TWI757443B - Solder bonding apparatus - Google Patents
Solder bonding apparatus Download PDFInfo
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- TWI757443B TWI757443B TW107107530A TW107107530A TWI757443B TW I757443 B TWI757443 B TW I757443B TW 107107530 A TW107107530 A TW 107107530A TW 107107530 A TW107107530 A TW 107107530A TW I757443 B TWI757443 B TW I757443B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/002—Soldering by means of induction heating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/02—Induction heating
- H05B6/06—Control, e.g. of temperature, of power
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/02—Induction heating
- H05B6/10—Induction heating apparatus, other than furnaces, for specific applications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
- General Induction Heating (AREA)
Abstract
Description
本發明關於一種軟焊料接合裝置,其利用感應加熱,用軟焊料將電子元件接合到形成在基板上的電極上。The present invention relates to a solder bonding apparatus which utilizes induction heating to bond electronic components to electrodes formed on a substrate with soft solder.
先前的軟焊料接合裝置利用迴銲方式進行接合,即對置有電子元件的基板進行加熱,直到達到可讓軟焊料熔融的溫度。因此,軟焊料接合對象區域以外的部分也會過度受熱,電子元件和基板等承受的熱載荷就會增大。Conventional soft solder bonding apparatuses use a reflow method for bonding, that is, heating a substrate on which electronic components are placed until it reaches a temperature at which the soft solder is melted. Therefore, the portion other than the area to be joined by the soft solder is also overheated, and the thermal load on electronic components, substrates, and the like increases.
近年來,伴隨著電子設備的小型化、輕量化,封裝微小電子元件的基板一般採用軟性電路板,但為了削減軟性電路板的成本,先前的聚醯亞胺樹脂正逐漸被聚酯和聚乙烯等樹脂所取代。In recent years, with the miniaturization and weight reduction of electronic devices, flexible circuit boards are generally used as substrates for packaging tiny electronic components. However, in order to reduce the cost of flexible circuit boards, the previous polyimide resins are gradually being replaced by polyester and polyethylene replaced by resin.
然而,聚酯等廉價樹脂的熔點比聚醯亞胺樹脂低。因此,在用軟焊料接合時,存在以下問題:如果軟性電路板被加熱到高於耐熱溫度的溫度,基板就會變形。However, inexpensive resins such as polyester have lower melting points than polyimide resins. Therefore, when bonding with soft solder, there is a problem that if the flexible wiring board is heated to a temperature higher than the heat-resistant temperature, the substrate is deformed.
對於上述問題,在專利文獻1中公開了一種方法,其利用感應加熱,局部性地對軟焊料接合的對象部位進行加熱。該方法為,在使發熱體抵接到基板上的狀態下,將利用感應加熱而被加熱的發熱體的熱量,經由與軟焊料抵接的基板的電極,傳遞給軟焊料,由此使軟焊料熔融。 〔專利文獻〕 [專利文獻1]日本特開2009-95873號公報With regard to the above-mentioned problems,
〔發明所欲解決之問題〕[Problems to be Solved by Invention]
然而,因為在專利文獻1中公開的方法中,是將利用感應加熱而被加熱的發熱體的熱量藉由熱傳導傳遞給與軟焊料抵接的基板的電極,所以加熱效率差。又因為,利用感應加熱而被加熱的發熱體對與軟焊料抵接的基板的電極附近的部分也進行多餘的加熱,所以基板有可能變形。此外,因為在將微小電子元件封裝到基板上時,軟焊料接合的對象部位較小,所以當使發熱體抵接到基板上時,難以準確地抵接到軟焊料接合的對象部位上。However, in the method disclosed in
本發明正是鑑於上述問題而完成的,其主要目的是提供一種軟焊料接合裝置,其利用感應加熱,用軟焊料將電子元件接合到形成在基板上的電極上,該軟焊料接合裝置能抑制基板被加熱,並且,即使是微小的電子元件,也能夠容易地用軟焊料進行接合,加熱效率高。而且,本發明提供的軟焊料接合裝置在基板上置有不同種類的電子元件的情況下,也能夠以適當的加熱量用軟焊料同時對不同種類的電子元件進行接合。本發明提供的軟焊料接合裝置還能夠以良好的均一性用軟焊料同時對複數個電子元件進行接合。 〔解決問題之技術手段〕The present invention has been made in view of the above-mentioned problems, and its main object is to provide a soft solder bonding apparatus that uses induction heating to bond electronic components to electrodes formed on a substrate with soft solder, which is capable of suppressing The substrate is heated, and even small electronic components can be easily joined with soft solder, and the heating efficiency is high. Furthermore, the soft solder bonding apparatus provided by the present invention can simultaneously bond different types of electronic components with soft solder with an appropriate heating amount even when different types of electronic components are placed on the substrate. The soft solder bonding apparatus provided by the present invention can also bond a plurality of electronic components with soft solder with good uniformity at the same time. [Technical means to solve problems]
