JP2010253503A - Heater chip and joining apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heater chip that gives no damage to an electronic component by heat and that is designed to obtain joining quality uniform in the longitudinal direction of a trowel, and to provide a joining apparatus. <P>SOLUTION: This is a heater chip 10 that joins a workpiece by bringing the chip into pressurized contact with the workpiece or bringing the chip close thereto. The chip includes a serrated trowel part 10a that generates heat by energization and a heat radiating parts 12A-12E that are formed integrally with the trowel part 10a and that extend in fin shapes on the side opposite from the trowel tip 10e of the serrated trowel part. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a heater chip and a bonding apparatus used for heat bonding such as soldering, heat caulking, and thermocompression bonding.

  Conventionally, as shown in FIG. 1, in order to solder a surface mount type semiconductor package 100 having a plurality of leads 100a protruding to the side of a chip body onto a printed wiring board 102, a long iron part is used. A heater chip 104 having 104a is used (see, for example, Patent Document 1).

  This type of heater chip 104 is formed as a substantially U-shaped plate made of a refractory metal such as tungsten or molybdenum, and has a long bottom iron part 104a in a concave direction (posture) with a horizontal side, The connection terminal portions 104 b and 104 b are attached to the heater head 106. The illustrated heater head 106 physically and electrically connects the left and right connection terminals 104b and 104b of the heater chip 104 with bolts 112 and 112 on the side surfaces of a pair of power supply conductors 108 and 110 that communicate with an output terminal of a heater power source (not shown). They are connected to each other, and have an elevating mechanism for moving the heater chip 104 up and down via the power supply conductors 108 and 110 and a pressurizing mechanism (not shown) for pressing toward the object to be joined. An insulator 114 is sandwiched between the power supply conductors 108 and 110 to electrically separate them.

  In FIG. 1, a printed wiring board 102 is horizontally placed on a work table such as an XY table (not shown), and the semiconductor package 100 is placed at a predetermined position on the printed wiring board 102 by a chip mounter (not shown). . For soldering, the leads 100a, 100a,... For one side (one row) of the semiconductor package 100 are positioned directly below the heater chip 104.

  When the heater head 106 lowers the heater chip 104, as shown in FIG. 2, the lower surface of the elongated iron portion 104 of the heater chip 104, that is, the iron tip surface 104c is joined to the portion to be joined, that is, one row of leads 100a, 100a,. Further, the lands 102a, 102a,. Cream solder (not shown) is applied to the surface of each land 102a. When the heater power supply is turned on and the current I is supplied to the heater chip 104 in a state in which the iron part 104a of the heater chip 104 is pressed against the bonded parts 100a and 102a, the iron part 104a of the heater chip 104 is Resistance heat is generated, and the solder between the bonded portions 100a and 102a is heated and melted. The heater power supply stops energizing after a lapse of a certain time from the start of energization, and the heater head 106 raises the heater chip 104 away from the bonded portions 100a and 102a after the lapse of a certain time from the end of energization. Then, the solder is solidified, and the bonded parts 100a and 102a are joined by reflow soldering.

  In the conventional heater chip 104, as shown in FIG. 2, since there is a space between the lands 102a, the tip surface 104a does not hit (or approach) the printed wiring board 102 and is not damaged. However, depending on the electronic component, there may be no space between adjacent joints. For example, the joint portion may be partitioned by a resin or the like, or a protrusion may be formed between the joint portions. Patent Documents 2 to 4 have been proposed as techniques for protecting adjacent joints in an electronic component having such a configuration.

  In the heater chip of Patent Document 2, a diamond powder having an electrical insulating action is supported on a plating layer at a portion in contact with a terminal of an electronic component, and a part of the diamond powder protrudes from the plating layer, and the substrate from the heater chip. The electronic current is protected by blocking the current to the side. Further, in the heater chip of Patent Document 3, a heater chip is provided in each portion to which heat is applied, and heat is applied only to a necessary part of the electronic component. Furthermore, in the heater chip of Patent Document 3, a plurality of protrusions are provided at locations where resistance heat is generated, and heat is applied to a plurality of locations at the same time so that heat is applied only to necessary locations.

