TWI780290B - 感光化射線性或感放射線性樹脂組成物、感光化射線性或感放射線性樹脂組成物用樹脂之製造方法、感光化射線性或感放射線性膜、圖案形成方法及電子器件之製造方法 - Google Patents
感光化射線性或感放射線性樹脂組成物、感光化射線性或感放射線性樹脂組成物用樹脂之製造方法、感光化射線性或感放射線性膜、圖案形成方法及電子器件之製造方法 Download PDFInfo
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- TWI780290B TWI780290B TW108100615A TW108100615A TWI780290B TW I780290 B TWI780290 B TW I780290B TW 108100615 A TW108100615 A TW 108100615A TW 108100615 A TW108100615 A TW 108100615A TW I780290 B TWI780290 B TW I780290B
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F8/00—Chemical modification by after-treatment
- C08F8/12—Hydrolysis
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Materials For Photolithography (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018035999 | 2018-02-28 | ||
JP2018-035999 | 2018-02-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201936665A TW201936665A (zh) | 2019-09-16 |
TWI780290B true TWI780290B (zh) | 2022-10-11 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW108100615A TWI780290B (zh) | 2018-02-28 | 2019-01-08 | 感光化射線性或感放射線性樹脂組成物、感光化射線性或感放射線性樹脂組成物用樹脂之製造方法、感光化射線性或感放射線性膜、圖案形成方法及電子器件之製造方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPWO2019167419A1 (ko) |
KR (1) | KR102361263B1 (ko) |
TW (1) | TWI780290B (ko) |
WO (1) | WO2019167419A1 (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN118235092A (zh) | 2021-11-15 | 2024-06-21 | 日产化学株式会社 | 多环芳香族烃系光固化性树脂组合物 |
JP2024045816A (ja) | 2022-09-22 | 2024-04-03 | 信越化学工業株式会社 | ポリマー、化学増幅ポジ型レジスト組成物、レジストパターン形成方法、及びマスクブランク |
US20240329532A1 (en) | 2023-03-17 | 2024-10-03 | Shin-Etsu Chemical Co., Ltd. | Acetal modifier, polymer, chemically amplified positive resist composition, and resist pattern forming process |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105122138A (zh) * | 2013-05-02 | 2015-12-02 | 富士胶片株式会社 | 图案形成方法、感光化射线性或感放射线性树脂组合物、抗蚀剂膜、电子元件的制造方法及电子元件 |
CN105629664A (zh) * | 2014-11-25 | 2016-06-01 | 信越化学工业株式会社 | 光掩模坯、抗蚀剂图案形成方法和光掩模的制造方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5510086B2 (ja) * | 2010-06-08 | 2014-06-04 | Jsr株式会社 | (メタ)アクリル酸系重合体および感放射線性樹脂組成物 |
JP5740375B2 (ja) * | 2011-09-30 | 2015-06-24 | 富士フイルム株式会社 | 感活性光線性又は感放射線性樹脂組成物、並びに、それを用いた感活性光線性又は感放射線性膜及びパターン形成方法 |
JP6134539B2 (ja) | 2013-02-28 | 2017-05-24 | 富士フイルム株式会社 | 感活性光線性又は感放射線性樹脂組成物、感活性光線性又は感放射線性膜、パターン形成方法及び電子デバイスの製造方法 |
KR102139060B1 (ko) * | 2015-09-30 | 2020-07-29 | 후지필름 가부시키가이샤 | 레지스트 조성물과, 이를 이용한 레지스트막, 패턴 형성 방법 및 전자 디바이스의 제조 방법 |
-
2018
- 2018-12-27 KR KR1020207017070A patent/KR102361263B1/ko active IP Right Grant
- 2018-12-27 WO PCT/JP2018/048317 patent/WO2019167419A1/ja active Application Filing
- 2018-12-27 JP JP2020502832A patent/JPWO2019167419A1/ja active Pending
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2019
- 2019-01-08 TW TW108100615A patent/TWI780290B/zh active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105122138A (zh) * | 2013-05-02 | 2015-12-02 | 富士胶片株式会社 | 图案形成方法、感光化射线性或感放射线性树脂组合物、抗蚀剂膜、电子元件的制造方法及电子元件 |
CN105629664A (zh) * | 2014-11-25 | 2016-06-01 | 信越化学工业株式会社 | 光掩模坯、抗蚀剂图案形成方法和光掩模的制造方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2019167419A1 (ja) | 2019-09-06 |
KR102361263B1 (ko) | 2022-02-14 |
JPWO2019167419A1 (ja) | 2021-02-04 |
TW201936665A (zh) | 2019-09-16 |
KR20200075021A (ko) | 2020-06-25 |
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