TWI779208B - 黏著劑組成物及黏著薄片 - Google Patents

黏著劑組成物及黏著薄片 Download PDF

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Publication number
TWI779208B
TWI779208B TW108122309A TW108122309A TWI779208B TW I779208 B TWI779208 B TW I779208B TW 108122309 A TW108122309 A TW 108122309A TW 108122309 A TW108122309 A TW 108122309A TW I779208 B TWI779208 B TW I779208B
Authority
TW
Taiwan
Prior art keywords
resin
adhesive
meth
adhesive composition
acrylate
Prior art date
Application number
TW108122309A
Other languages
English (en)
Chinese (zh)
Other versions
TW202020088A (zh
Inventor
佐佐木一博
池谷達宏
中西健一
Original Assignee
日商昭和電工股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商昭和電工股份有限公司 filed Critical 日商昭和電工股份有限公司
Publication of TW202020088A publication Critical patent/TW202020088A/zh
Application granted granted Critical
Publication of TWI779208B publication Critical patent/TWI779208B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00—Chemical modification by after-treatment
    • C08F8/14—Esterification
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C09J163/10—Epoxy resins modified by unsaturated compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Dicing (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
TW108122309A 2018-09-03 2019-06-26 黏著劑組成物及黏著薄片 TWI779208B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018164843 2018-09-03
JP2018-164843 2018-09-03

Publications (2)

Publication Number Publication Date
TW202020088A TW202020088A (zh) 2020-06-01
TWI779208B true TWI779208B (zh) 2022-10-01

Family

ID=69723127

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108122309A TWI779208B (zh) 2018-09-03 2019-06-26 黏著劑組成物及黏著薄片

Country Status (5)

Country Link
JP (3) JP7363791B2 (ja)
KR (1) KR102408062B1 (ja)
CN (1) CN112534015B (ja)
TW (1) TWI779208B (ja)
WO (1) WO2020049829A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118402041A (zh) * 2021-12-14 2024-07-26 株式会社力森诺科 半导体器件的制造方法及半导体器件

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014234422A (ja) * 2013-05-31 2014-12-15 昭和電工株式会社 ガラスエッチング向け再剥離保護テープ用活性線硬化型粘着剤組成物、ガラスエッチング向け再剥離保護テープ

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JP3662365B2 (ja) * 1996-09-06 2005-06-22 ダイセル化学工業株式会社 光硬化性樹脂組成物
EP0938526B1 (en) * 1996-11-12 2003-04-23 Minnesota Mining And Manufacturing Company Thermosettable pressure sensitive adhesive
JP3803200B2 (ja) * 1998-07-31 2006-08-02 日本合成化学工業株式会社 再剥離型粘着剤組成物
JP4011747B2 (ja) 1998-08-27 2007-11-21 ダイセル化学工業株式会社 硬化性樹脂の製造方法および硬化性樹脂を含む組成物
JP2000204130A (ja) 1998-11-09 2000-07-25 Toray Ind Inc 感光性ペ―ストおよびそれを用いたディスプレイ用部材の製造方法
JP2003122003A (ja) * 2001-10-15 2003-04-25 Toppan Printing Co Ltd 感光性樹脂組成物
JP4011885B2 (ja) * 2001-10-18 2007-11-21 ダイセル化学工業株式会社 硬化性樹脂の製造方法および硬化性樹脂を含む組成物
JP4182887B2 (ja) 2003-02-07 2008-11-19 三菱化学株式会社 着色樹脂組成物、カラーフィルタ、及び液晶表示装置
JP4506146B2 (ja) * 2003-03-20 2010-07-21 東洋インキ製造株式会社 粘着剤組成物および粘着シート
JP4573256B2 (ja) 2003-06-13 2010-11-04 ダイセル・サイテック株式会社 多官能（メタ）アクリル酸エステル、その製造方法および活性エネルギー線硬化型（メタ）アクリル酸エステル樹脂組成物並びにその硬化物
US8084545B2 (en) 2007-05-11 2011-12-27 Daicel Chemical Industries, Ltd. Photo- and/or thermo-curable copolymer, curable resin compositions, and cured articles
JP2009084435A (ja) 2007-09-28 2009-04-23 Fujifilm Corp 感光性樹脂組成物、フォトスペーサの製造方法、液晶表示装置用基板、液晶表示素子、及び液晶表示装置
JP4318743B1 (ja) * 2008-10-07 2009-08-26 昭和高分子株式会社 紫外線硬化型再剥離性粘着剤組成物及びこれを用いた粘着シート
US8067504B2 (en) * 2009-08-25 2011-11-29 3M Innovative Properties Company Acrylic pressure-sensitive adhesives with acylaziridine crosslinking agents
JP2012119364A (ja) * 2010-11-29 2012-06-21 Toyo Ink Sc Holdings Co Ltd 太陽電池裏面保護シートならびに太陽電池モジュール
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JP5996985B2 (ja) 2012-09-24 2016-09-21 日東電工株式会社 粘着シートの製造方法、および、該製造方法により得られた粘着シート
JP6021715B2 (ja) * 2013-03-29 2016-11-09 株式会社ブリヂストン 光硬化性粘着剤組成物
JP2017206637A (ja) 2016-05-20 2017-11-24 日立化成株式会社 樹脂組成物、樹脂層付き基板及びその製造方法、導電層付き基板及びその製造方法並びにタッチパネル。
EP3252088B1 (en) * 2016-05-31 2018-07-04 Henkel AG & Co. KGaA Cationic pressure sensitive adhesive uv cured by medium mercury bulbs
KR102103619B1 (ko) * 2016-07-29 2020-04-22 주식회사 엘지화학 접착제 조성물, 이를 이용하여 형성된 접착제층을 포함하는 보호필름 및 편광판, 및 이를 포함하는 화상표시장치
WO2018033995A1 (ja) * 2016-08-19 2018-02-22 大阪有機化学工業株式会社 易剥離膜形成用硬化性樹脂組成物及びその製造方法
KR102276828B1 (ko) * 2016-12-02 2021-07-14 미쯔비시 케미컬 주식회사 점착제용 수지 조성물 및 점착 시트
CN112029468A (zh) * 2020-08-03 2020-12-04 新纶科技（常州）有限公司 光固化印刷的压敏胶组合物及其制备方法和用途

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014234422A (ja) * 2013-05-31 2014-12-15 昭和電工株式会社 ガラスエッチング向け再剥離保護テープ用活性線硬化型粘着剤組成物、ガラスエッチング向け再剥離保護テープ

Also Published As

Publication number Publication date
WO2020049829A1 (ja) 2020-03-12
JPWO2020049829A1 (ja) 2021-08-12
CN112534015B (zh) 2022-02-25
KR102408062B1 (ko) 2022-06-14
CN112534015A (zh) 2021-03-19
TW202020088A (zh) 2020-06-01
KR20210027424A (ko) 2021-03-10
JP7568024B2 (ja) 2024-10-16
JP2023182666A (ja) 2023-12-26
JP7363791B2 (ja) 2023-10-18
JP2024014872A (ja) 2024-02-01

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