CN114667485B - 使用反馈和前馈控制的纳米压印光刻中的对准控制 - Google Patents

使用反馈和前馈控制的纳米压印光刻中的对准控制

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Publication number
CN114667485B
CN114667485B CN202080078826.3A CN202080078826A CN114667485B CN 114667485 B CN114667485 B CN 114667485B CN 202080078826 A CN202080078826 A CN 202080078826A CN 114667485 B CN114667485 B CN 114667485B
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CN
China
Prior art keywords
information
feedforward
alignment
substrate
control signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202080078826.3A
Other languages
English (en)
Chinese (zh)
Other versions
CN114667485A (zh
Inventor
娄明吉
崔炳镇
J·D·克莱因
吉田贵裕
S·T·詹金斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of CN114667485A publication Critical patent/CN114667485A/zh
Application granted granted Critical
Publication of CN114667485B publication Critical patent/CN114667485B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7042—Alignment for lithographic apparatus using patterning methods other than those involving the exposure to radiation, e.g. by stamping or imprinting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/301—Marks applied to devices, e.g. for alignment or identification for alignment

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
CN202080078826.3A 2019-12-12 2020-10-27 使用反馈和前馈控制的纳米压印光刻中的对准控制 Active CN114667485B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US16/712,739 2019-12-12
US16/712,739 US11422460B2 (en) 2019-12-12 2019-12-12 Alignment control in nanoimprint lithography using feedback and feedforward control
PCT/US2020/057520 WO2021118698A1 (en) 2019-12-12 2020-10-27 Alignment control in nanoimprint lithography using feedback and feedforward control

Publications (2)

Publication Number Publication Date
CN114667485A CN114667485A (zh) 2022-06-24
CN114667485B true CN114667485B (zh) 2025-08-19

Family

ID=76316959

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080078826.3A Active CN114667485B (zh) 2019-12-12 2020-10-27 使用反馈和前馈控制的纳米压印光刻中的对准控制

Country Status (6)

Country Link
US (1) US11422460B2 (https=)
JP (1) JP7589231B2 (https=)
KR (1) KR102874085B1 (https=)
CN (1) CN114667485B (https=)
TW (1) TWI794664B (https=)
WO (1) WO2021118698A1 (https=)

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* Cited by examiner, † Cited by third party
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US12195382B2 (en) * 2021-12-01 2025-01-14 Canon Kabushiki Kaisha Superstrate and a method of using the same
CN118610132B (zh) * 2024-08-09 2024-10-29 青岛天仁微纳科技有限责任公司 一种基于晶圆检测数据的生成设备参数调节方法及系统
CN120969152A (zh) * 2025-09-23 2025-11-18 宁波市汉鸣科技股份有限公司 压缩机抽真空同步移动控制方法及装置

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Also Published As

Publication number Publication date
TWI794664B (zh) 2023-03-01
CN114667485A (zh) 2022-06-24
US20210181622A1 (en) 2021-06-17
JP2023506342A (ja) 2023-02-16
US11422460B2 (en) 2022-08-23
KR102874085B1 (ko) 2025-10-22
WO2021118698A1 (en) 2021-06-17
KR20220093169A (ko) 2022-07-05
JP7589231B2 (ja) 2024-11-25
TW202122936A (zh) 2021-06-16

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