Japanese Utility Model Publication No. 3-14060 Japanese Patent Laid-Open No. 02-165866 Japanese Patent Laid-Open No. 10-291100 JP 2007-253481 A

  However, in the conventional joining apparatus as described above, the temperature of the iron part of the heater chip may not be uniform between the center part and the end part of the iron part. For example, after energization after heating, the rate of temperature drop of the iron part differs between the center part and the end part, and the temperature of the iron part may not be uniform. For this reason, the amount of heat applied to the object to be joined by the heater chip 104 is not uniform in the longitudinal direction of the long iron part 104a, and the center part of the iron part 104a heats relatively more than both ends. . For this reason, there is a concern that the center portion of the bonded portion may be heated and damaged more than necessary.

  Further, in the case of the shape of the conventional heater chip 104 shown in FIG. 1, in the case of an electronic component having no space between adjacent joints, the electronic component may be damaged due to the influence of heat other than the joints. was there.

  Therefore, the present invention has been made in view of the above-described problem, and even if an electronic component has no space between adjacent joints, the electronic component is not damaged by heat, and the entire length of the iron portion. Accordingly, it is an object of the present invention to provide a heater chip and a joining apparatus in which the temperature characteristics during and after energization are made uniform to obtain uniform joining quality in the longitudinal direction of the iron part.

  In order to solve the above-mentioned problems, a heater chip of the present invention is a heater chip that joins the object to be joined by pressing or approaching the object to be joined, and is a comb-shaped iron part that generates heat when energized. And a heat dissipating part that is formed integrally with the iron part and extends in a fin shape on the opposite side of the iron tip part of the comb-like iron part.

  The joining device according to the present invention includes the heater chip according to the present invention, and a heater head that supports the heater chip and causes the tip of the solder part to be in pressure contact with or close to the object to be joined when the object to be joined is joined. And a heater power supply for supplying a current for resistance heating to the heater chip.

  In the heater chip of the present invention, by forming the iron portion in a comb-teeth shape, even if there is no space between adjacent joint portions, the joining can be performed without the influence of heat other than the joint portions. Further, Joule heat generated in the iron part is absorbed by the fin-like heat dissipating part provided on the side opposite to the iron tip part of the comb-like iron part and released to the atmosphere. As a result, the temperature characteristics during and after energization can be made uniform over the entire length of the iron part, and uniform bonding quality can be obtained in the longitudinal direction of the iron part.

  In the present invention, it is preferable to provide a plurality of the fin-like heat radiation portions along the longitudinal direction of the comb-shaped iron portion. According to the present invention, it is possible to increase the uniformity of the iron part temperature.

  In the present invention, the fin-like heat dissipating part is provided on a side opposite to the iron tip of the comb-shaped iron part and corresponding to the iron tip.

  Furthermore, the heater chip according to the present invention further includes a protrusion provided on at least one side opposite to the tip of the iron tip for connecting a thermocouple, and the fin-like heat dissipating section is formed by removing the protrusion. It is provided at a corresponding position on the opposite side of the iron tip. According to the aspect of the present invention, the thermocouple can be disposed at a desired position of the heater chip, and the heater chip can be formed small.

  Further, in the heater chip of the present invention, the phenomenon that the heat of the iron part is absorbed by the thermocouple connected to the protrusion by heat conduction, that is, heat pulling occurs in the protrusion. The effect similar to the heat radiation in the fin-shaped heat radiation portion can be obtained by this heat drawing. In addition, in the protrusion and the thermocouple connected to the protrusion, heat can be released to the atmosphere as in the fin-like heat radiating portion.

  Furthermore, as a preferred embodiment, the fin-like heat radiating portion is formed in a plate shape flush with the iron portion, and the iron portion and the fin-like heat radiating portion are integrally formed of the same material. Further, the amount of heat of the tip portion is controlled by adjusting the fin-like heat radiation portion. The comb-shaped iron part has a plurality of iron tips having different amounts of heat when generating heat. According to the present invention, the amount of heat can be controlled by a combination of the shapes of the iron tip.

  In addition, the heater chip of the present invention extends from both ends of the comb-shaped iron part to the periphery of the fin-like heat radiating part in order to make a physical and electrical connection with a power supply conductor from a heater power source. It has a pair of connection terminal portions. In this case, as a preferred embodiment, the iron part, the fin-like heat radiating part, and the connection terminal part may be formed integrally by punching a tungsten plate by wire electric discharge machining.

  The joining device of the present invention can be applied to any application in which a part to be joined is heated and joined using a comb-shaped iron part that generates heat and is heated, for example, soldering, joining via an anisotropic conductive material, heat It can be suitably applied to caulking, thermocompression bonding, and the like.

