TWI799582B - 半導體裝置以及在其製造中使用的熱硬化性樹脂組成物以及切晶黏晶一體型帶 - Google Patents
半導體裝置以及在其製造中使用的熱硬化性樹脂組成物以及切晶黏晶一體型帶 Download PDFInfo
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- TWI799582B TWI799582B TW108116804A TW108116804A TWI799582B TW I799582 B TWI799582 B TW I799582B TW 108116804 A TW108116804 A TW 108116804A TW 108116804 A TW108116804 A TW 108116804A TW I799582 B TWI799582 B TW I799582B
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- 238000004519 manufacturing process Methods 0.000 title 1
- 239000011342 resin composition Substances 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
- 229920001187 thermosetting polymer Polymers 0.000 title 1
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- H01L2224/8319—Arrangement of the layer connectors prior to mounting
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- H01L2224/832—Applying energy for connecting
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- H01L2224/832—Applying energy for connecting
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- H01L2224/83203—Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
- H01L2224/83204—Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding with a graded temperature profile
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- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
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- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
- H01L2224/9222—Sequential connecting processes
- H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
- H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
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- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
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- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1017—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support
- H01L2225/1029—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support the support being a lead frame
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- H01L2225/1052—Wire or wire-like electrical connections
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/94—Batch processes at wafer-level, i.e. with connecting carried out on a wafer comprising a plurality of undiced individual devices
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
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- Adhesives Or Adhesive Processes (AREA)
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Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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WOPCT/JP2018/018765 | 2018-05-15 | ||
PCT/JP2018/018765 WO2019220540A1 (ja) | 2018-05-15 | 2018-05-15 | 半導体装置、並びに、その製造に使用する熱硬化性樹脂組成物及びダイシングダイボンディング一体型テープ |
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TW202010788A TW202010788A (zh) | 2020-03-16 |
TWI799582B true TWI799582B (zh) | 2023-04-21 |
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JP (1) | JP7136200B2 (ja) |
KR (1) | KR102482629B1 (ja) |
CN (1) | CN112204730A (ja) |
SG (1) | SG11202011196SA (ja) |
TW (1) | TWI799582B (ja) |
WO (1) | WO2019220540A1 (ja) |
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JP2022115581A (ja) * | 2021-01-28 | 2022-08-09 | 昭和電工マテリアルズ株式会社 | 半導体装置及びその製造方法、並びに、熱硬化性樹脂組成物、接着フィルム及びダイシング・ダイボンディング一体型フィルム |
JP2022182532A (ja) * | 2021-05-28 | 2022-12-08 | キオクシア株式会社 | 半導体装置およびその製造方法 |
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JP5236134B2 (ja) | 2001-01-26 | 2013-07-17 | 日立化成株式会社 | 接着剤組成物、接着部材、半導体搭載用支持部材及び半導体装置等 |
JP2005103180A (ja) | 2003-10-02 | 2005-04-21 | Matsushita Electric Ind Co Ltd | 洗濯機 |
US7560821B2 (en) * | 2005-03-24 | 2009-07-14 | Sumitomo Bakelite Company, Ltd | Area mount type semiconductor device, and die bonding resin composition and encapsulating resin composition used for the same |
JP5524465B2 (ja) | 2007-10-24 | 2014-06-18 | 日立化成株式会社 | 接着シート及びこれを用いた半導体装置およびその製造方法 |
JP2010118554A (ja) * | 2008-11-13 | 2010-05-27 | Nec Electronics Corp | 半導体装置およびその製造方法 |
JP5390209B2 (ja) * | 2009-02-04 | 2014-01-15 | 日東電工株式会社 | 熱硬化型ダイボンドフィルム |
JP5344097B2 (ja) * | 2010-11-18 | 2013-11-20 | 日立化成株式会社 | 半導体封止充てん用フィルム状樹脂組成物、半導体装置の製造方法及び半導体装置 |
JP5781794B2 (ja) * | 2011-03-11 | 2015-09-24 | 積水化学工業株式会社 | 接着剤層付き半導体チップ及び半導体装置の製造方法 |
CN106024654B (zh) * | 2012-03-08 | 2019-07-02 | 日立化成株式会社 | 半导体装置 |
JP2015120836A (ja) * | 2013-12-24 | 2015-07-02 | 日東電工株式会社 | 接着フィルム、ダイシング・ダイボンドフィルム、半導体装置の製造方法及び半導体装置 |
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TW202010788A (zh) | 2020-03-16 |
SG11202011196SA (en) | 2020-12-30 |
JP7136200B2 (ja) | 2022-09-13 |
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KR102482629B1 (ko) | 2022-12-29 |
WO2019220540A1 (ja) | 2019-11-21 |
KR102482629B9 (ko) | 2024-03-25 |
CN112204730A (zh) | 2021-01-08 |
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