本發明所關係之軟焊料接合裝置是用軟焊料將電子元件接合到形成在基板上的電極上之軟焊料接合裝置,其具有加熱手段,該加熱手段使夾在電極與電子元件之間的軟焊料熔融,而用軟焊料將電子元件接合到電極上。加熱手段具有:線圈,其在俯視時的內側具有空間部;複數個鐵氧體,其佈置在線圈的空間部中;調整機構,其對各鐵氧體與形成在基板上的電極之間的間距分別進行調整;以及電源,其對線圈施加交流電壓而對形成在基板上的電極進行感應加熱。預先對各鐵氧體與形成在基板上的電極之間的間距進行調整,以使當交流電壓施加到線圈上之後,位於線圈的內側的複數個電極中,利用感應加熱而被加熱的各電極會達到相同的溫度。The solder bonding apparatus to which the present invention relates is a solder bonding apparatus for bonding an electronic component to an electrode formed on a substrate by using a soft solder, and has heating means for causing a soft solder interposed between the electrode and the electronic component. The solder melts and the electronic components are joined to the electrodes with soft solder. The heating means includes: a coil having a space portion on the inner side in a plan view; a plurality of ferrites arranged in the space portion of the coil; The pitches are individually adjusted; and a power supply applies an alternating voltage to the coils to inductively heat electrodes formed on the substrate. The distance between each ferrite and the electrode formed on the substrate is adjusted in advance so that when an AC voltage is applied to the coil, each electrode is heated by induction heating among the plurality of electrodes located inside the coil. will reach the same temperature.
本發明所關係之另一軟焊料接合裝置是用軟焊料將電子元件接合到形成在基板上的電極上之軟焊料接合裝置,其具有加熱手段,該加熱手段使夾在電極與電子元件之間的軟焊料熔融,而用軟焊料將電子元件接合到電極上。加熱手段具有:線圈,其在俯視時的內側具有空間部;複數個鐵氧體,其佈置在線圈的空間部中;以及電源,其對線圈施加交流電壓而對形成在基板上的電極進行感應加熱。預先對各鐵氧體的靠近基板一側的端面的面積進行調整,以使當交流電壓施加到線圈上之後,位於線圈的內側的複數個電極中,利用感應加熱而被加熱的各電極會達到相同的溫度。 〔發明之效果〕Another soft solder bonding apparatus to which the present invention relates is a soft solder bonding apparatus for bonding electronic components with soft solder to electrodes formed on a substrate, which has heating means for sandwiching between the electrodes and the electronic components The soft solder is melted, and the electronic components are bonded to the electrodes with the soft solder. The heating means includes: a coil having a space on the inner side in a plan view; a plurality of ferrites arranged in the space of the coil; and a power source that applies an alternating voltage to the coil to induce electrodes formed on the substrate heating. The area of the end face on the substrate side of each ferrite is adjusted in advance so that when an AC voltage is applied to the coil, each electrode heated by induction heating of the plurality of electrodes located inside the coil reaches the size of the coil. the same temperature. [Effect of invention]
根據本發明,能夠提供一種軟焊料接合裝置,其利用感應加熱,用軟焊料將電子元件接合到形成在基板上的電極上,該軟焊料接合裝置能抑制基板被加熱,並且,即使是微小的電子元件,也能夠容易地用軟焊料進行接合,加熱效率高。而且,本發明提供的軟焊料接合裝置在基板上置有不同種類的電子元件的情況下,能夠以適當的加熱量用軟焊料同時對不同種類的電子元件進行高精度的接合。本發明提供的軟焊料接合裝置還能夠以良好的均一性用軟焊料同時對複數個電子元件進行接合。According to the present invention, it is possible to provide a soft-solder bonding apparatus that bonds an electronic component to an electrode formed on a substrate with a soft solder using induction heating, which can suppress the heating of the substrate, and which can suppress the heating of the substrate, and which can suppress the heating of the substrate even if it is small. Electronic components can also be easily joined with soft solder, and the heating efficiency is high. Furthermore, the soft solder bonding apparatus provided by the present invention can simultaneously perform high-precision bonding of different types of electronic components with soft solder with an appropriate heating amount when different types of electronic components are placed on the substrate. The soft solder bonding apparatus provided by the present invention can also bond a plurality of electronic components with soft solder with good uniformity at the same time.
