JPWO2022201285A1 - - Google Patents

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Publication number
JPWO2022201285A1
JPWO2022201285A1 JP2023508202A JP2023508202A JPWO2022201285A1 JP WO2022201285 A1 JPWO2022201285 A1 JP WO2022201285A1 JP 2023508202 A JP2023508202 A JP 2023508202A JP 2023508202 A JP2023508202 A JP 2023508202A JP WO2022201285 A1 JPWO2022201285 A1 JP WO2022201285A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023508202A
Other languages
Japanese (ja)
Other versions
JP7456066B2 (ja
JPWO2022201285A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022201285A1 publication Critical patent/JPWO2022201285A1/ja
Publication of JPWO2022201285A5 publication Critical patent/JPWO2022201285A5/ja
Application granted granted Critical
Publication of JP7456066B2 publication Critical patent/JP7456066B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3404—Storage means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/56—External testing equipment for static stores, e.g. automatic test equipment [ATE]; Interfaces therefor
    • G11C29/56016—Apparatus features
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1902—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers specially adapted for a single substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3218—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H10P72/3412—Batch transfer of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/27—Structural arrangements therefor
    • H10P74/273—Interconnections for measuring or testing, e.g. probe pads
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/56—External testing equipment for static stores, e.g. automatic test equipment [ATE]; Interfaces therefor
    • G11C2029/5602—Interface to device under test
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/04—Arrangements for writing information into, or reading information out from, a digital store with means for avoiding disturbances due to temperature effects

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Memory System (AREA)
  • Casings For Electric Apparatus (AREA)
  • Stored Programmes (AREA)
JP2023508202A 2021-03-23 2021-03-23 カセット筐体、プローバー、サーバーラックおよびストレージシステム Active JP7456066B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/011858 WO2022201285A1 (ja) 2021-03-23 2021-03-23 カセット筐体、プローバー、サーバーラックおよびストレージシステム

Publications (3)

Publication Number Publication Date
JPWO2022201285A1 true JPWO2022201285A1 (https=) 2022-09-29
JPWO2022201285A5 JPWO2022201285A5 (https=) 2023-07-12
JP7456066B2 JP7456066B2 (ja) 2024-03-26

Family

ID=83396431

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023508202A Active JP7456066B2 (ja) 2021-03-23 2021-03-23 カセット筐体、プローバー、サーバーラックおよびストレージシステム

Country Status (7)

Country Link
US (1) US20240014061A1 (https=)
EP (1) EP4276632A4 (https=)
JP (1) JP7456066B2 (https=)
CN (1) CN116368474A (https=)
DE (1) DE112021007357T5 (https=)
TW (1) TWI792396B (https=)
WO (1) WO2022201285A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016171241A (ja) * 2015-03-13 2016-09-23 株式会社東芝 電子機器
JP2020194889A (ja) * 2019-05-28 2020-12-03 東京エレクトロン株式会社 搬送システム、検査システム及び検査方法
WO2021095252A1 (ja) * 2019-11-15 2021-05-20 キオクシア株式会社 ストレージデバイスおよびストレージシステム

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3963985A (en) * 1974-12-12 1976-06-15 International Business Machines Corporation Probe device having probe heads and method of adjusting distances between probe heads
US5550482A (en) * 1993-07-20 1996-08-27 Tokyo Electron Kabushiki Kaisha Probe device
JP3529581B2 (ja) * 1997-03-14 2004-05-24 東芝マイクロエレクトロニクス株式会社 半導体ウェーハ及びｉｃカード
US6468098B1 (en) * 1999-08-17 2002-10-22 Formfactor, Inc. Electrical contactor especially wafer level contactor using fluid pressure
US20060145715A1 (en) * 2005-01-06 2006-07-06 Salmon Peter C Wafer level test head
JP2007088203A (ja) * 2005-09-22 2007-04-05 Tokyo Electron Ltd ウエハ検査装置およびウエハ検査方法、ならびにコンピュータプログラム
JP4744382B2 (ja) * 2006-07-20 2011-08-10 株式会社東京精密 プローバ及びプローブ接触方法
JP4996184B2 (ja) 2006-09-19 2012-08-08 東京エレクトロン株式会社 ウエハの温度制御装置及びウエハの温度制御方法
EP1959265A1 (en) * 2007-02-16 2008-08-20 Eles Semiconductor Equipment S.P.A. Testing integrated circuits on a wafer with a cartridge leaving exposed a surface thereof
JP5088167B2 (ja) * 2008-02-22 2012-12-05 東京エレクトロン株式会社 プローブ装置、プロービング方法及び記憶媒体
JP5427536B2 (ja) * 2009-10-01 2014-02-26 東京エレクトロン株式会社 プローブカード
EP2418503B1 (en) * 2010-07-14 2013-07-03 Sensirion AG Needle head
JP6289962B2 (ja) * 2013-07-11 2018-03-07 東京エレクトロン株式会社 プローブ装置
WO2017170393A1 (ja) * 2016-03-28 2017-10-05 株式会社東京精密 プローバ及びプローバの操作方法
KR102311459B1 (ko) * 2017-03-14 2021-10-13 가부시키가이샤 코쿠사이 엘렉트릭 기판 처리 장치, 반도체 장치의 제조 방법, 및 프로그램
JP6832804B2 (ja) 2017-07-20 2021-02-24 東京エレクトロン株式会社 基板載置台及び基板検査装置
KR20190021101A (ko) * 2017-08-22 2019-03-05 삼성전자주식회사 프로브 카드, 프로브 카드를 포함한 테스트 장치, 그 프로브 카드를 이용한 테스트 방법 및 반도체 소자 제조방법
JP7336256B2 (ja) 2019-05-10 2023-08-31 東京エレクトロン株式会社 載置台及び載置台の作製方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016171241A (ja) * 2015-03-13 2016-09-23 株式会社東芝 電子機器
JP2020194889A (ja) * 2019-05-28 2020-12-03 東京エレクトロン株式会社 搬送システム、検査システム及び検査方法
WO2021095252A1 (ja) * 2019-11-15 2021-05-20 キオクシア株式会社 ストレージデバイスおよびストレージシステム

Also Published As

Publication number Publication date
WO2022201285A1 (ja) 2022-09-29
TW202237507A (zh) 2022-10-01
TWI792396B (zh) 2023-02-11
JP7456066B2 (ja) 2024-03-26
EP4276632A1 (en) 2023-11-15
EP4276632A4 (en) 2025-01-29
US20240014061A1 (en) 2024-01-11
CN116368474A (zh) 2023-06-30
DE112021007357T5 (de) 2024-03-21

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