TWI793054B - 供給裝置、供給系統 - Google Patents

供給裝置、供給系統 Download PDF

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Publication number
TWI793054B
TWI793054B TW111133987A TW111133987A TWI793054B TW I793054 B TWI793054 B TW I793054B TW 111133987 A TW111133987 A TW 111133987A TW 111133987 A TW111133987 A TW 111133987A TW I793054 B TWI793054 B TW I793054B
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TW
Taiwan
Prior art keywords
liquid
supply
tank
pipe
region
Prior art date
Application number
TW111133987A
Other languages
English (en)
Chinese (zh)
Other versions
TW202312240A (zh
Inventor
古矢正明
小林浩秋
森秀樹
Original Assignee
日商芝浦機械電子裝置股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商芝浦機械電子裝置股份有限公司 filed Critical 日商芝浦機械電子裝置股份有限公司
Application granted granted Critical
Publication of TWI793054B publication Critical patent/TWI793054B/zh
Publication of TW202312240A publication Critical patent/TW202312240A/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1039—Recovery of excess liquid or other fluent material; Controlling means therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1042—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material provided with means for heating or cooling the liquid or other fluent material in the supplying means upstream of the applying apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1047—Apparatus or installations for supplying liquid or other fluent material comprising a buffer container or an accumulator between the supply source and the applicator
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/11—Vats or other containers for liquids or other fluent materials

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  • Weting (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Input Circuits Of Receivers And Coupling Of Receivers And Audio Equipment (AREA)
  • Telephone Function (AREA)
  • Feeding Of Articles To Conveyors (AREA)
TW111133987A 2021-09-13 2022-09-08 供給裝置、供給系統 TWI793054B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-148850 2021-09-13
JP2021148850A JP7438172B2 (ja) 2021-09-13 2021-09-13 供給装置、供給システム

Publications (2)

Publication Number Publication Date
TWI793054B true TWI793054B (zh) 2023-02-11
TW202312240A TW202312240A (zh) 2023-03-16

Family

ID=85478152

Family Applications (2)

Application Number Title Priority Date Filing Date
TW112100005A TWI828504B (zh) 2021-09-13 2022-09-08 供給裝置、供給系統
TW111133987A TWI793054B (zh) 2021-09-13 2022-09-08 供給裝置、供給系統

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW112100005A TWI828504B (zh) 2021-09-13 2022-09-08 供給裝置、供給系統

Country Status (5)

Country Link
US (1) US12318803B2 (enExample)
JP (1) JP7438172B2 (enExample)
KR (1) KR102718065B1 (enExample)
CN (1) CN115810563B (enExample)
TW (2) TWI828504B (enExample)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201819685A (zh) * 2016-09-30 2018-06-01 日商斯庫林集團股份有限公司 基板處理裝置
CN111905412A (zh) * 2019-05-10 2020-11-10 杉野机械股份有限公司 液体处理装置以及液体处理方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08174420A (ja) * 1994-12-26 1996-07-09 Fuji Oozx Inc 水溶性研削液の自動補充装置
JP2001062669A (ja) 1999-08-24 2001-03-13 Nikon Corp 加工方法およびその装置
JP3761457B2 (ja) 2001-12-04 2006-03-29 Ｎｅｃエレクトロニクス株式会社 半導体基板の薬液処理装置
JP2007258462A (ja) 2006-03-23 2007-10-04 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP5477375B2 (ja) * 2009-03-31 2014-04-23 栗田工業株式会社 エッチング液の処理装置及び処理方法
KR101255018B1 (ko) * 2010-06-07 2013-04-16 쿠리타 고교 가부시키가이샤 세정 시스템 및 세정 방법
CN103094151B (zh) * 2011-10-27 2015-07-22 沈阳芯源微电子设备有限公司 一种化学液回收装置
KR101380494B1 (ko) * 2011-12-27 2014-04-01 시바우라 메카트로닉스 가부시끼가이샤 기판의 처리 장치 및 처리 방법
JP6010457B2 (ja) 2012-12-28 2016-10-19 東京エレクトロン株式会社 液処理装置および薬液回収方法
US10046371B2 (en) * 2013-03-29 2018-08-14 Semes Co., Ltd. Recycling unit, substrate treating apparatus and recycling method using the recycling unit
JP6502633B2 (ja) 2013-09-30 2019-04-17 芝浦メカトロニクス株式会社 基板処理方法及び基板処理装置
JP6022431B2 (ja) * 2013-10-17 2016-11-09 東京エレクトロン株式会社 基板液処理装置及び基板液処理方法
JP6839990B2 (ja) * 2017-01-31 2021-03-10 株式会社Ｓｃｒｅｅｎホールディングス 処理液供給装置、基板処理装置、および処理液供給方法
US20190203342A1 (en) * 2017-12-29 2019-07-04 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Cooling system and evaporation machine
JP6869306B2 (ja) * 2019-09-30 2021-05-12 月島機械株式会社 熱媒体利用機器への熱媒体供給方法及び熱媒体利用設備

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201819685A (zh) * 2016-09-30 2018-06-01 日商斯庫林集團股份有限公司 基板處理裝置
CN111905412A (zh) * 2019-05-10 2020-11-10 杉野机械股份有限公司 液体处理装置以及液体处理方法

Also Published As

Publication number Publication date
CN115810563A (zh) 2023-03-17
JP2023041461A (ja) 2023-03-24
KR20230039533A (ko) 2023-03-21
US12318803B2 (en) 2025-06-03
TW202312240A (zh) 2023-03-16
CN115810563B (zh) 2025-07-08
US20230081295A1 (en) 2023-03-16
JP7438172B2 (ja) 2024-02-26
KR102718065B1 (ko) 2024-10-15
TW202318481A (zh) 2023-05-01
TWI828504B (zh) 2024-01-01

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