  According to the present invention, even if there is no space between adjacent joints, joining is possible without affecting the heat other than the joints. It is possible to provide a heater chip and a joining apparatus in which the temperature characteristics during and after energization are made uniform over the entire length of the iron part to obtain uniform joining quality in the longitudinal direction of the iron part.

It is a perspective view which shows the example of the conventional heater chip | tip and soldering using it. It is a front view which shows the state which is energizing the heater chip of FIG. It is a figure which shows the whole structure of the heater chip in one Embodiment of this invention. It is a perspective view of a heater chip in one embodiment of the present invention. It is a front view which shows the state which is energizing the heater chip of embodiment. It is a circuit diagram which shows an example of the heater power supply for supplying the electric current for energization heat_generation | fever to the heater chip of embodiment. It is a figure which shows the whole structure of the heater chip in other embodiment of this invention. It is a perspective view of the heater chip in other embodiments of the present invention. It is a perspective view of the heater chip in other embodiments of the present invention.

  DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments according to the present invention will be described in detail with reference to the drawings.

FIG. 3 is a diagram illustrating a configuration of the heater chip 10 according to the embodiment of the present invention. FIG. 4 is a perspective view of the heater chip 10 in one embodiment of the present invention. The heater chip 10 is formed using a tungsten plate rolled to a plate thickness of, for example, 1 to 3 mm. The rolled tungsten plate has a structure in which extremely thin plates are laminated (hereinafter, simply referred to as a laminated structure). The heater chip 10 of this embodiment is formed by punching and integrally processing the tungsten plate by wire electric discharge machining. Further, the heater chip 10 is formed with a comb-like iron portion 10a. The iron part 10a is integrally formed with a base part 10f extending in the longitudinal direction and iron tip parts 10e _{1 to} 10e ₇ protruding in a protruding shape from the base part 10f.

Further, the heater chip 10 integrally includes heat dissipating parts 12A to 12E extending in a fin shape on the side opposite to the iron tip part 10e of the comb-like iron part 10a. More specifically, five fin-like heat radiation portions 12A to 12E are provided along the longitudinal direction of the comb-shaped iron portion 10a. Rectangular fin heat radiating portion 12A~12E are respectively provided on the opposite side of the position excluding the tip portion 10e _1, 10e ₇ across one of the tip portions 10e ₁ ~10e ₇ of the comb-shaped iron section 10a ing. In other words, the fin-like heat radiating portion 12A is provided at a position corresponding to the tip portion 10e ₂ of the comb-shaped iron section 10a, the fin-like heat radiation portion 12B is provided at a position corresponding to the tip portion 10e _3, iron part fin heat radiating portion 12C is provided at a position corresponding to 10e _4, the fin-like heat radiating portion 12D is provided at a position corresponding to the iron portion 10e _5, fin heat radiating portion 12E is provided at a position corresponding to the iron portion 10e ₆ It has been. It is preferable to have a large area in order from the fin-like heat radiation portions 12A and 12E on both sides toward the fin-like heat radiation portion 12C at the center.

  Further, in the fin-shaped heat radiation portions 12A to 12E, preferably, the base end portions 14A to 14E connected to the comb-shaped iron portion 10a are cut and constricted in a slit shape. As will be described later, the narrowed base end portions 14A to 14E prevent the current I flowing through the iron portion 10a from being electrically affected by the fin-shaped heat radiation portions 12A to 12E, that is, the fin-shaped heat radiation portions. The portion of the base portion 10f of the iron portion can be vertically cut without flowing through 12A to 12E.

  A pair of connection terminal portions 10b and 10b are connected to the left and right ends of the comb-shaped iron portion 10a. These connection terminal portions 10b and 10b extend around the fin-shaped heat radiation portions 12A to 12E while forming appropriate gaps, and are provided with a plurality of bolt through holes 16 and 16 at their upper ends. In addition, the protrusion 18 for attaching the thermocouple 20 (FIG. 5) mentioned later is formed in the lower end part inner side of the connection terminal part 10b of the one side (left of a figure).

