TWI792396B - 盒筐體、探針器、伺服器機架及儲存系統 - Google Patents

盒筐體、探針器、伺服器機架及儲存系統 Download PDF

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Publication number
TWI792396B
TWI792396B TW110125116A TW110125116A TWI792396B TW I792396 B TWI792396 B TW I792396B TW 110125116 A TW110125116 A TW 110125116A TW 110125116 A TW110125116 A TW 110125116A TW I792396 B TWI792396 B TW I792396B
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TW
Taiwan
Prior art keywords
wafer
medium solution
housing
heat medium
storage system
Prior art date
Application number
TW110125116A
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English (en)
Chinese (zh)
Other versions
TW202237507A (zh
Inventor
人見達郎
吉水康人
井上新
堂前宏之
早坂一人
佐貫朋也
Original Assignee
日商鎧俠股份有限公司
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Application filed by 日商鎧俠股份有限公司 filed Critical 日商鎧俠股份有限公司
Publication of TW202237507A publication Critical patent/TW202237507A/zh
Application granted granted Critical
Publication of TWI792396B publication Critical patent/TWI792396B/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3404—Storage means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/56—External testing equipment for static stores, e.g. automatic test equipment [ATE]; Interfaces therefor
    • G11C29/56016—Apparatus features
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1902—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers specially adapted for a single substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3218—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H10P72/3412—Batch transfer of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/27—Structural arrangements therefor
    • H10P74/273—Interconnections for measuring or testing, e.g. probe pads
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/56—External testing equipment for static stores, e.g. automatic test equipment [ATE]; Interfaces therefor
    • G11C2029/5602—Interface to device under test
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/04—Arrangements for writing information into, or reading information out from, a digital store with means for avoiding disturbances due to temperature effects

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Memory System (AREA)
  • Casings For Electric Apparatus (AREA)
  • Stored Programmes (AREA)
TW110125116A 2021-03-23 2021-07-08 盒筐體、探針器、伺服器機架及儲存系統 TWI792396B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
WOPCT/JP2021/011858 2021-03-23
PCT/JP2021/011858 WO2022201285A1 (ja) 2021-03-23 2021-03-23 カセット筐体、プローバー、サーバーラックおよびストレージシステム

Publications (2)

Publication Number Publication Date
TW202237507A TW202237507A (zh) 2022-10-01
TWI792396B true TWI792396B (zh) 2023-02-11

Family

ID=83396431

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110125116A TWI792396B (zh) 2021-03-23 2021-07-08 盒筐體、探針器、伺服器機架及儲存系統

Country Status (7)

Country Link
US (1) US20240014061A1 (https=)
EP (1) EP4276632A4 (https=)
JP (1) JP7456066B2 (https=)
CN (1) CN116368474A (https=)
DE (1) DE112021007357T5 (https=)
TW (1) TWI792396B (https=)
WO (1) WO2022201285A1 (https=)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6072325A (en) * 1993-07-20 2000-06-06 Tokyo Electron Kabushiki Kaisha Probe device
US7492176B2 (en) * 2006-07-20 2009-02-17 Tokyo Seimitsu Co., Ltd. Prober and probe contact method
TWI312547B (https=) * 2005-09-22 2009-07-21 Tokyo Electron Limite
US7859283B2 (en) * 2008-02-22 2010-12-28 Tokyo Electron Limited Probe apparatus, probing method, and storage medium
US8643361B2 (en) * 2010-07-14 2014-02-04 Sensirion Ag Needle head
TWI631344B (zh) * 2013-07-11 2018-08-01 日商東京威力科創股份有限公司 Probe device
CN109425764A (zh) * 2017-08-22 2019-03-05 三星电子株式会社 探针卡、包括该探针卡的测试装置以及相关的制造方法
TWI706487B (zh) * 2016-03-28 2020-10-01 日商東京精密股份有限公司 探針機台及探針機台的操作方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3963985A (en) * 1974-12-12 1976-06-15 International Business Machines Corporation Probe device having probe heads and method of adjusting distances between probe heads
JP3529581B2 (ja) * 1997-03-14 2004-05-24 東芝マイクロエレクトロニクス株式会社 半導体ウェーハ及びｉｃカード
US6468098B1 (en) * 1999-08-17 2002-10-22 Formfactor, Inc. Electrical contactor especially wafer level contactor using fluid pressure
US20060145715A1 (en) * 2005-01-06 2006-07-06 Salmon Peter C Wafer level test head
JP4996184B2 (ja) 2006-09-19 2012-08-08 東京エレクトロン株式会社 ウエハの温度制御装置及びウエハの温度制御方法
EP1959265A1 (en) * 2007-02-16 2008-08-20 Eles Semiconductor Equipment S.P.A. Testing integrated circuits on a wafer with a cartridge leaving exposed a surface thereof
JP5427536B2 (ja) * 2009-10-01 2014-02-26 東京エレクトロン株式会社 プローブカード
JP6339035B2 (ja) * 2015-03-13 2018-06-06 東芝メモリ株式会社 電子機器
KR102311459B1 (ko) * 2017-03-14 2021-10-13 가부시키가이샤 코쿠사이 엘렉트릭 기판 처리 장치, 반도체 장치의 제조 방법, 및 프로그램
JP6832804B2 (ja) 2017-07-20 2021-02-24 東京エレクトロン株式会社 基板載置台及び基板検査装置
JP7336256B2 (ja) 2019-05-10 2023-08-31 東京エレクトロン株式会社 載置台及び載置台の作製方法
JP7274350B2 (ja) * 2019-05-28 2023-05-16 東京エレクトロン株式会社 搬送システム、検査システム及び検査方法
WO2021095252A1 (ja) 2019-11-15 2021-05-20 キオクシア株式会社 ストレージデバイスおよびストレージシステム

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6072325A (en) * 1993-07-20 2000-06-06 Tokyo Electron Kabushiki Kaisha Probe device
TWI312547B (https=) * 2005-09-22 2009-07-21 Tokyo Electron Limite
US7492176B2 (en) * 2006-07-20 2009-02-17 Tokyo Seimitsu Co., Ltd. Prober and probe contact method
US7859283B2 (en) * 2008-02-22 2010-12-28 Tokyo Electron Limited Probe apparatus, probing method, and storage medium
US8643361B2 (en) * 2010-07-14 2014-02-04 Sensirion Ag Needle head
TWI631344B (zh) * 2013-07-11 2018-08-01 日商東京威力科創股份有限公司 Probe device
TWI706487B (zh) * 2016-03-28 2020-10-01 日商東京精密股份有限公司 探針機台及探針機台的操作方法
CN109425764A (zh) * 2017-08-22 2019-03-05 三星电子株式会社 探针卡、包括该探针卡的测试装置以及相关的制造方法

Also Published As

Publication number Publication date
WO2022201285A1 (ja) 2022-09-29
TW202237507A (zh) 2022-10-01
JP7456066B2 (ja) 2024-03-26
EP4276632A1 (en) 2023-11-15
JPWO2022201285A1 (https=) 2022-09-29
EP4276632A4 (en) 2025-01-29
US20240014061A1 (en) 2024-01-11
CN116368474A (zh) 2023-06-30
DE112021007357T5 (de) 2024-03-21

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