本申請的申請人在PCT/JP2016/072056、PCT/2016/076332之申請說明書中公開了下述軟焊料接合裝置:其透過軟焊料將電子元件接合到形成在絕緣性基板上的電極上,在置有電子元件的規定區域的上方或下方,佈置具有圍住該規定區域之形狀的線圈,向線圈供給電流,在線圈內對置有電子元件的電極進行感應加熱,由此用軟焊料進行接合。The applicant of the present application discloses, in the application specifications of PCT/JP2016/072056 and PCT/2016/076332, the following soft solder bonding apparatus for bonding electronic components to electrodes formed on an insulating substrate through soft solder, Above or below a predetermined area where electronic components are placed, a coil having a shape surrounding the predetermined area is arranged, current is supplied to the coil, and electrodes on which electronic components are placed are induction-heated in the coil, thereby bonding with soft solder .
圖1(a)、圖1(b)示意性地顯示上述申請說明書中公開的軟焊料接合裝置的構成。FIGS. 1( a ) and 1 ( b ) schematically show the configuration of the solder bonding apparatus disclosed in the above application specification.
如圖1(a)所示,基板11上置有複數個電子元件C,在置有電子元件C的區域A的上方,佈置有具有圍住該區域A之形狀的線圈20。如圖1(b)所示,當交流電壓施加到線圈20上時,在線圈20內側產生的磁通Φ,就會垂直射向形成在基板11上的電極13,這樣一來,電極13就被感應加熱。電極13利用感應加熱被加熱而產生的熱量傳遞給軟焊料14,由此使軟焊料14熔融,這樣一來,電子元件C就被軟焊料接合到電極13上。As shown in FIG. 1( a ), a plurality of electronic components C are placed on the
根據上述構成,能夠將感應加熱的範圍限定到線圈20內的置有電子元件C的電極13。這樣一來,因為是利用感應加熱直接對軟焊料接合的對象部位即電極13進行加熱,而不是利用來自發熱體的熱傳導進行加熱,所以能夠抑制基板11被加熱。其結果是,即使使用耐熱性較低的軟性電路板,也能夠抑制基板11的熱變形。並且,因為不必使發熱體直接與軟焊料接合的對象部位抵接,所以即使是微小的電子元件,也能夠容易地用軟焊料進行接合。According to the above configuration, the range of induction heating can be limited to the
置有電子元件C的電極13的大小可能隨電子元件C的種類和大小而變化。因此,區域A內的置有電子元件C的電極13由於在線圈20內側產生的磁通Φ而被感應加熱,其加熱量隨電極13的大小而變化,即隨電子元件C的種類和大小而變化。其結果是,當基板11上存在種類和大小不同的電子元件C時,對置有電子元件C的電極13的加熱量就會不同。因此,因為從被感應加熱的電極13傳遞給軟焊料14的熱量不同,所以對於種類和大小不同的電子元件,用軟焊料接合時可能會產生偏差。The size of the
此外,即使電子元件C的種類和大小相同,在線圈20內側產生的磁通Φ也不一定相同。線圈20的形狀也會導致在線圈20內側產生的磁通Φ的分佈情況不同。例如,如果基板11由軟性電路板構成,則基板的翹曲和彎曲等會導致射到電極13處的磁通Φ產生偏差。因此,對置有電子元件C的電極13的加熱量有時會不同。其結果是,因為從被感應加熱的電極13傳遞給軟焊料14的熱量不同,所以對於種類和大小不同的電子元件,用軟焊料接合時可能會產生偏差。In addition, even if the type and size of the electronic components C are the same, the magnetic flux Φ generated inside the
本發明正是為了消除此等不良現象而完成的,本發明提供一種軟焊料接合裝置,即使在基板上置有不同種類的電子元件的情況下,也能夠以適當的加熱量用軟焊料同時對不同種類的電子元件進行接合。並且,即使在線圈20內側產生的磁通Φ有偏差,本發明提供的軟焊料接合裝置也能夠以良好的均一性用軟焊料同時對複數個電子元件進行接合。The present invention has been accomplished in order to eliminate such inconveniences, and the present invention provides a soft solder bonding apparatus capable of simultaneously bonding with soft solder with an appropriate heating amount even when different types of electronic components are placed on a substrate. Different kinds of electronic components are joined. Furthermore, even if the magnetic flux Φ generated inside the
以下根據圖式對本發明的實施方式進行詳細說明。需要說明的是,本發明不限於以下實施方式。並且,在能發揮本發明之效果的範圍內,可以根據情況適當地對本發明進行變更。Hereinafter, embodiments of the present invention will be described in detail based on the drawings. In addition, this invention is not limited to the following embodiment. In addition, the present invention can be appropriately changed according to the circumstances within the range in which the effects of the present invention can be exhibited.
圖2示意性地顯示本發明的一實施方式中的軟焊料接合裝置的構成。FIG. 2 schematically shows the configuration of the solder bonding apparatus according to the embodiment of the present invention.