Like the conventional heater chip 100, the heater chip 10 may be attached to the heater head 106 (FIG. 5) of the bonding apparatus, and may perform energization heat generation operation according to a conventional method. For example, when the lead wires 120a, 120a,... Are soldered to a row of terminals 130a, 130a,..., The heater head 106 has a tip of the comb-shaped iron part 10a as shown in FIG. A heater power supply (not shown) is turned on with the portions 10e _{1 to} 10e _{7 in contact} with the lead wires 120a, 120a,... And the terminals 130a, 130a,. Thus, the current I is supplied to the heater chip 10 through the power supply conductors 108 and 110. Then, the iron part 10a of the heater chip 10 generates resistance heat, and the solder between the joined parts (120a, 130a) is heated and melted.

At this time, in the fin-like heat radiation portions 12A to 12E, the narrowed base end portions 14A to 14E become high-resistance current blocking portions, and the current I is not drawn, so that the current (electric current density) of the iron portion 10a base portion 10f is electrically connected. The Joule heat generated in each part of the base part 10f of the iron part 10a is absorbed on the opposite side of the iron tip parts 10e _{1 to} 10e ₇ and released only to the atmosphere. Here, the fin-like heat radiating portion 12A mainly dissipates Joule heat generated in the section between the left end and the portion corresponding to the tip portion 10e ₃ of the base portion 10f, the fin-like heat radiating portion 12B mainly base dissipates Joule heat generated in the section between the tip section 10e ₂ corresponding portion corresponding portion tip portion 10e ₄ in the 10f, fin heat radiating portion 12C mainly occurs in the central portion of the base 10f and released heat Joule heat, the fin-like heat radiating portion 12D mainly dissipates Joule heat generated in the section between the portion corresponding to the portion and the tip portion 10e ₆ corresponding to the tip portion 10e ₄ of the base portion 10f The fin-like heat radiating portion 12E mainly radiates Joule heat generated in the section between the tip 10e ₅ of the base portion 10f and the right end portion.

In the present embodiment, since the more heat dissipation rate toward the center from both ends of the iron portion 10a is configured so as to be higher, while power of tip portion 10e ₁ ~10e ₇ over the entire length of the iron portion 10a and The temperature characteristics immediately after energization can be made uniform.

  Then, the heater power supply stops energizing after a lapse of a certain time from the start of energization, and the heater head 106 raises the heater chip 10 away from the bonded portions (120a, 130a) after the lapse of a certain time from the end of energization. If it does so, solder will solidify and a joined part (120a, 130a) will combine by soldering. In this embodiment, since the temperature characteristics are uniform during energization of the base portion 10f and immediately after the energization is completed over the entire length of the iron portion 10a, one row of lead wires 120a, 120a,... Corresponds to the corresponding terminals 130a, 130a,. To be soldered evenly. Therefore, the central portion of the lead wiring row is not heated and damaged more than necessary. Further, as shown in FIG. 5, since the iron portion 10a has a comb-teeth shape in accordance with the terminals 130a, 130a,..., Even if there is no space between the adjacent terminals 130a, 130a,. Joining is possible without affecting the heat other than the part.

  FIG. 6 shows an example of the heater power supply 28 for supplying a current for generating heat to the heater chip 10 of this embodiment. The heater power supply 28 uses an AC waveform inverter type power supply circuit.

  The inverter 30 in this power supply circuit has four transistor switching elements 32, 34, 36, and 38 made of GTR (giant transistor) or IGBT (insulated gate bipolar transistor).

Among these four switching elements 32 to 38, the first set (positive side) switching elements 32 and 36 are driven at a predetermined inverter frequency by in-phase drive pulses G ₁ and G ₃ from the control unit 42 via the drive circuit 40. Switching (on / off) is controlled at the same time (for example, 4 kHz), and the second set (negative electrode side) of the switching elements 34 and 38 are driven by in-phase drive pulses G ₂ and G ₄ from the control unit 42 via the drive circuit 40. Switching control is performed simultaneously with the inverter frequency.

The input terminals [L ₀ , L ₁ ] of the inverter 30 are connected to the output terminals of the three-phase rectifier circuit 44. The three-phase rectifier circuit 44 is formed by, for example, connecting six diodes in a three-phase bridge, and full-wave rectifying a commercial-frequency three-phase AC voltage input from a three-phase AC power supply terminal (R, S, T) to generate a direct current. Convert to voltage. The DC voltage output from the three-phase rectifier circuit 44 is smoothed by the capacitor 46 and then applied to the input terminals [L ₀ , L ₁ ] of the inverter 30.

