TWI780290B - 感光化射線性或感放射線性樹脂組成物、感光化射線性或感放射線性樹脂組成物用樹脂之製造方法、感光化射線性或感放射線性膜、圖案形成方法及電子器件之製造方法 - Google Patents

感光化射線性或感放射線性樹脂組成物、感光化射線性或感放射線性樹脂組成物用樹脂之製造方法、感光化射線性或感放射線性膜、圖案形成方法及電子器件之製造方法 Download PDF

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Publication number
TWI780290B
TWI780290B TW108100615A TW108100615A TWI780290B TW I780290 B TWI780290 B TW I780290B TW 108100615 A TW108100615 A TW 108100615A TW 108100615 A TW108100615 A TW 108100615A TW I780290 B TWI780290 B TW I780290B
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Taiwan
Prior art keywords
group
sensitive
radiation
general formula
resin composition
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TW108100615A
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English (en)
Chinese (zh)
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TW201936665A (zh
Inventor
三好太朗
米久田康智
高橋孝太郎
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日商富士軟片股份有限公司
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Publication of TW201936665A publication Critical patent/TW201936665A/zh
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/039Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00Chemical modification by after-treatment
    • C08F8/12Hydrolysis
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0045Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
TW108100615A 2018-02-28 2019-01-08 感光化射線性或感放射線性樹脂組成物、感光化射線性或感放射線性樹脂組成物用樹脂之製造方法、感光化射線性或感放射線性膜、圖案形成方法及電子器件之製造方法 TWI780290B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018035999 2018-02-28
JP2018-035999 2018-02-28

Publications (2)

Publication Number Publication Date
TW201936665A TW201936665A (zh) 2019-09-16
TWI780290B true TWI780290B (zh) 2022-10-11

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TW108100615A TWI780290B (zh) 2018-02-28 2019-01-08 感光化射線性或感放射線性樹脂組成物、感光化射線性或感放射線性樹脂組成物用樹脂之製造方法、感光化射線性或感放射線性膜、圖案形成方法及電子器件之製造方法

Country Status (4)

Country Link
JP (1) JPWO2019167419A1 (ko)
KR (1) KR102361263B1 (ko)
TW (1) TWI780290B (ko)
WO (1) WO2019167419A1 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118235092A (zh) 2021-11-15 2024-06-21 日产化学株式会社 多环芳香族烃系光固化性树脂组合物
JP2024045816A (ja) 2022-09-22 2024-04-03 信越化学工業株式会社 ポリマー、化学増幅ポジ型レジスト組成物、レジストパターン形成方法、及びマスクブランク
US20240329532A1 (en) 2023-03-17 2024-10-03 Shin-Etsu Chemical Co., Ltd. Acetal modifier, polymer, chemically amplified positive resist composition, and resist pattern forming process

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105122138A (zh) * 2013-05-02 2015-12-02 富士胶片株式会社 图案形成方法、感光化射线性或感放射线性树脂组合物、抗蚀剂膜、电子元件的制造方法及电子元件
CN105629664A (zh) * 2014-11-25 2016-06-01 信越化学工业株式会社 光掩模坯、抗蚀剂图案形成方法和光掩模的制造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5510086B2 (ja) * 2010-06-08 2014-06-04 Jsr株式会社 (メタ)アクリル酸系重合体および感放射線性樹脂組成物
JP5740375B2 (ja) * 2011-09-30 2015-06-24 富士フイルム株式会社 感活性光線性又は感放射線性樹脂組成物、並びに、それを用いた感活性光線性又は感放射線性膜及びパターン形成方法
JP6134539B2 (ja) 2013-02-28 2017-05-24 富士フイルム株式会社 感活性光線性又は感放射線性樹脂組成物、感活性光線性又は感放射線性膜、パターン形成方法及び電子デバイスの製造方法
KR102139060B1 (ko) * 2015-09-30 2020-07-29 후지필름 가부시키가이샤 레지스트 조성물과, 이를 이용한 레지스트막, 패턴 형성 방법 및 전자 디바이스의 제조 방법

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105122138A (zh) * 2013-05-02 2015-12-02 富士胶片株式会社 图案形成方法、感光化射线性或感放射线性树脂组合物、抗蚀剂膜、电子元件的制造方法及电子元件
CN105629664A (zh) * 2014-11-25 2016-06-01 信越化学工业株式会社 光掩模坯、抗蚀剂图案形成方法和光掩模的制造方法

Also Published As

Publication number Publication date
WO2019167419A1 (ja) 2019-09-06
KR102361263B1 (ko) 2022-02-14
JPWO2019167419A1 (ja) 2021-02-04
TW201936665A (zh) 2019-09-16
KR20200075021A (ko) 2020-06-25

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