如圖2所示,本實施方式中的軟焊料接合裝置10是用軟焊料將電子元件C接合到形成在基板11上的電極(未圖示)上之軟焊料接合裝置,其具有加熱手段,加熱手段使夾在電極與電子元件C之間的軟焊料(未圖示)熔融,而用軟焊料將電子元件C接合到電極上。As shown in FIG. 2 , the
加熱手段具有:線圈20,其在俯視時(z方向)的內側具有空間部21;以及複數個鐵氧體30,其佈置在線圈20的空間部21中。此處,各鐵氧體30與形成在基板11上的電極之間的間距利用調整機構40分別進行控制。該間隔的調整例如可以用為每個鐵氧體30設置的致動器(例如,電動缸、線性滑軌等)41來進行。線圈20的兩端部經由導線51與電源50相連,藉由向線圈20施加交流電壓,形成在位於鐵氧體30下方的基板11上的電極就被感應加熱。The heating means includes a
圖3說明在本實施方式中,利用感應加熱,用軟焊料將電子元件接合到形成在基板11上的電極上之方法。此處,顯示的例子為:向形成在基板11上的電極13供給軟焊料14後,用軟焊料將具有端子(未圖示)的電子元件(例如,晶片電容、晶片電阻等)C接合到上面。FIG. 3 illustrates a method of bonding electronic components to electrodes formed on the
如圖3所示,各鐵氧體30的端部31與軟焊料接合的對象部位即電極13的大小一致,呈逐漸變細的形狀。向線圈20施加交流電壓後,線圈20周圍就會產生磁通Φ。在線圈20內側產生的磁通Φ沿著佈置在線圈20內側的鐵氧體30,從鐵氧體30的端部31,垂直射向形成在基板11上的電極13。這樣一來,電極13就被感應加熱。電極13利用感應加熱被加熱而產生的熱量傳遞給軟焊料14,由此使軟焊料14熔融,這樣一來,電子元件C的端子就被軟焊料接合到電極13上。As shown in FIG. 3 , the
藉由本實施方式中的軟焊料接合裝置,能夠經由鐵氧體30傳遞在線圈20內側產生的磁通Φ,以使磁通Φ集中到電極13,且不會衰減,因此能夠高效率地用軟焊料進行接合。藉由使鐵氧體30的端部31與電極13的大小一致,就能夠將感應加熱的範圍限定到電極13。這樣一來,即使是微小的電子元件C,也能夠容易地用軟焊料進行接合。此外,因為是利用感應加熱直接對電極13進行加熱,所以能夠抑制基板11被加熱。這樣一來,即使使用耐熱性較低的軟性電路板,也能夠抑制基板11的熱變形。With the soft solder bonding device in this embodiment, the magnetic flux Φ generated inside the
如上述,當基板11上存在種類和大小不同的電子元件C時,對置有電子元件C的電極13的加熱量就會不同。因此,因為從被感應加熱的電極13傳遞給軟焊料14的熱量不同,所以對於種類和大小不同的電子元件C,用軟焊料接合時可能會產生偏差。As described above, when the electronic components C of different types and sizes are present on the
此外,即使電子元件C的種類和大小相同,在線圈20內側產生的磁通Φ也不一定相同。基板11的翹曲和彎曲等也會導致射到電極13處磁通Φ產生偏差。因此,因為從被感應加熱的電極13傳遞給軟焊料14的熱量不同,所以用軟焊料接合時可能會產生偏差。In addition, even if the type and size of the electronic components C are the same, the magnetic flux Φ generated inside the
為了消除上述不良現象,本實施方式中的軟焊料接合裝置具有調整機構40,調整機構40預先對各鐵氧體30與形成在基板11上的電極13之間的間距進行調整,以使當交流電壓施加到線圈20上之後,位於線圈20內側的複數個電極13中,利用感應加熱而被加熱的各電極13會達到相同的溫度。In order to eliminate the above-mentioned inconveniences, the solder bonding apparatus in this embodiment has an
圖4(a)、圖4(b)顯示隨著鐵氧體30的端部31與基板11上的電極13之間的間距D的變化,利用感應加熱而被加熱的電極13的溫度變化情況。如圖3所示,磁通Φ從鐵氧體30的端部31射到電極13處,磁通Φ和鐵氧體30的端部31與基板11上的電極13之間的間距D的二次方成正比衰減。因此,因為利用感應加熱而被加熱的電極13的加熱量與磁通Φ成正比,所以如圖4(b)所示,電極13的溫度變化和鐵氧體30的端部31與基板11上的電極13之間的間距D的二次方基本成反比。因此,藉由調整各鐵氧體30與形成在基板11上的電極13之間的間距D,就能夠將利用感應加熱而被加熱的各電極13控制到相同的溫度。FIGS. 4( a ) and 4 ( b ) show the temperature change of the
圖5顯示當基板11上置有大小不同的兩個電子元件Ca、Cb時,對鐵氧體30A、30B與形成在基板11上的電極13A、13B之間的間距D1
、D2