Output terminals [M ₀ , M ₁ ] of the inverter 30 are respectively connected to both ends of the primary coil of the welding transformer 48. Both ends of the secondary side coil of the welding transformer 48 are connected to the connection terminal portions 10b and 10b of the heater chip 10 via the secondary side conductors 108 and 110 without passing through the rectifier circuit.

  The control unit 42 includes a microcomputer, and performs all controls in the heater power supply 28, such as energization control (particularly inverter control), various heat condition setting or display processing, etc., as well as required for the heater head 106. Control.

  In the heater power supply 28, a solder temperature measurement signal output from the thermocouple 20 attached to the protrusion 18 of the heater chip 10 is given to the controller 42 via the cable 22 in order to perform chip temperature feedback control. When current feedback control is performed, a current sensor 50 made of, for example, a current transformer is attached to the conductor of the primary circuit. A measured value (for example, effective value, average value, or peak value) of the primary current or the secondary current is obtained from the output signal of the current sensor 50 in the current measurement circuit 52, and the current measurement signal is given to the control unit 42.

  The configuration of the heater power supply unit 28 using an AC waveform inverter type power supply circuit as shown in FIG. 6 is merely an example, and a single-phase AC type or any other arbitrary type is used to cause the heater chip 10 of this embodiment to generate resistance heat for bonding purposes. A model heater power supply can be used.

Next, another embodiment of the present invention will be described. FIG. 7 is a diagram showing a configuration of a heater chip 60 according to another embodiment of the present invention. FIG. 8 is a perspective view of a heater chip 60 according to another embodiment of the present invention. 7 and 8 show a state in which the thermocouple 20 is welded to the protrusion 68. FIG. The heater chip 60 is formed using a tungsten plate rolled to a plate thickness of, for example, 1 to 3 mm, similarly to the heater chip 10 described above. The heater chip 60 of this embodiment is formed by punching and integrally processing the tungsten plate by wire electric discharge machining. Further, the heater chip 60 has a protrusion 68 for welding the thermocouple 20 on the opposite side of the central tip 60e ₄ and is positioned on the opposite side except for the tips 60e ₁ and 60e ₇ at both ends. In the positions corresponding to the iron tips 60e ₂ , 60e ₃ , 60e ₄ , and 60e ₆ excluding the protrusion 68, fin-like heat radiating portions 62A to 62D are formed integrally with the iron 60a. .

More specifically, four fin-like heat radiation portions 62A to 62D and a protrusion 68 are provided along the longitudinal direction of the comb-shaped iron portion 60a. That is, the fin-like heat radiating portion 62A is provided at a position corresponding to the iron tip 60e ₂ of the comb-like iron portion 60a, and the fin-like heat radiating portion 62B is provided at a position corresponding to the iron tip 60e _3. A protrusion 68 is provided at a position corresponding to 60e ₄ , a fin-like heat dissipating part 62C is provided at a position corresponding to the iron part 60e ₅ , and a fin-like heat dissipating part 62D is provided at a position corresponding to the iron part 60e _6. Yes.

  The thermocouple 20 is connected to the protrusion 68 by, for example, arc welding. This thermocouple 20 is for measuring the temperature of the iron part 60A. The fin-like heat dissipating parts 62B and 62C on both sides of the protrusion 68 are larger than the fin-like heat dissipating parts 62A and 62D in order to secure a gap when the thermocouple 20 is attached and to secure an area as a heat dissipating part. , Formed in an elongated shape in the longitudinal direction.

  Further, in the fin-shaped heat radiation portions 62A to 62D, preferably, the base end portions 64A to 64D connected to the comb-shaped trowel portion 60a are cut and constricted in a slit shape. Due to the narrowed base end portions 64A to 64D, the current I flowing through the iron portion 60a when energized flows without being electrically affected by the fin-like heat radiation portions 62A to 62D, that is, flows to the fin-like heat radiation portions 62A to 62D. The base 60f portion of the iron portion can be cut vertically without any problems.

  A pair of connection terminal portions 60b and 60b are connected to the left and right ends of the comb-shaped iron portion 60a. These connection terminal portions 60b and 60b extend around the fin-like heat radiation portions 62A to 62D while forming appropriate gaps, and are provided with a plurality of bolt through holes 66 and 66 at their upper ends.

