TWI785195B - 半導體裝置 - Google Patents

半導體裝置 Download PDF

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Publication number
TWI785195B
TWI785195B TW108103065A TW108103065A TWI785195B TW I785195 B TWI785195 B TW I785195B TW 108103065 A TW108103065 A TW 108103065A TW 108103065 A TW108103065 A TW 108103065A TW I785195 B TWI785195 B TW I785195B
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TW
Taiwan
Prior art keywords
light
receiving
receiving element
mentioned
emitting element
Prior art date
Application number
TW108103065A
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English (en)
Chinese (zh)
Other versions
TW201941447A (zh
Inventor
黒羽淳史
Original Assignee
日商青井電子股份有限公司
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Publication date
Application filed by 日商青井電子股份有限公司 filed Critical 日商青井電子股份有限公司
Publication of TW201941447A publication Critical patent/TW201941447A/zh
Application granted granted Critical
Publication of TWI785195B publication Critical patent/TWI785195B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
  • Bipolar Transistors (AREA)
  • Noodles (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW108103065A 2018-01-29 2019-01-28 半導體裝置 TWI785195B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2018012842A JP6620176B2 (ja) 2018-01-29 2018-01-29 半導体装置
JPJP2018-012842 2018-01-29
PCT/JP2018/047287 WO2019146339A1 (ja) 2018-01-29 2018-12-21 半導体装置
??PCT/JP2018/047287 2018-12-21
WOPCT/JP2018/047287 2018-12-21

Publications (2)

Publication Number Publication Date
TW201941447A TW201941447A (zh) 2019-10-16
TWI785195B true TWI785195B (zh) 2022-12-01

Family

ID=67395853

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108103065A TWI785195B (zh) 2018-01-29 2019-01-28 半導體裝置

Country Status (5)

Country Link
JP (1) JP6620176B2 (ja)
KR (1) KR102459822B1 (ja)
CN (1) CN111656540B (ja)
TW (1) TWI785195B (ja)
WO (1) WO2019146339A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7189994B2 (ja) * 2021-04-16 2022-12-14 アオイ電子株式会社 半導体装置およびその製造方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06204508A (ja) * 1992-12-28 1994-07-22 Canon Inc 光学式検出装置
JP2005038956A (ja) * 2003-07-17 2005-02-10 Matsushita Electric Ind Co Ltd 光部品とその製造方法
JP2005043192A (ja) * 2003-07-28 2005-02-17 Olympus Corp 光学式エンコーダ及びその製造方法並びに光学レンズモジュール
JP3684823B2 (ja) * 1998-03-26 2005-08-17 松下電工株式会社 半導体リレー
JP2005283457A (ja) * 2004-03-30 2005-10-13 Olympus Corp 光学式エンコーダ及びその製造方法
KR20110033744A (ko) * 2009-09-25 2011-03-31 전자부품연구원 발광 및 수광 소자가 일체로 형성된 패키지 모듈
CN106575660A (zh) * 2014-07-25 2017-04-19 赫普塔冈微光有限公司 包括具有彼此光学分离的区域的图像传感器的光电子模块

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6132535A (ja) * 1984-07-25 1986-02-15 Sanyo Electric Co Ltd センサの製造方法
JP3573400B2 (ja) * 1997-07-16 2004-10-06 シャープ株式会社 光学式入力装置
JP3819664B2 (ja) * 2000-03-08 2006-09-13 シャープ株式会社 光結合素子
JP4812189B2 (ja) * 2001-06-15 2011-11-09 オリンパス株式会社 光学式検出装置
EP1376960A1 (en) 2002-06-29 2004-01-02 Deutsche Thomson-Brandt Gmbh Data link layer device with two transmission modes for a serial communication bus
JP2004063764A (ja) * 2002-07-29 2004-02-26 Toshiba Corp 光結合半導体装置、およびその製造方法
JP5381280B2 (ja) * 2009-04-23 2014-01-08 オムロン株式会社 光結合装置
WO2013190871A1 (ja) * 2012-06-20 2013-12-27 アオイ電子株式会社 光源一体型光センサ
EP2860497B2 (de) * 2013-10-09 2019-04-10 SICK STEGMANN GmbH Optoelektronischer Sensor und Verfahren zur Herstellung eines solchen
JP2015095584A (ja) * 2013-11-13 2015-05-18 ローム株式会社 光学装置、光学装置の製造方法
JP2015177052A (ja) * 2014-03-14 2015-10-05 株式会社東芝 光結合装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06204508A (ja) * 1992-12-28 1994-07-22 Canon Inc 光学式検出装置
JP3684823B2 (ja) * 1998-03-26 2005-08-17 松下電工株式会社 半導体リレー
JP2005038956A (ja) * 2003-07-17 2005-02-10 Matsushita Electric Ind Co Ltd 光部品とその製造方法
JP2005043192A (ja) * 2003-07-28 2005-02-17 Olympus Corp 光学式エンコーダ及びその製造方法並びに光学レンズモジュール
JP2005283457A (ja) * 2004-03-30 2005-10-13 Olympus Corp 光学式エンコーダ及びその製造方法
KR20110033744A (ko) * 2009-09-25 2011-03-31 전자부품연구원 발광 및 수광 소자가 일체로 형성된 패키지 모듈
CN106575660A (zh) * 2014-07-25 2017-04-19 赫普塔冈微光有限公司 包括具有彼此光学分离的区域的图像传感器的光电子模块

Also Published As

Publication number Publication date
JP6620176B2 (ja) 2019-12-11
KR20200090239A (ko) 2020-07-28
CN111656540A (zh) 2020-09-11
KR102459822B1 (ko) 2022-10-26
CN111656540B (zh) 2023-06-13
WO2019146339A1 (ja) 2019-08-01
JP2019133994A (ja) 2019-08-08
TW201941447A (zh) 2019-10-16

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