進行調整的方法。需要說明的是,此處,根據電子元件Ca、Cb的大小,使電極13A的面積大於電極13B的面積。當要利用感應加熱將電極13A,13B加熱到相同的溫度時,因為與面積較大的電極13A相比,面積較小的電極13B被射到的磁通Φ少,對電極13B的加熱量小,所以在不彌補磁通Φ的情況下就需要藉由增大磁通密度來增大加熱量。因此,只要使鐵氧體30B與電極13B之間的間距D2
比鐵氧體30A與電極13A之間的間距D1小即可。這樣一來,能夠將利用感應加熱而被加熱的電極13A、13B的加熱量調整為適當的量,因此能夠將電極13A、13B控制到相同的溫度。5 shows the adjustment of the distances D 1 and D 2 between the
當在線圈20內側產生的磁通Φ不同時,輸送溫度測量用基板(在被加熱的電極13A、13B等上裝有溫度感測器的基板),預先測定出溫度曲線等,並根據該溫度曲線,對各鐵氧體30與基板11上的電極13之間的間距D進行調整,由此能夠將利用感應加熱而被加熱的各電極13控制到相同的溫度。When the magnetic flux Φ generated inside the
當基板11發生翹曲和彎曲等時,也是預先測定出處於翹曲和彎曲等狀態的基板11與各鐵氧體30之間的間距的偏差,並根據該偏差對各鐵氧體30與基板11上的電極13之間的間距D進行調整,由此能夠將利用感應加熱而被加熱的各電極13控制到相同的溫度。When the
如上述說明的那樣,本發明中的軟焊料接合裝置10藉由在線圈20的空間部中佈置複數個鐵氧體30,就能夠經由鐵氧體30傳遞在線圈20內側產生的磁通,以使磁通集中到基板11上的電極13,且不會衰減,因此能夠高效率地用軟焊料進行接合。藉由使鐵氧體30的頂端與電極13的大小一致,就能夠將感應加熱的範圍限定到電極13。這樣一來,因為是利用感應加熱直接對軟焊料接合的對象部位即電極13進行加熱,而不是利用來自發熱體的熱傳導進行加熱,所以能夠抑制基板11被加熱。其結果是,即使使用耐熱性較低的軟性電路板,也能夠抑制基板11的熱變形。並且,因為不必使發熱體直接與軟焊料接合的對象部位抵接,所以即使是微小的電子元件,也能夠容易地用軟焊料進行接合。As described above, in the
而且,當基板11上置有不同種類的電子元件C時,也能夠藉由對各鐵氧體30與形成在基板11上的電極13之間的間距分別進行調整,而將位於線圈20內側的複數個電極13中,利用感應加熱而被加熱的各電極13控制到相同的溫度。這樣一來,就能夠以適當的加熱量用軟焊料同時對不同種類的電子元件C進行接合。Furthermore, when different types of electronic components C are placed on the
當線圈20內側產生的磁通Φ不同時,也能夠藉由對各鐵氧體30與形成在基板11上的電極13之間的間距分別進行調整,而將位於線圈20內側的複數個電極13中,利用感應加熱而被加熱的各電極13控制到相同的溫度。這樣一來,就能夠以良好的均一性用軟焊料同時對複數個電子元件進行接合。When the magnetic flux Φ generated inside the
當基板11發生翹曲和彎曲等時,也能夠藉由對各鐵氧體30與形成在基板11上的電極13之間的間距分別進行調整,而將位於線圈20內側的複數個電極13中,利用感應加熱而被加熱的各電極13控制到相同的溫度。這樣一來,就能夠以良好的均一性用軟焊料同時對複數個電子元件進行接合。Even when the
在本實施方式中,鐵氧體30只要是磁導率較高的鐵氧體即可,磁導率較高是指能夠將在線圈20內側產生的磁通傳遞給軟焊料接合的對象部位即電極13,且不會衰減。例如,鐵氧體30可以採用軟磁鐵氧體。軟磁鐵氧體是以氧化鐵為主要成分的軟質磁性材料,電阻較大,基本不會讓電流通過。因此,在感應加熱之際,在軟磁鐵氧體中難以產生渦電流。其結果是,在進行感應加熱之際,能夠避免軟磁鐵氧體本身發熱,因此即使軟磁鐵氧體鄰近電極13,也能夠使基板11受熱量的影響較小。In the present embodiment, the
在本實施方式中,調整機構40對各鐵氧體30與形成在基板11上的電極13之間的間距分別進行調整,如圖2所示,調整機構40還可以具有記憶部43和控制部42。其中,記憶部43中存儲有已將各鐵氧體30與形成在基板11上的電極13之間的間距設定為規定值之資料,控制部42根據記憶部43中存儲的資料,自動對各鐵氧體30與形成在基板11上的電極13之間的間距進行調整。In this embodiment, the
記憶部43中存儲有已設定好的各鐵氧體30與形成在基板11上的電極13之間的間距之資料,該設定保證利用感應加熱而被加熱的各電極13會達到相同的溫度。控制部42根據記憶部43中存儲的資料,自動對各鐵氧體30與形成在基板11上的電極13之間的間距進行調整。The memory section 43 stores the set data of the distances between the
對位於線圈20內側的各電極13的適當的加熱量隨各電極13的面積、用軟焊料接合到各電極13上的電子元件的種類和大小、基板11的翹曲程度和彎曲程度等而變化。因此,預先取得適合各條件之適當的加熱量,並將設定好的各鐵氧體30與基板11上的電極13之間的間距之資料存儲到記憶部43中,由此實現軟焊料接合的自動化。其中,該設定保證利用感應加熱而被加熱的各電極13會達到相同的溫度。The appropriate amount of heating to each