Like the heater chip 10, the heater chip 60 may be attached to the heater head 106 (FIG. 5) of the bonding apparatus and perform an energization heat generation operation according to a conventional method. In the fin-shaped heat radiation portions 62A to 62D, the base end portions 64A to 64D and the protrusion 68 serve as a high-resistance current blocking portion and do not draw the current I. Therefore, what is electrically applied to the base portion 60f of the iron portion 60a? Without any influence, only Joule heat generated at each part of the base part 60f of the iron part 60a is absorbed on the opposite side of the iron tip parts 60e _{1 to} 60e ₇ and only released to the atmosphere.

  On the other hand, the protrusion 68 can exhibit the same effect as the heat dissipation effect of the fin-like heat dissipation parts 62 </ b> A to 62 </ b> D by heat sinking of the thermocouple 20 connected to the protrusion 68. In addition, in the protrusion and the thermocouple connected to the protrusion, heat can be released to the atmosphere as in the fin-like heat radiating portion.

Here, the fin-like heat radiating portion 62A mainly dissipates Joule heat generated in the section between the portion corresponding to the left end portion and the tip portion 60e ₃ of the base portion 60f, the fin-like heat radiating portion 62B mainly base The protrusion 68 to which Joule heat generated in the section between the portion corresponding to the iron tip 60e ₂ of 60f and the portion corresponding to the iron tip 60e ₄ is radiated and the thermocouple 20 is welded is mainly the base 60f. dissipates Joule heat generated in the central portion of, occurred in the interval between the portion and the tip portion 60e ₆ parts corresponding to the fin-shaped radiator part 62C mainly corresponding to the tip portion 60e ₄ of the base portion 60f It dissipates Joule heat fins radiating portion 62D mainly radiates Joule heat generated in the section between the tip section 60e ₅ and the right end portion of the base portion 60f.

In the present embodiment, since the more heat dissipation rate toward the center from both ends of the iron portion 60a is configured so as to be higher, while power of tip portion 60e ₁ ~60e ₇ over the entire length of the iron portion 60a and The temperature characteristics immediately after energization can be made uniform. Further, the projection 68 for welding the thermocouple 20 can have the same function as the fin-like heat radiation portion. That is, Joule heat generated in the iron part 60 a can be absorbed also from the protrusion 68 by the heat pulling of the thermocouple 20 connected to the protrusion 68. Further, according to the heater chip of the present embodiment, the thermocouple can be disposed at a desired position of the heater chip, and thus the heater chip can be made small.

  In each of the above embodiments, an example has been described in which the heat dissipation rate is increased toward the center of the iron part, that is, the fin-like heat dissipating part at the center of the iron part is formed larger. With this configuration, the heat generation balance can be made uniform, and the same amount of heat can be obtained throughout the iron part. Similarly, it is also possible to make the same amount of heat in the entire area of the iron part by making the widths of the individual iron tip parts different according to the width of the joined part. In this case, the shape of the fin-shaped heat radiation portion is adjusted in consideration of the heat radiation amount of the tip portion.

Moreover, unlike each embodiment mentioned above, it is also possible to change a heat quantity with a tip part. FIG. 9 shows an example in which the heat generation of the tip part is controlled by adjusting the shape and area of the tip part. As shown in FIG. 9, the heater chip 70 is formed with a comb-shaped iron part 70a. The iron part 70a is integrally formed with a base part 70f extending in the longitudinal direction and iron tip parts 70e _{1 to} 70e ₇ protruding in a protruding shape from the base part 70f.

The tip portions 70e _{1 to} 70e ₇ are formed to have a plurality of shapes so that the amount of heat at the time of heat generation is different. More specifically, the iron tip portions 70e ₁ , 70e ₃ , 70e ₅ , and 70e ₇ have a shape in which the central portion is recessed so that the amount of heat increases when heat is generated. The iron tip portions 70e ₂ , 70e ₄ , 70e ₆ have a shape in which the central portion swells so that the amount of heat is lower than that of the iron tip portions 70e ₁ , 70e ₃ , 70e ₅ , 70e ₇ when heat is generated. In this manner, the heat generation of the tip 70e can be controlled by adjusting the shape and area of the tip 70e.

