TWI763844B - 研磨方法及研磨裝置 - Google Patents

研磨方法及研磨裝置

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Publication number
TWI763844B
TWI763844B TW107116217A TW107116217A TWI763844B TW I763844 B TWI763844 B TW I763844B TW 107116217 A TW107116217 A TW 107116217A TW 107116217 A TW107116217 A TW 107116217A TW I763844 B TWI763844 B TW I763844B
Authority
TW
Taiwan
Prior art keywords
support plate
support
polishing
grinding
shape
Prior art date
Application number
TW107116217A
Other languages
English (en)
Chinese (zh)
Other versions
TW201902618A (zh
Inventor
渡邉篤史
橫川克也
栗本宏高
Original Assignee
日商信越半導體股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商信越半導體股份有限公司 filed Critical 日商信越半導體股份有限公司
Publication of TW201902618A publication Critical patent/TW201902618A/zh
Application granted granted Critical
Publication of TWI763844B publication Critical patent/TWI763844B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW107116217A 2017-06-12 2018-05-14 研磨方法及研磨裝置 TWI763844B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP2017-115077 2017-06-12
JP2017115077A JP6312229B1 (ja) 2017-06-12 2017-06-12 研磨方法及び研磨装置

Publications (2)

Publication Number Publication Date
TW201902618A TW201902618A (zh) 2019-01-16
TWI763844B true TWI763844B (zh) 2022-05-11

Family

ID=61968269

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107116217A TWI763844B (zh) 2017-06-12 2018-05-14 研磨方法及研磨裝置

Country Status (4)

Country Link
JP (1) JP6312229B1 (ko)
KR (1) KR102476609B1 (ko)
CN (1) CN109015115B (ko)
TW (1) TWI763844B (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7363978B1 (ja) 2022-07-04 2023-10-18 株式会社Sumco ウェーハ研磨条件の決定方法、ウェーハの製造方法およびウェーハ片面研磨システム

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09193003A (ja) * 1996-01-16 1997-07-29 Nippon Steel Corp 研磨装置
WO2001056742A1 (fr) * 2000-01-31 2001-08-09 Shin-Etsu Handotai Co., Ltd. Dispositif et procede de polissage
US20020052172A1 (en) * 1999-03-19 2002-05-02 Fujitsu Limited Lapping machine, lapping method, and method of manufacturing magnetic head
JP2004239718A (ja) * 2003-02-05 2004-08-26 Shin Etsu Handotai Co Ltd バッキングパッドの形状測定方法及び被加工物の研磨方法、並びにバッキングパッドの形状測定装置
US20050186887A1 (en) * 2003-03-31 2005-08-25 Fujitsu Limited Processing method and apparatus
TW200539338A (en) * 2004-05-20 2005-12-01 Renesas Tech Corp A manufacturing method of a semiconductor device

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4313284A (en) * 1980-03-27 1982-02-02 Monsanto Company Apparatus for improving flatness of polished wafers
JP2535943B2 (ja) * 1987-08-31 1996-09-18 大同特殊鋼株式会社 自動車トンネルの排ガス除塵装置
JP2560611B2 (ja) 1993-07-26 1996-12-04 日本電気株式会社 保護膜およびその製造方法
JPH0740231A (ja) * 1993-07-30 1995-02-10 Sumitomo Sitix Corp 半導体ウェーハの研磨方法および研磨装置
JPH07307317A (ja) * 1994-05-16 1995-11-21 Nippon Steel Corp 半導体ウェーハ研磨装置
JPH07314327A (ja) * 1994-05-20 1995-12-05 Sony Corp ウエハ研磨装置およびその方法
TW348279B (en) * 1995-04-10 1998-12-21 Matsushita Electric Ind Co Ltd Substrate grinding method
JPH1058315A (ja) * 1996-08-20 1998-03-03 Sony Corp 研磨装置及び研磨方法
JP4033632B2 (ja) * 1999-02-02 2008-01-16 株式会社荏原製作所 基板把持装置及び研磨装置
JP2002222784A (ja) * 2001-01-24 2002-08-09 Toshiba Mach Co Ltd 平面研磨方法及び平面研磨装置
JP2003260644A (ja) * 2002-03-07 2003-09-16 Asahi Glass Co Ltd 板状体の加工方法および加工装置
JP5001877B2 (ja) * 2008-02-26 2012-08-15 株式会社ディスコ 板状物搬送装置および板状物搬送方法
JP2010056366A (ja) * 2008-08-29 2010-03-11 Showa Denko Kk ウェーハの研削装置及び半導体発光素子の製造方法
JP2013004928A (ja) * 2011-06-21 2013-01-07 Shin Etsu Handotai Co Ltd 研磨ヘッド、研磨装置及びワークの研磨方法
JP2014053356A (ja) * 2012-09-05 2014-03-20 Disco Abrasive Syst Ltd ウエーハの加工方法
JP5870960B2 (ja) * 2013-05-16 2016-03-01 信越半導体株式会社 ワークの研磨装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09193003A (ja) * 1996-01-16 1997-07-29 Nippon Steel Corp 研磨装置
US20020052172A1 (en) * 1999-03-19 2002-05-02 Fujitsu Limited Lapping machine, lapping method, and method of manufacturing magnetic head
WO2001056742A1 (fr) * 2000-01-31 2001-08-09 Shin-Etsu Handotai Co., Ltd. Dispositif et procede de polissage
JP2004239718A (ja) * 2003-02-05 2004-08-26 Shin Etsu Handotai Co Ltd バッキングパッドの形状測定方法及び被加工物の研磨方法、並びにバッキングパッドの形状測定装置
US20050186887A1 (en) * 2003-03-31 2005-08-25 Fujitsu Limited Processing method and apparatus
TW200539338A (en) * 2004-05-20 2005-12-01 Renesas Tech Corp A manufacturing method of a semiconductor device

Also Published As

Publication number Publication date
KR20180135412A (ko) 2018-12-20
JP2019000917A (ja) 2019-01-10
JP6312229B1 (ja) 2018-04-18
TW201902618A (zh) 2019-01-16
KR102476609B1 (ko) 2022-12-12
CN109015115B (zh) 2021-08-31
CN109015115A (zh) 2018-12-18

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