如圖2所示,在本實施方式中,還可以在以基板11為基準時與佈置有線圈20的一側相反的一側且與複數個鐵氧體30相對的位置,設置與基板11平行的鐵氧體板32。這樣一來,沿線圈20一側的鐵氧體30通過的磁通,就穿過基板11傳遞給鐵氧體板32,從而能夠使在線圈20中產生的磁通更可靠地射到電極13處。其結果是,能夠更可靠地用軟焊料接合電子元件C。需要說明的是,也可以將棒狀的鐵氧體佈置到與鐵氧體30相對的位置,來取代鐵氧體板32。As shown in FIG. 2 , in this embodiment, the position opposite to the side on which the
在本實施方式中,基板11只要由絕緣性材料構成即可,其種類沒有特別限定。例如,基板11可以採用表面形成有電路佈線的電路板、兩面形成有電極焊墊(pad)的內插板(interposer)等。電子元件C只要是具有端子的部件即可,其種類沒有特別限定。例如,電子元件可以採用晶片電容、晶片電阻、LED元件、半導體元件、LSI等。In the present embodiment, as long as the
在本實施方式中,軟焊料接合的對象部位即電極13具有可利用感應加熱而局部性地被加熱的面積較佳。電極13的面積在0.25mm×0.25mm以上較佳。當電極13的面積較小時,還可以鄰接著電極13設置輔助加熱用之金屬墊。In the present embodiment, it is preferable that the
在本實施方式中,線圈20只要俯視時與基板11平行且在內側具有空間部即可,其形狀等沒有特別限定。還可以使線圈20為管狀,讓冷媒在其內部循環。In the present embodiment, as long as the
(變形例1)(Variation 1)
本實施方式中的軟焊料接合裝置構成為:在置有電子元件C的區域的上方,佈置有具有圍住該區域之形狀的線圈20。例如,圖2顯示的例子是,軟焊料接合裝置10構成為:電子元件C排成一列,在置有電子元件C的區域的上方,佈置有具有圍住該區域之形狀的線圈20。但還存在下述情況:在基板11上置有複數列電子元件C,用軟焊料同時對上述電子元件C進行接合。The solder bonding apparatus in the present embodiment is configured such that, above the region where the electronic component C is placed, the
圖6示意性地顯示對應於上述情況之軟焊料接合裝置的構成。如圖6所示,基板11上置有兩列電子元件C,在置有電子元件C的區域的上方,佈置有具有圍住該區域之形狀的線圈20。在線圈20的空間部21中,佈置有排成兩列的複數個鐵氧體30。FIG. 6 schematically shows the constitution of the solder bonding apparatus corresponding to the above-mentioned case. As shown in FIG. 6 , two rows of electronic components C are placed on the
根據上述構成,當基板11上置有不同種類的電子元件C時,也能夠藉由對各鐵氧體30與形成在基板11上的電極之間的間距分別進行調整,而將位於線圈20內側的複數個電極中,利用感應加熱而被加熱的各電極控制到相同的溫度。這樣一來,就能夠以適當的加熱量用軟焊料同時對不同種類的電子元件C進行接合。According to the above configuration, even when different types of electronic components C are placed on the
當基板11上置有排成複數列的電子元件C並用軟焊料同時對電子元件C進行接合時,線圈20圍住的區域的面積也變大。因此,在線圈20內側產生的磁通Φ的均勻性可能會下降。或者,翹曲和彎曲等對基板11的影響可能變大。在上述情況下,也能夠藉由在線圈20的空間部21中佈置排成複數列的鐵氧體30,而將對線圈20內側的複數個電極的加熱量調整到適當的加熱量。這樣一來,能夠將利用感應加熱而被加熱的各電極13控制到相同的溫度,因此能夠用軟焊料以良好的均一性同時對複數個電子元件C進行接合。When the electronic components C arranged in a plurality of rows are placed on the
需要說明的是,在圖6所示的軟焊料接合裝置的變形例中,顯示的例子是在線圈20的空間部21中佈置排成兩列的鐵氧體30,不過當然也可以佈置排成三列以上的鐵氧體30。It should be noted that, in the modification of the solder bonding apparatus shown in FIG. 6 , the example shown is that the
鐵氧體30的形狀和排列方式沒有特別限定,可以根據要封裝到基板上11上的電子元件C的種類、大小和排列方式等,適當地進行變更。The shape and arrangement of the
