TWI772403B - 攝像元件安裝基板、其製造方法及安裝基板集合體 - Google Patents
攝像元件安裝基板、其製造方法及安裝基板集合體 Download PDFInfo
- Publication number
- TWI772403B TWI772403B TW107112243A TW107112243A TWI772403B TW I772403 B TWI772403 B TW I772403B TW 107112243 A TW107112243 A TW 107112243A TW 107112243 A TW107112243 A TW 107112243A TW I772403 B TWI772403 B TW I772403B
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- Prior art keywords
- imaging element
- metal
- layer
- wiring
- insulating
- Prior art date
Links
- 238000003384 imaging method Methods 0.000 title claims abstract description 197
- 238000004519 manufacturing process Methods 0.000 title claims description 26
- 229910052751 metal Inorganic materials 0.000 claims abstract description 242
- 239000002184 metal Substances 0.000 claims abstract description 242
- 239000000758 substrate Substances 0.000 claims abstract description 134
- 239000010410 layer Substances 0.000 claims description 378
- 239000004020 conductor Substances 0.000 claims description 101
- 238000000034 method Methods 0.000 claims description 20
- 239000012790 adhesive layer Substances 0.000 claims description 15
- 239000010409 thin film Substances 0.000 description 23
- 229920002120 photoresistant polymer Polymers 0.000 description 21
- 229920001721 polyimide Polymers 0.000 description 20
- 239000010408 film Substances 0.000 description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 15
- 239000004642 Polyimide Substances 0.000 description 15
- 229910052802 copper Inorganic materials 0.000 description 15
- 239000010949 copper Substances 0.000 description 15
- 239000000463 material Substances 0.000 description 12
- 230000003287 optical effect Effects 0.000 description 12
- 238000004544 sputter deposition Methods 0.000 description 8
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 239000011810 insulating material Substances 0.000 description 6
- 238000012986 modification Methods 0.000 description 6
- 230000004048 modification Effects 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
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- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 230000001629 suppression Effects 0.000 description 3
- 230000000930 thermomechanical effect Effects 0.000 description 3
- 238000001039 wet etching Methods 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- IKCQWKJZLSDDSS-UHFFFAOYSA-N 2-formyloxyethyl formate Chemical compound O=COCCOC=O IKCQWKJZLSDDSS-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- QHIWVLPBUQWDMQ-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(=O)C(C)=C.CCCCOC(=O)C=C QHIWVLPBUQWDMQ-UHFFFAOYSA-N 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Electromagnetism (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-077542 | 2017-04-10 | ||
| JP2017077542 | 2017-04-10 | ||
| JP2017201977 | 2017-10-18 | ||
| JP2017-201977 | 2017-10-18 | ||
| JP2018071825A JP7357436B2 (ja) | 2017-04-10 | 2018-04-03 | 撮像素子実装基板、その製造方法、および、実装基板集合体 |
| JP2018-071825 | 2018-04-03 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201842406A TW201842406A (zh) | 2018-12-01 |
| TWI772403B true TWI772403B (zh) | 2022-08-01 |
Family
ID=63793431
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107112243A TWI772403B (zh) | 2017-04-10 | 2018-04-10 | 攝像元件安裝基板、其製造方法及安裝基板集合體 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2023041968A (ja) |
| TW (1) | TWI772403B (ja) |
| WO (1) | WO2018190215A1 (ja) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10804205B1 (en) * | 2019-08-22 | 2020-10-13 | Bridge Semiconductor Corp. | Interconnect substrate with stiffener and warp balancer and semiconductor assembly using the same |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080078573A1 (en) * | 2006-10-02 | 2008-04-03 | Nitto Denko Corporation | Wired circuit board and electronic device |
| JP2014175423A (ja) * | 2013-03-07 | 2014-09-22 | Sharp Corp | フレキシブル基板及びその実装方法 |
| JP2015038908A (ja) * | 2012-03-06 | 2015-02-26 | イビデン株式会社 | フレックスリジッド配線板 |
| TWI503383B (zh) * | 2011-01-07 | 2015-10-11 | Fujifilm Corp | 鍍層形成用組成物以及具有金屬膜之積層體的製造方法 |
| CN104995906A (zh) * | 2013-04-26 | 2015-10-21 | 株式会社村田制作所 | 摄像头模块的制造方法 |
| JP5968514B1 (ja) * | 2015-11-05 | 2016-08-10 | 株式会社フジクラ | プリント配線板 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2631548B2 (ja) * | 1989-03-15 | 1997-07-16 | 日本シイエムケイ株式会社 | シールド層を備えるプリント配線板 |
| JP4405062B2 (ja) * | 2000-06-16 | 2010-01-27 | 株式会社ルネサステクノロジ | 固体撮像装置 |
-
2018
- 2018-04-04 WO PCT/JP2018/014380 patent/WO2018190215A1/ja active Application Filing
- 2018-04-10 TW TW107112243A patent/TWI772403B/zh active
-
2023
- 2023-02-06 JP JP2023016297A patent/JP2023041968A/ja active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080078573A1 (en) * | 2006-10-02 | 2008-04-03 | Nitto Denko Corporation | Wired circuit board and electronic device |
| TWI503383B (zh) * | 2011-01-07 | 2015-10-11 | Fujifilm Corp | 鍍層形成用組成物以及具有金屬膜之積層體的製造方法 |
| JP2015038908A (ja) * | 2012-03-06 | 2015-02-26 | イビデン株式会社 | フレックスリジッド配線板 |
| JP2014175423A (ja) * | 2013-03-07 | 2014-09-22 | Sharp Corp | フレキシブル基板及びその実装方法 |
| CN104995906A (zh) * | 2013-04-26 | 2015-10-21 | 株式会社村田制作所 | 摄像头模块的制造方法 |
| JP5968514B1 (ja) * | 2015-11-05 | 2016-08-10 | 株式会社フジクラ | プリント配線板 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2018190215A1 (ja) | 2018-10-18 |
| JP2023041968A (ja) | 2023-03-24 |
| TW201842406A (zh) | 2018-12-01 |
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