TWI799557B - 樹脂組合物、密封片及密封體 - Google Patents

樹脂組合物、密封片及密封體 Download PDF

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Publication number
TWI799557B
TWI799557B TW108110666A TW108110666A TWI799557B TW I799557 B TWI799557 B TW I799557B TW 108110666 A TW108110666 A TW 108110666A TW 108110666 A TW108110666 A TW 108110666A TW I799557 B TWI799557 B TW I799557B
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Taiwan
Prior art keywords
sealing
resin composition
sheet
sealing body
sealing sheet
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TW108110666A
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English (en)
Chinese (zh)
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TW201942236A (zh
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前谷枝保
西嶋健太
樫尾幹広
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日商琳得科股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1515—Three-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/26—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/26—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C09J7/405—Adhesives in the form of films or foils characterised by release liners characterised by the substrate of the release liner
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesive Tapes (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Electroluminescent Light Sources (AREA)
  • Polyethers (AREA)
  • Manufacture Of Switches (AREA)
  • Optics & Photonics (AREA)
  • Absorbent Articles And Supports Therefor (AREA)
TW108110666A 2018-03-28 2019-03-27 樹脂組合物、密封片及密封體 TWI799557B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2018-061660 2018-03-28
JP2018061660 2018-03-28
JP2018128365 2018-07-05
JP2018-128365 2018-07-05

Publications (2)

Publication Number Publication Date
TW201942236A TW201942236A (zh) 2019-11-01
TWI799557B true TWI799557B (zh) 2023-04-21

Family

ID=68060182

Family Applications (3)

Application Number Title Priority Date Filing Date
TW108110666A TWI799557B (zh) 2018-03-28 2019-03-27 樹脂組合物、密封片及密封體
TW108110908A TWI801542B (zh) 2018-03-28 2019-03-28 電子裝置密封體、片狀接著劑、電子裝置密封用接著膜及電子裝置密封體的製造方法
TW108110910A TWI820103B (zh) 2018-03-28 2019-03-28 樹脂組合物、密封片及密封體

Family Applications After (2)

Application Number Title Priority Date Filing Date
TW108110908A TWI801542B (zh) 2018-03-28 2019-03-28 電子裝置密封體、片狀接著劑、電子裝置密封用接著膜及電子裝置密封體的製造方法
TW108110910A TWI820103B (zh) 2018-03-28 2019-03-28 樹脂組合物、密封片及密封體

Country Status (5)

Country Link
JP (3) JP7368348B2 (ko)
KR (3) KR20200138711A (ko)
CN (3) CN112088185B (ko)
TW (3) TWI799557B (ko)
WO (3) WO2019189616A1 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7368202B2 (ja) * 2019-11-29 2023-10-24 リンテック株式会社 封止シート
JP7485511B2 (ja) * 2019-12-25 2024-05-16 日東電工株式会社 シーリング方法
KR20240065096A (ko) * 2021-09-28 2024-05-14 린텍 가부시키가이샤 시트상 경화성 접착제 및 광학 부재

Citations (4)

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JPH11140414A (ja) * 1997-11-10 1999-05-25 Sekisui Chem Co Ltd 反応性ホットメルト接着剤組成物及び接着方法
JP2003238885A (ja) * 2002-02-18 2003-08-27 Nippon Paper Industries Co Ltd 紫外線硬化型コーティング組成物および成形品
CN102161793A (zh) * 2011-03-07 2011-08-24 黑龙江省润特科技有限公司 紫外光深度交联膨胀阻燃聚烯烃电缆料及其绝缘或护套层的制备方法
WO2018047868A1 (ja) * 2016-09-07 2018-03-15 リンテック株式会社 接着剤組成物、封止シート、及び封止体