需要說明的是,鐵氧體30的長度在30~40mm之範圍內較佳。鐵氧體30為盡可能接近線圈20之內側尺寸的形狀較佳。It should be noted that the length of the
(變形例2)(Variation 2)
在本發明中的軟焊料接合裝置中,在線圈20內側產生的磁通Φ沿著佈置在線圈20內側的鐵氧體30,從鐵氧體30的端部31,垂直射向形成在基板11上的電極13。這樣一來,電極13利用感應加熱而被加熱,但該加熱量和鐵氧體30與基板11上的電極之間的間距D的二次方成正比衰減。圖2顯示的軟焊料接合裝置便利用了該性質,藉由對各鐵氧體30與形成在基板11上的電極之間的間距進行調整,而將位於線圈20內側的複數個電極中,利用感應加熱而被加熱的各電極控制到相同的溫度。In the soft solder bonding apparatus of the present invention, the magnetic flux Φ generated inside the
如圖5所示,因為與面積較小的晶片Cb相對而設的鐵氧體30B的端面的面積大於電極13B的面積,所以從鐵氧體30的端部31射出的磁通Φ還會射到晶片Cb以外的區域。因此,如果在晶片Cb附近有其他晶片或導電物等,則它們也會利用感應加熱而被加熱,因此不佳。所以為了避免上述影響,配合晶片的大小來改變鐵氧體30的端面的面積較佳。As shown in FIG. 5 , since the area of the end face of the
與圖5所示的情況相同,圖7顯示的也是在基板11上置有大小不同的兩個電子元件Ca、Cb的情況。此處,根據電子元件Ca、Cb的大小,使電極13A的面積大於電極13B的面積。與晶片Ca、Cb相對而設的鐵氧體30A、30B的端面31A、31B的面積分別改成與電極13A、13B相同的面積。Similar to the case shown in FIG. 5 , FIG. 7 also shows a case where two electronic components Ca and Cb of different sizes are placed on the
另一方面,如果鐵氧體30A、30B的端面31A、31B的面積不同,從鐵氧體30A、30B的端面31A、31B射到電極13A、13B處的磁通Φ的密度就會不同。又因為面積較大的電極13A的電阻值小於面積較小的電極13B的電阻值,所以電極13A上產生的渦電流大於電極13B上產生的渦電流。由於上述要因,對電極13A、13B的加熱量就會不同,所以需要調整對電極13A、13B的加熱量,以使利用感應加熱而被加熱的電極13A、13B會達到相同的溫度。On the other hand, when the areas of the end faces 31A and 31B of the
圖7顯示的是對電極13A的加熱量大於對電極13B的加熱量之情況,在此情況下,只要將鐵氧體30B與電極13B之間的間距D2
調整到比鐵氧體30A與電極13A之間的間距D1
小即可。這樣一來,能夠將利用感應加熱而被加熱的電極13A、13B的加熱量調整為適當的量,因此能夠將電極13A、13B控制到相同的溫度。需要說明的是,當對電極13B的加熱量大於對電極13A的加熱量時,將鐵氧體30A與電極13A之間的間距D1
調整到比鐵氧體30B與電極13B之間的間距D2
小即可。FIG. 7 shows the case where the heating amount of the
以上透過較佳的實施方式對本發明進行了說明,但上述記載並非限定事項,當然也可以做出各種變更。例如,在上述實施方式中,使鐵氧體30呈靠近基板11一側的端部31逐漸變細的形狀,但其形狀並沒有特別限定。例如,可以對鐵氧體30的端部31的一對對邊或兩對對邊進行倒角加工。也可以不讓靠近基板11一側的端部31呈逐漸變細的形狀。As mentioned above, although this invention was demonstrated based on preferable embodiment, the said description is not a limitation matter, Of course, various changes can be added. For example, in the above-described embodiment, the
在上述實施方式中,是根據存儲在記憶部43中的資料,自動對各鐵氧體30與形成在基板11上的電極13之間的間距進行調整,但也可以準備已預先將各鐵氧體30與形成在基板11上的電極13之間的間距調整好的單元,根據要封裝到基板11上的電子元件C的種類、大小和排列方式等,更換整個單元。In the above-described embodiment, the distance between each
10‧‧‧軟焊料接合裝置11‧‧‧基板12‧‧‧輸送手段13‧‧‧電極14‧‧‧軟焊料15‧‧‧端子20‧‧‧線圈21‧‧‧空間部30‧‧‧鐵氧體31‧‧‧鐵氧體的端面32‧‧‧鐵氧體板40‧‧‧調整機構42‧‧‧控制部43‧‧‧記憶部50‧‧‧電源51‧‧‧導線10‧‧‧