  In addition, the heater chip 70 integrally includes heat dissipating parts 72A to 72E extending in a fin shape on the opposite side of the iron tip part 70e of the comb-like iron part 70a with the iron part 70a. Further, in the fin-like heat radiation portions 72A to 72E, the base end portions 74A to 74E connected to the comb-shaped iron portion 70a are cut out and constricted in a slit shape. A pair of connection terminal portions 70b and 70b are connected to the left and right ends of the comb-shaped iron portion 70a. A projecting portion 78 for attaching the thermocouple 20 is formed on the inner side of the lower end portion of the connection terminal portion 70b on one side (left side in the figure).

  Moreover, the heat quantity of the tip part 70e can also be controlled by adjusting the shape and area of the fin-like heat radiation parts 72A to 72E. For example, the fin-like heat dissipating part corresponding to the tip part where heat generation is desired to be made smaller and the fin-like heat dissipating part corresponding to the tip part desired to suppress heat generation are made larger. In this way, the heat balance of the iron part can be adjusted.

  The preferred embodiments of the present invention have been described in detail above, but the present invention is not limited to the embodiments according to the present invention, and various modifications and changes can be made within the scope of the gist of the present invention described in the claims. Is possible. In the heater chips 20, 60 and 70, the space between the tips may be U-shaped or U-shaped. Further, in the heater chip 60, the example in which the protrusion 68 for welding the thermocouple 20 is formed in the central portion has been described. However, the protrusion 68 is positioned on the opposite side of the tip 60e other than the central portion. You may make it provide in. Further, in the heater chip 60, the example in which only one protrusion 68 for welding the thermocouple 20 is provided has been described, but the present invention is not limited to this, and a plurality of protrusions are provided. A plurality of thermocouples may be provided there. Furthermore, in this embodiment, the case where a tungsten plate having a laminated structure is used has been described, but molybdenum or an alloy of tungsten and molybdenum may be used.

  Further, in each of the above embodiments, the case where the heater chips 20, 60, 70 of the present invention are used for soldering is exemplified, but instead of this, bonding using an anisotropic conductive material, bonding by thermal caulking, It can be suitably used for joining by thermocompression bonding.

10, 60, 70 Heater chip 10a, 60a, 70a Iron part 10b, 60b, 70b Connection terminal part 10e, 60e, 70e Iron tip part 10f, 60f, 70f Base part 12A-12E, 62A-62D, 72A-72E Heat radiation part 18 , 68, 78 Projection 20 Thermocouple

Claims (11)

A heater chip that joins the workpiece by pressing or approaching the workpiece,
A comb-shaped iron part that generates heat when energized;
A heater chip having a heat dissipating part formed integrally with the iron part and extending in a fin shape on the opposite side of the iron tip part of the comb-like iron part. The heater chip according to claim 1, wherein a plurality of the fin-shaped heat radiation portions are provided along a longitudinal direction of the comb-shaped iron portion. 3. The heater chip according to claim 2, wherein the fin-like heat dissipating part is provided at a position opposite to the iron tip of the comb-like iron part and corresponding to the iron tip. A protrusion for connecting a thermocouple provided on at least one opposite side of the iron tip;
3. The heater chip according to claim 2, wherein the fin-like heat radiating portion is provided at a position corresponding to the opposite side of the tip portion excluding the protrusion. 4. The heater chip according to any one of claims 1 to 4, wherein the fin-shaped heat radiation portion is formed in a plate shape flush with the iron portion. The heater chip as described in any one of Claims 1-5 which controls the calorie | heat amount of the said tip part by adjusting the said fin-shaped thermal radiation part. The heater chip according to any one of claims 1 to 6, wherein the comb-shaped iron portion has a plurality of iron tips having different amounts of heat when heat is generated. The heater chip according to any one of claims 1 to 7, wherein the iron part and the fin-shaped heat radiation part are integrally formed of the same material. A pair of connection terminal portions extending from both ends of the comb-shaped iron portion to the periphery of the fin-like heat radiating portion in order to establish a physical and electrical connection with a power supply conductor from a heater power source. The heater chip according to any one of claims 1 to 8. The heater chip according to claim 9, wherein the iron part, the fin-like heat radiating part, and the connection terminal part are integrally formed by piercing a tungsten plate by wire electric discharge machining. The heater chip according to any one of claims 1 to 10, and
A heater head for supporting the heater chip and bringing the iron tip of the iron part into pressure contact with or close to the object to be bonded when bonding the object to be bonded;
A heater power supply for supplying a current for resistance heating to the heater chip;
A joining apparatus.

Images