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JP2002294196A (ja) * 2001-03-30 2002-10-09 Three M Innovative Properties Co 熱硬化性接着剤
EP1518912A4 (en) * 2002-06-17 2006-03-01 Sekisui Chemical Co Ltd ADHESIVE FOR SEALING AN ORGANIC ELECTROLUMINESCENT TELEPHONE AND USE THEREOF
JP5000238B2 (ja) * 2006-09-01 2012-08-15 株式会社ダイセル 活性エネルギー線硬化性封止剤および該封止剤を用いた光半導体装置
WO2009054168A1 (ja) * 2007-10-22 2009-04-30 Sharp Kabushiki Kaisha 表示装置及びその製造方法
JP4930623B2 (ja) * 2009-04-28 2012-05-16 日立化成工業株式会社 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及び回路部材の接続方法
JP5284880B2 (ja) * 2009-06-10 2013-09-11 株式会社カネカ 光硬化性組成物およびそれを用いた絶縁性薄膜および薄膜トランジスタ
KR101688057B1 (ko) 2010-08-09 2016-12-21 삼성디스플레이 주식회사 가시광선 감지 센서 및 이를 포함하는 광 센서
JPWO2012042665A1 (ja) * 2010-10-01 2014-02-03 リケンテクノス株式会社 接着剤組成物、塗料組成物およびこれを用いたプライマー、インクジェットインク、接着方法および積層体
JP5651421B2 (ja) * 2010-10-07 2015-01-14 三井化学株式会社 封止用組成物及びそれを用いた封止用シート
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DE102012202377A1 (de) 2011-10-21 2013-04-25 Tesa Se Klebemasse insbesondere zur Kapselung einer elektronischen Anordnung
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CN104508069B (zh) * 2012-08-02 2017-03-29 琳得科株式会社 膜状粘接剂、半导体接合用粘接片、和半导体装置的制造方法
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JP2017031383A (ja) 2015-08-06 2017-02-09 Jsr株式会社 有機電子デバイス用素子の封止用樹脂組成物
TWI751989B (zh) * 2015-12-01 2022-01-11 日商琳得科股份有限公司 接著劑組成物、封密板片及封密體
TWI729034B (zh) * 2015-12-01 2021-06-01 日商琳得科股份有限公司 接著劑組成物、封密用板片以及封密體
KR102556848B1 (ko) 2016-02-11 2023-07-18 삼성디스플레이 주식회사 표시 장치
KR102056178B1 (ko) * 2016-03-31 2019-12-16 후루카와 덴키 고교 가부시키가이샤 전자 디바이스 패키지용 테이프
KR102272537B1 (ko) * 2016-09-07 2021-07-02 린텍 가부시키가이샤 접착제 조성물, 봉지 시트, 및 봉지체
JP6746777B2 (ja) 2016-09-23 2020-08-26 エルジー・ケム・リミテッド 接着剤組成物

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11140414A (ja) * 1997-11-10 1999-05-25 Sekisui Chem Co Ltd 反応性ホットメルト接着剤組成物及び接着方法
JP2003238885A (ja) * 2002-02-18 2003-08-27 Nippon Paper Industries Co Ltd 紫外線硬化型コーティング組成物および成形品
CN102161793A (zh) * 2011-03-07 2011-08-24 黑龙江省润特科技有限公司 紫外光深度交联膨胀阻燃聚烯烃电缆料及其绝缘或护套层的制备方法
WO2018047868A1 (ja) * 2016-09-07 2018-03-15 リンテック株式会社 接着剤組成物、封止シート、及び封止体

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CN112088185B (zh) 2023-09-26
CN111955053B (zh) 2023-09-29
CN112088185A (zh) 2020-12-15
JP7348165B2 (ja) 2023-09-20
JPWO2019189617A1 (ja) 2021-04-22
TW201942304A (zh) 2019-11-01
TW202003773A (zh) 2020-01-16
KR102582788B1 (ko) 2023-09-25
KR20200138711A (ko) 2020-12-10
KR20200136368A (ko) 2020-12-07
JP7319964B2 (ja) 2023-08-02
JP7368348B2 (ja) 2023-10-24
CN111955053A (zh) 2020-11-17
JPWO2019189618A1 (ja) 2021-05-13
WO2019189618A1 (ja) 2019-10-03
JPWO2019189616A1 (ja) 2021-04-08
TWI820103B (zh) 2023-11-01
TWI801542B (zh) 2023-05-11
CN112041389A (zh) 2020-12-04
WO2019189616A1 (ja) 2019-10-03
TW201942236A (zh) 2019-11-01
WO2019189617A1 (ja) 2019-10-03
KR20200138172A (ko) 2020-12-09

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