圖1(a)、圖1(b)示意性地顯示作為本發明之前提的軟焊料接合裝置的構成。 圖2示意性地顯示本發明的一實施方式中的軟焊料接合裝置的構成。 圖3說明在本發明的一實施方式中,利用感應加熱,用軟焊料將電子元件接合到形成在基板上的電極上之方法。 圖4(a)、圖4(b)顯示隨著鐵氧體30的端部與基板上的電極之間的間距的變化,利用感應加熱而被加熱的電極的溫度變化情況。 圖5顯示在本發明的一實施方式中,當基板上置有兩個大小不同的電子元件時,對鐵氧體與形成在基板上的電極之間的間距進行調整的方法之例。 圖6示意性地顯示本發明的變形例中的軟焊料接合裝置的構成。 圖7示意性地顯示本發明的變形例中的軟焊料接合裝置的構成。FIGS. 1( a ) and 1 ( b ) schematically show the configuration of the solder bonding apparatus that is the premise of the present invention. FIG. 2 schematically shows the configuration of the solder bonding apparatus according to the embodiment of the present invention. FIG. 3 illustrates a method of bonding electronic components to electrodes formed on a substrate with soft solder using induction heating in one embodiment of the present invention. FIGS. 4( a ) and 4 ( b ) show changes in the temperature of the electrodes heated by induction heating as the distance between the ends of the
10‧‧‧軟焊料接合裝置 10‧‧‧Soft Solder Bonding Device
11‧‧‧基板 11‧‧‧Substrate
20‧‧‧線圈 20‧‧‧coil
21‧‧‧空間部 21‧‧‧Space Department
30‧‧‧鐵氧體 30‧‧‧Ferrite
32‧‧‧鐵氧體板 32‧‧‧Ferrite plate
40‧‧‧調整機構 40‧‧‧Adjustment mechanism
41‧‧‧致動器 41‧‧‧Actuators
42‧‧‧控制部 42‧‧‧Control Department
43‧‧‧記憶部 43‧‧‧Memory Department
50‧‧‧電源 50‧‧‧Power
51‧‧‧導線 51‧‧‧Wire
C‧‧‧電子元件 C‧‧‧Electronic Components
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JP6738057B1 (en) | 2019-06-14 | 2020-08-12 | 株式会社ワンダーフューチャーコーポレーション | Circuit board and mounting method |
JP6928631B2 (en) * | 2019-09-11 | 2021-09-01 | 株式会社スフィンクス・テクノロジーズ | High frequency induction heating head and high frequency induction heating device using it |
KR102221523B1 (en) * | 2019-12-16 | 2021-03-02 | 오세돈 | Welding device for inductive heating |
KR102403214B1 (en) * | 2021-03-30 | 2022-05-30 | 주식회사 비에스테크닉스 | MID shouldering device using induction heat |
CN113814516B (en) * | 2021-10-11 | 2023-08-25 | 珠海格力智能装备有限公司 | Welding gun structure |
KR102569407B1 (en) * | 2021-12-15 | 2023-08-22 | 주식회사 비에스테크닉스 | Induction Heating Soldering Coil and Jig Unit |
KR102574733B1 (en) * | 2021-12-15 | 2023-09-06 | 주식회사 비에스테크닉스 | Induction Heating Multi- Soldering Coil Unit for MID |
KR102595782B1 (en) * | 2021-12-29 | 2023-10-30 | 주식회사 비에스테크닉스 | Induction heating soldering automation apparatus |
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JP2018148136A (en) | 2018-09-20 |
WO2018164039A1 (en) | 2018-09-13 |
TW201842997A (en) | 2018-12-16 |
JP6915843B2 (en) | 2021-08-04 |
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