWI800995B (zh) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9171861B2 (en) * | 2013-05-07 | 2015-10-27 | SK Hynix Inc. | Semiconductor memory device and system having the same |
US10147731B2 (en) * | 2014-03-17 | 2018-12-04 | SK Hynix Inc. | Semiconductor device |
US20200335513A1 (en) * | 2019-04-17 | 2020-10-22 | Kioxia Corporation | Semiconductor memory device |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9397110B2 (en) | 2014-05-21 | 2016-07-19 | Macronix International Co., Ltd. | 3D independent double gate flash memory |
US9666594B2 (en) | 2014-09-05 | 2017-05-30 | Sandisk Technologies Llc | Multi-charge region memory cells for a vertical NAND device |
KR20160107553A (ko) * | 2015-03-04 | 2016-09-19 | 에스케이하이닉스 주식회사 | 반도체 장치 |
US10269828B2 (en) | 2017-03-27 | 2019-04-23 | Toshiba Memory Corporation | Semiconductor memory device |
JP6948892B2 (ja) | 2017-09-19 | 2021-10-13 | キオクシア株式会社 | 半導体記憶装置 |
JP2022048489A (ja) | 2020-09-15 | 2022-03-28 | キオクシア株式会社 | 半導体記憶装置 |
-
2021
- 2021-06-21 JP JP2021102805A patent/JP2023001828A/ja active Pending
- 2021-11-18 TW TW110143000A patent/TWI800995B/zh active
- 2021-12-07 CN CN202111516663.5A patent/CN115579034A/zh active Pending
- 2021-12-10 US US17/643,726 patent/US11929123B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9171861B2 (en) * | 2013-05-07 | 2015-10-27 | SK Hynix Inc. | Semiconductor memory device and system having the same |
US10147731B2 (en) * | 2014-03-17 | 2018-12-04 | SK Hynix Inc. | Semiconductor device |
US20200335513A1 (en) * | 2019-04-17 | 2020-10-22 | Kioxia Corporation | Semiconductor memory device |
Also Published As
Publication number | Publication date |
---|---|
TW202301355A (zh) | 2023-01-01 |
CN115579034A (zh) | 2023-01-06 |
US11929123B2 (en) | 2024-03-12 |
JP2023001828A (ja) | 2023-01-06 |
US20220406384A1 (en) | 2022-12-22 |
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