TWI770013B - 導電性塗料及使用其之屏蔽封裝體之製造方法 - Google Patents

導電性塗料及使用其之屏蔽封裝體之製造方法 Download PDF

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Publication number
TWI770013B
TWI770013B TW106108722A TW106108722A TWI770013B TW I770013 B TWI770013 B TW I770013B TW 106108722 A TW106108722 A TW 106108722A TW 106108722 A TW106108722 A TW 106108722A TW I770013 B TWI770013 B TW I770013B
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TW
Taiwan
Prior art keywords
conductive paint
mass
parts
package
conductive
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TW106108722A
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English (en)
Chinese (zh)
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TW201737368A (zh
Inventor
梅田裕明
松田和大
湯川健
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日商拓自達電線股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C08K3/042—Graphene or derivatives, e.g. graphene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/20—Diluents or solvents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/70—Additives characterised by shape, e.g. fibres, flakes or microspheres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Paints Or Removers (AREA)
  • Conductive Materials (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Dicing (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
TW106108722A 2016-03-29 2017-03-16 導電性塗料及使用其之屏蔽封裝體之製造方法 TWI770013B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-065478 2016-03-29
JP2016065478 2016-03-29

Publications (2)

Publication Number Publication Date
TW201737368A TW201737368A (zh) 2017-10-16
TWI770013B true TWI770013B (zh) 2022-07-11

Family

ID=59964507

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106108722A TWI770013B (zh) 2016-03-29 2017-03-16 導電性塗料及使用其之屏蔽封裝體之製造方法

Country Status (5)

Country Link
JP (1) JP6921573B2 (enExample)
KR (1) KR102362081B1 (enExample)
CN (1) CN108779363B (enExample)
TW (1) TWI770013B (enExample)
WO (1) WO2017170395A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102428873B1 (ko) * 2017-10-13 2022-08-02 타츠타 전선 주식회사 차폐 패키지
JP7164181B2 (ja) * 2019-02-27 2022-11-01 ナミックス株式会社 電磁波シールド用スプレー塗布剤
JP7185289B2 (ja) * 2019-03-07 2022-12-07 ナミックス株式会社 電磁波シールド用スプレー塗布剤
TWI813872B (zh) * 2019-07-25 2023-09-01 日商拓自達電線股份有限公司 導電性塗料及使用其之屏蔽封裝體之製造方法、以及具有屏蔽層之樹脂成形品之製造方法
US11597858B1 (en) * 2020-07-31 2023-03-07 Tatsuta Electric Wire & Cable Co., Ltd. Conductive adhesive
KR102875756B1 (ko) * 2020-09-09 2025-10-24 베스트그래핀(주) 전자파 차폐용 하이브리드 접착제 조성물, 전자파 차폐용 하이브리드 접착제의 제조방법 및 전자파차폐용 하이브리드 접착필름
CN118541424A (zh) * 2021-11-16 2024-08-23 马来西亚国家石油公司 石墨烯涂料
CN116082799A (zh) * 2023-02-10 2023-05-09 常州威斯双联科技有限公司 一种热固型耐高温导电屏蔽材料及其制备方法
JP2025115704A (ja) * 2024-01-26 2025-08-07 株式会社タムラ製作所 スプレー用カーボン塗料組成物、およびカーボン塗膜の形成方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11213755A (ja) * 1998-01-28 1999-08-06 Hitachi Chem Co Ltd 導電ペースト
JP2011151372A (ja) * 2009-12-25 2011-08-04 Murata Mfg Co Ltd 電子部品モジュールの製造方法及び電子部品モジュール

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58129072A (ja) * 1982-01-28 1983-08-01 Sutaaraito Kogyo Kk 導電性プライマ−組成物
JPS6081705A (ja) * 1983-10-07 1985-05-09 東洋ゴム工業株式会社 広領域周波数帯用電磁波シ−ルド材
JP2003045228A (ja) * 2001-08-01 2003-02-14 Hitachi Chem Co Ltd 導電ペースト
JP2003258137A (ja) 2002-02-28 2003-09-12 Mitsubishi Electric Corp 半導体装置
KR100757163B1 (ko) * 2002-05-31 2007-09-07 다츠다 덴센 가부시키가이샤 도전성 페이스트, 이를 이용한 다층기판과 그 제조방법
JP4109156B2 (ja) * 2002-05-31 2008-07-02 タツタ電線株式会社 導電性ペースト
JP3986908B2 (ja) * 2002-07-09 2007-10-03 住友ベークライト株式会社 導電性ペースト
JP3841733B2 (ja) * 2002-09-06 2006-11-01 九州耐火煉瓦株式会社 導電性組成物、それを含有する導電性塗料、導電性接着剤および電磁波シールド剤
JP5022652B2 (ja) * 2006-08-07 2012-09-12 太陽誘電株式会社 回路モジュールの製造方法及び回路モジュール
WO2010068488A1 (en) * 2008-11-25 2010-06-17 Lord Corporation Methods for protecting a die surface with photocurable materials
US8962986B2 (en) * 2009-10-15 2015-02-24 Hitachi Chemical Company, Ltd. Conductive adhesive, solar cell, method for manufacturing solar cell, and solar cell module
JP5831762B2 (ja) * 2011-12-21 2015-12-09 昭栄化学工業株式会社 熱硬化型導電性ペースト
JP6166860B2 (ja) * 2012-05-16 2017-07-19 小林　博 グラフェンの製造方法、該グラフェンを接合したグラフェン接合体の製造方法、および前記グラフェンないしは前記グラフェン接合体を用いた基材ないしは部品の製造方法
CN102876270B (zh) * 2012-09-20 2013-09-25 吴江市天源塑胶有限公司 一种高粘接强度的环氧树脂导电胶
CN102925100B (zh) * 2012-11-28 2014-07-02 上海材料研究所 一种高导热性能导电银胶及其制备方法
TWI500737B (zh) * 2013-05-06 2015-09-21 Chi Mei Corp 導電性接著劑
CN104178053A (zh) * 2013-05-28 2014-12-03 北京中科纳通电子技术有限公司 一种石墨烯复合导电胶
JP6163421B2 (ja) * 2013-12-13 2017-07-12 株式会社東芝 半導体装置、および、半導体装置の製造方法
JP2015141746A (ja) * 2014-01-27 2015-08-03 大阪瓦斯株式会社 導電体及びその製造方法
CN104112605A (zh) * 2014-07-30 2014-10-22 万裕三信电子(东莞)有限公司 电极片及其制备方法、超级电容器及其制备方法
JP6318137B2 (ja) * 2015-09-30 2018-04-25 Ｄｏｗａエレクトロニクス株式会社 導電性ペースト及び導電膜

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11213755A (ja) * 1998-01-28 1999-08-06 Hitachi Chem Co Ltd 導電ペースト
JP2011151372A (ja) * 2009-12-25 2011-08-04 Murata Mfg Co Ltd 電子部品モジュールの製造方法及び電子部品モジュール

Also Published As

Publication number Publication date
CN108779363B (zh) 2021-06-22
CN108779363A (zh) 2018-11-09
WO2017170395A1 (ja) 2017-10-05
TW201737368A (zh) 2017-10-16
KR20180125942A (ko) 2018-11-26
JP2017179360A (ja) 2017-10-05
KR102362081B1 (ko) 2022-02-10
JP6921573B2 (ja) 2021-08-18

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