TWI778105B - 印刷電路板 - Google Patents
印刷電路板 Download PDFInfo
- Publication number
- TWI778105B TWI778105B TW107125944A TW107125944A TWI778105B TW I778105 B TWI778105 B TW I778105B TW 107125944 A TW107125944 A TW 107125944A TW 107125944 A TW107125944 A TW 107125944A TW I778105 B TWI778105 B TW I778105B
- Authority
- TW
- Taiwan
- Prior art keywords
- metal
- insulating layer
- layer
- printed circuit
- circuit board
- Prior art date
Links
- 229910052751 metal Inorganic materials 0.000 claims abstract description 391
- 239000002184 metal Substances 0.000 claims abstract description 391
- 238000002844 melting Methods 0.000 claims abstract description 107
- 230000008018 melting Effects 0.000 claims abstract description 102
- 230000000149 penetrating effect Effects 0.000 claims abstract description 4
- 230000003746 surface roughness Effects 0.000 claims 1
- 239000010410 layer Substances 0.000 description 260
- 239000003822 epoxy resin Substances 0.000 description 40
- 229920000647 polyepoxide Polymers 0.000 description 40
- 239000010949 copper Substances 0.000 description 18
- 238000003475 lamination Methods 0.000 description 17
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 16
- 239000000463 material Substances 0.000 description 15
- 238000000034 method Methods 0.000 description 13
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 12
- 239000010931 gold Substances 0.000 description 12
- 229910000765 intermetallic Inorganic materials 0.000 description 12
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 11
- 229920005989 resin Polymers 0.000 description 11
- 239000011347 resin Substances 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000000758 substrate Substances 0.000 description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 8
- 229910052737 gold Inorganic materials 0.000 description 8
- 238000007747 plating Methods 0.000 description 8
- 239000010936 titanium Substances 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229920001774 Perfluoroether Polymers 0.000 description 7
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 6
- 229920000106 Liquid crystal polymer Polymers 0.000 description 6
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 6
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 6
- 229920001955 polyphenylene ether Polymers 0.000 description 6
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 6
- 239000004810 polytetrafluoroethylene Substances 0.000 description 6
- 239000012779 reinforcing material Substances 0.000 description 6
- 229920003986 novolac Polymers 0.000 description 5
- 229910052718 tin Inorganic materials 0.000 description 5
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229930003836 cresol Natural products 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 4
- 239000011256 inorganic filler Substances 0.000 description 4
- 229910003475 inorganic filler Inorganic materials 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 229910052763 palladium Inorganic materials 0.000 description 4
- 239000011574 phosphorus Substances 0.000 description 4
- 229910052698 phosphorus Inorganic materials 0.000 description 4
- 229910052697 platinum Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000011229 interlayer Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 239000004843 novolac epoxy resin Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- -1 polytetrafluoroethylene Polymers 0.000 description 3
- 235000012239 silicon dioxide Nutrition 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 229920005992 thermoplastic resin Polymers 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000011353 cycloaliphatic epoxy resin Substances 0.000 description 2
- 230000000994 depressogenic effect Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000002335 surface treatment layer Substances 0.000 description 2
- 238000005253 cladding Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020170165225A KR20190065748A (ko) | 2017-12-04 | 2017-12-04 | 인쇄회로기판 |
| KR10-2017-0165225 | 2017-12-04 | ||
| ??10-2017-0165225 | 2017-12-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201927088A TW201927088A (zh) | 2019-07-01 |
| TWI778105B true TWI778105B (zh) | 2022-09-21 |
Family
ID=66845789
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107125944A TWI778105B (zh) | 2017-12-04 | 2018-07-26 | 印刷電路板 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2019102790A (ko) |
| KR (1) | KR20190065748A (ko) |
| TW (1) | TWI778105B (ko) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI705747B (zh) * | 2019-08-30 | 2020-09-21 | 嘉聯益科技股份有限公司 | 多層軟性電路板及其製造方法 |
| CN112449512A (zh) * | 2019-08-30 | 2021-03-05 | 嘉联益电子(昆山)有限公司 | 多层软性电路板及其制造方法 |
| TWI740767B (zh) * | 2021-01-07 | 2021-09-21 | 欣興電子股份有限公司 | 線路板及其製作方法 |
| JP2023136298A (ja) * | 2022-03-16 | 2023-09-29 | Ｆｉｃｔ株式会社 | 多層基板、多層基板の製造方法及び電子機器 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008515241A (ja) * | 2004-10-01 | 2008-05-08 | テセラ・インターコネクト・マテリアルズ，インコーポレイテッド | 相互接続要素の構造体および製造方法と相互接続要素を含む多層配線基板 |
| CN101425512A (zh) * | 2007-10-30 | 2009-05-06 | 海力士半导体有限公司 | 堆叠半导体封装及其制造方法 |
| CN102683545A (zh) * | 2011-03-16 | 2012-09-19 | 隆达电子股份有限公司 | 提升散热效率的光源模块及其嵌入式封装结构 |
| TW201713172A (zh) * | 2015-09-25 | 2017-04-01 | Dainippon Printing Co Ltd | 安裝部件與其製造方法、配線基板與其製造方法及電子裝置 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100734234B1 (ko) | 2006-05-29 | 2007-07-02 | 전자부품연구원 | 다층 인쇄회로기판 및 그 제조방법 |
| KR100905566B1 (ko) * | 2007-04-30 | 2009-07-02 | 삼성전기주식회사 | 회로 전사용 캐리어 부재, 이를 이용한 코어리스인쇄회로기판, 및 이들의 제조방법 |
-
2017
- 2017-12-04 KR KR1020170165225A patent/KR20190065748A/ko not_active Application Discontinuation
-
2018
- 2018-07-25 JP JP2018139493A patent/JP2019102790A/ja active Pending
- 2018-07-26 TW TW107125944A patent/TWI778105B/zh active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008515241A (ja) * | 2004-10-01 | 2008-05-08 | テセラ・インターコネクト・マテリアルズ，インコーポレイテッド | 相互接続要素の構造体および製造方法と相互接続要素を含む多層配線基板 |
| CN101425512A (zh) * | 2007-10-30 | 2009-05-06 | 海力士半导体有限公司 | 堆叠半导体封装及其制造方法 |
| CN102683545A (zh) * | 2011-03-16 | 2012-09-19 | 隆达电子股份有限公司 | 提升散热效率的光源模块及其嵌入式封装结构 |
| TW201713172A (zh) * | 2015-09-25 | 2017-04-01 | Dainippon Printing Co Ltd | 安裝部件與其製造方法、配線基板與其製造方法及電子裝置 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20190065748A (ko) | 2019-06-12 |
| TW201927088A (zh) | 2019-07-01 |
| JP2019102790A (ja) | 2019-06-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GD4A | Issue of patent certificate for granted invention patent |