TWI794664B - 控制可移動平台的位置的方法、壓印微影系統及製造物品的方法 - Google Patents

控制可移動平台的位置的方法、壓印微影系統及製造物品的方法 Download PDF

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Publication number
TWI794664B
TWI794664B TW109136284A TW109136284A TWI794664B TW I794664 B TWI794664 B TW I794664B TW 109136284 A TW109136284 A TW 109136284A TW 109136284 A TW109136284 A TW 109136284A TW I794664 B TWI794664 B TW I794664B
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TW
Taiwan
Prior art keywords
information
control signal
substrate
alignment
platform
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TW109136284A
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English (en)
Chinese (zh)
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TW202122936A (zh
Inventor
明吉 羅
傑佛瑞 克萊恩
孝宏 吉田
史蒂芬 詹金斯
炳鎮 崔
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日商佳能股份有限公司
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7042—Alignment for lithographic apparatus using patterning methods other than those involving the exposure to radiation, e.g. by stamping or imprinting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/301—Marks applied to devices, e.g. for alignment or identification for alignment

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
TW109136284A 2019-12-12 2020-10-20 控制可移動平台的位置的方法、壓印微影系統及製造物品的方法 TWI794664B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US16/712,739 2019-12-12
US16/712,739 US11422460B2 (en) 2019-12-12 2019-12-12 Alignment control in nanoimprint lithography using feedback and feedforward control

Publications (2)

Publication Number Publication Date
TW202122936A TW202122936A (zh) 2021-06-16
TWI794664B true TWI794664B (zh) 2023-03-01

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TW109136284A TWI794664B (zh) 2019-12-12 2020-10-20 控制可移動平台的位置的方法、壓印微影系統及製造物品的方法

Country Status (6)

Country Link
US (1) US11422460B2 (https=)
JP (1) JP7589231B2 (https=)
KR (1) KR102874085B1 (https=)
CN (1) CN114667485B (https=)
TW (1) TWI794664B (https=)
WO (1) WO2021118698A1 (https=)

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US12195382B2 (en) * 2021-12-01 2025-01-14 Canon Kabushiki Kaisha Superstrate and a method of using the same
CN118610132B (zh) * 2024-08-09 2024-10-29 青岛天仁微纳科技有限责任公司 一种基于晶圆检测数据的生成设备参数调节方法及系统
CN120969152A (zh) * 2025-09-23 2025-11-18 宁波市汉鸣科技股份有限公司 压缩机抽真空同步移动控制方法及装置

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CN101154056A (zh) * 2006-09-29 2008-04-02 富士胶片株式会社 描绘点数据取得方法及装置、描绘方法及装置
TW201702752A (zh) * 2015-04-03 2017-01-16 Ａｓｍｌ荷蘭公司 用於測量一目標結構之性質之檢測裝置、操作一光學系統之方法、製造器件之方法

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Publication number Publication date
CN114667485A (zh) 2022-06-24
US20210181622A1 (en) 2021-06-17
JP2023506342A (ja) 2023-02-16
US11422460B2 (en) 2022-08-23
KR102874085B1 (ko) 2025-10-22
WO2021118698A1 (en) 2021-06-17
CN114667485B (zh) 2025-08-19
KR20220093169A (ko) 2022-07-05
JP7589231B2 (ja) 2024-11-25
TW202122936A (zh) 2021-06-16

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