TWI757443B - 軟焊料接合裝置 - Google Patents

軟焊料接合裝置 Download PDF

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Publication number
TWI757443B
TWI757443B TW107107530A TW107107530A TWI757443B TW I757443 B TWI757443 B TW I757443B TW 107107530 A TW107107530 A TW 107107530A TW 107107530 A TW107107530 A TW 107107530A TW I757443 B TWI757443 B TW I757443B
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TW
Taiwan
Prior art keywords
substrate
electrodes
coil
ferrites
electrode
Prior art date
Application number
TW107107530A
Other languages
English (en)
Chinese (zh)
Other versions
TW201842997A (zh
Inventor
田嶋久容
杉山和弘
Original Assignee
日商萬達修查股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商萬達修查股份有限公司 filed Critical 日商萬達修查股份有限公司
Publication of TW201842997A publication Critical patent/TW201842997A/zh
Application granted granted Critical
Publication of TWI757443B publication Critical patent/TWI757443B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/002—Soldering by means of induction heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/02—Induction heating
    • H05B6/06—Control, e.g. of temperature, of power
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/02—Induction heating
    • H05B6/10—Induction heating apparatus, other than furnaces, for specific applications
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • General Induction Heating (AREA)
TW107107530A 2017-03-08 2018-03-07 軟焊料接合裝置 TWI757443B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017044131A JP6915843B2 (ja) 2017-03-08 2017-03-08 半田接合装置
JP2017-044131 2017-03-08

Publications (2)

Publication Number Publication Date
TW201842997A TW201842997A (zh) 2018-12-16
TWI757443B true TWI757443B (zh) 2022-03-11

Family

ID=63448229

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107107530A TWI757443B (zh) 2017-03-08 2018-03-07 軟焊料接合裝置

Country Status (3)

Country Link
JP (1) JP6915843B2 (ja)
TW (1) TWI757443B (ja)
WO (1) WO2018164039A1 (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6738057B1 (ja) * 2019-06-14 2020-08-12 株式会社ワンダーフューチャーコーポレーション 回路基板及び実装方法
JP6928631B2 (ja) * 2019-09-11 2021-09-01 株式会社スフィンクス・テクノロジーズ 高周波誘導加熱ヘッドと、それを用いた高周波誘導加熱装置
KR102221523B1 (ko) * 2019-12-16 2021-03-02 오세돈 유도가열 방식의 용접 장치
KR102403214B1 (ko) * 2021-03-30 2022-05-30 주식회사 비에스테크닉스 유도가열을 이용한 mid 솔더링 장치
CN113814516B (zh) * 2021-10-11 2023-08-25 珠海格力智能装备有限公司 焊枪结构
KR102574733B1 (ko) * 2021-12-15 2023-09-06 주식회사 비에스테크닉스 유도가열 멀티 솔더링 코일 유니트
KR102569407B1 (ko) * 2021-12-15 2023-08-22 주식회사 비에스테크닉스 유도가열 솔더링 코일 및 지그 유니트
KR102595782B1 (ko) * 2021-12-29 2023-10-30 주식회사 비에스테크닉스 유도가열 솔더링 자동화 장비

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008229709A (ja) * 2007-03-23 2008-10-02 Toyota Industries Corp 半田付け装置、半田付け方法及び電子機器の製造方法
CN102481649A (zh) * 2009-07-31 2012-05-30 科马斯控股股份公司 具有包括定位在与远离工件的表面的不同距离处的两个臂部的至少一个回路元件的感应焊接装置
TW201233278A (en) * 2011-01-21 2012-08-01 Power Mate Technology Co Ltd Method for welding electronic components by high frequency
JP2012143805A (ja) * 2011-01-14 2012-08-02 Eco & Engineering Co Ltd 加熱ヘッド、及びこれを用いた太陽電池素子の接続装置、太陽電池ストリングの接続装置
CN103639558A (zh) * 2013-12-12 2014-03-19 哈尔滨工业大学 热-超声-电磁多场复合再流焊方法
CN104661789A (zh) * 2012-09-25 2015-05-27 第一高周波工业株式会社 去应力用加热装置
CN105873710A (zh) * 2013-11-08 2016-08-17 株式会社达文希斯 用于熔融并供应金属材料的感应加热头
JP2017037931A (ja) * 2015-08-07 2017-02-16 東レエンジニアリング株式会社 実装部品の半田接合方法および実装部品の半田接合装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2923096B2 (ja) * 1991-09-10 1999-07-26 株式会社日立製作所 テープキャリアパッケージおよび高周波加熱はんだ接合装置
JP6896369B2 (ja) * 2016-03-10 2021-06-30 株式会社ワンダーフューチャーコーポレーション 半田接合装置および半田接合方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008229709A (ja) * 2007-03-23 2008-10-02 Toyota Industries Corp 半田付け装置、半田付け方法及び電子機器の製造方法
CN102481649A (zh) * 2009-07-31 2012-05-30 科马斯控股股份公司 具有包括定位在与远离工件的表面的不同距离处的两个臂部的至少一个回路元件的感应焊接装置
JP2012143805A (ja) * 2011-01-14 2012-08-02 Eco & Engineering Co Ltd 加熱ヘッド、及びこれを用いた太陽電池素子の接続装置、太陽電池ストリングの接続装置
TW201233278A (en) * 2011-01-21 2012-08-01 Power Mate Technology Co Ltd Method for welding electronic components by high frequency
CN104661789A (zh) * 2012-09-25 2015-05-27 第一高周波工业株式会社 去应力用加热装置
CN105873710A (zh) * 2013-11-08 2016-08-17 株式会社达文希斯 用于熔融并供应金属材料的感应加热头
CN103639558A (zh) * 2013-12-12 2014-03-19 哈尔滨工业大学 热-超声-电磁多场复合再流焊方法
JP2017037931A (ja) * 2015-08-07 2017-02-16 東レエンジニアリング株式会社 実装部品の半田接合方法および実装部品の半田接合装置

Also Published As

Publication number Publication date
JP6915843B2 (ja) 2021-08-04
WO2018164039A1 (ja) 2018-09-13
JP2018148136A (ja) 2018-09-20
TW201842997A (zh) 2018-12-16

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