CN116076161A - Heating nozzle and heating nozzle unit - Google Patents
Heating nozzle and heating nozzle unit Download PDFInfo
- Publication number
- CN116076161A CN116076161A CN202180062069.5A CN202180062069A CN116076161A CN 116076161 A CN116076161 A CN 116076161A CN 202180062069 A CN202180062069 A CN 202180062069A CN 116076161 A CN116076161 A CN 116076161A
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- China
- Prior art keywords
- soldering iron
- heating tip
- connection arm
- heat generating
- iron body
- Prior art date
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 75
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 188
- 238000005476 soldering Methods 0.000 claims abstract description 97
- 229910052742 iron Inorganic materials 0.000 claims abstract description 91
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 7
- 230000003647 oxidation Effects 0.000 claims description 16
- 238000007254 oxidation reaction Methods 0.000 claims description 16
- 239000011247 coating layer Substances 0.000 claims description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 16
- 239000000463 material Substances 0.000 description 13
- 238000001816 cooling Methods 0.000 description 9
- 229910052759 nickel Inorganic materials 0.000 description 8
- 238000007747 plating Methods 0.000 description 8
- 238000009529 body temperature measurement Methods 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000003466 welding Methods 0.000 description 5
- 238000003754 machining Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
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- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000002788 crimping Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000000994 depressogenic effect Effects 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
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- 230000005855 radiation Effects 0.000 description 2
- 230000000191 radiation effect Effects 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910001080 W alloy Inorganic materials 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
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- 230000000149 penetrating effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
Abstract
A heating tip (2) of the present invention is a plate-shaped heating tip for thermocompression bonding a terminal wire to a terminal member, the heating tip (2) comprising: a soldering iron part (4) which is provided with a soldering iron front end part (7) which is abutted against the lead wire for the terminal on the soldering iron body (6); and a pair of connection arm sections (5) which extend upward from the left and right end sections of the soldering iron body (6) in a state of being separated from each other, and which heat the soldering iron section (4) by passing a current from a power source through the soldering iron body (6), wherein a concave section (13) is formed on at least one surface of the soldering iron body (6) and the connection arm sections (5), and the concave section (13) has wall surfaces (14) which are lowered in a direction intersecting the surface direction of the surface on both sides.
Description
Technical Field
The present invention relates to a heating tip for thermocompression bonding a terminal wire to a terminal member, and a heating tip unit provided with a temperature sensor in the heating tip.
Background
In a process of thermocompression bonding a terminal wire to a terminal member, for example, in a process of thermocompression bonding a wire to a terminal portion of a core in manufacturing an electronic component such as a chip inductor (chip inductor), a heating tip unit for thermocompression bonding is used. Specifically, a heating tip unit is configured by attaching a thermocouple or the like as a temperature sensor to a heating tip that heats up in a soldering iron portion, and the heating tip unit is attached to a tool holder (tool holder) of a thermocompression bonding device. Then, the thermal compression bonding apparatus is operated, and the terminal wire mounted on the terminal member is rapidly heated while being pressurized by the soldering iron portion of the heating tip, so that the terminal wire is thermally compressed to the terminal member (for example, refer to patent document 1).
In the thermocompression bonding step, a part of the coating layer of the wire vaporized by heat becomes smoke (fuse) and adheres to the tip surface of the soldering iron. Further, since the heating tip is repeatedly heated and cooled, the tip surface of the soldering iron gradually oxidizes to form fine irregularities. Therefore, after thermocompression bonding, the attached coating is peeled off by moving the soldering iron front end face parallel to the soldering iron front end face in a state of pressing against a grindstone, grinding paper, or the like, and the oxide of the soldering iron front end face is ground to be trimmed to a clean plane.
Prior art literature
Patent literature
Patent document 1: japanese patent laid-open No. 2001-284781
Patent document 2: japanese patent application laid-open No. 2012-222316
Disclosure of Invention
Problems to be solved by the invention
However, in the heater nozzle (heater nozzle unit) described in the above patent document, the cross-sectional area of a portion through which the current passes tends to be reduced in order to increase the current density and improve the heat generation efficiency. Specifically, the soldering iron portion and the pair of connection arm portions are formed of a conductive plate material, and the thermocouple is mounted in the vicinity of the soldering iron portion, wherein the soldering iron portion is provided with a soldering iron tip portion that is in contact with the terminal lead wire in the soldering iron body, and the pair of connection arm portions extend upward from the left and right end portions of the soldering iron body in a state of being separated from each other, and a current from the power supply is caused to flow through the soldering iron body to raise the temperature of the soldering iron portion. In recent years, there has been a trend toward a reduction in the plate thickness of the heat generating portion in order to improve the heat generating efficiency, for example, the cross-sectional area of the heat generating portion is made smaller by gradually decreasing the plate width of the connection arm portion toward the tip end portion of the soldering iron and gradually decreasing the plate thickness. However, if the plate thickness of the heat generating portion is reduced, it is difficult to secure rigidity. Therefore, when an operator takes out the heating tip or the holder attached to the device and fastens the heating tip or the holder, even when the oxide on the front end surface of the soldering iron is polished after thermocompression bonding, cracks or damages may occur in the vicinity of the heat generating portion.
Further, even if the cross-sectional area of the heat generating portion is reduced to improve the heat efficiency, the surface area is reduced by the reduced cross-sectional area, and thus, there is a problem that the cooling time after the current interruption becomes long and the number of operations per unit time is reduced.
The present invention has been made in view of the above circumstances, and an object thereof is to provide a heating tip and a heating tip unit which can ensure sufficient rigidity even if the cross-sectional area of a portion where electric current passes and generates heat is reduced.
Means for solving the problems
The present invention has been made to achieve the above object, and a first aspect of the present invention provides a heater nozzle for thermally crimping a terminal wire to a terminal member, the heater nozzle comprising,
the heating tip has:
a soldering iron part which is provided with a soldering iron front end part abutting against the terminal lead wire on the soldering iron body; and
a pair of connection arm portions extending upward from left and right end portions of the soldering iron body in a state of being separated from each other, and causing a current from a power source to flow through the soldering iron body to heat the soldering iron portion,
a recess is formed in at least one of the soldering iron body and the connection arm, and the recess has a wall surface that descends in a direction intersecting a surface direction of the surface at an edge.
A heating tip according to a second aspect is the heating tip according to the first aspect, wherein a heating portion having a cross-sectional area in a direction orthogonal to a direction in which the current flows is formed in a range from the connection arm portion to the soldering iron portion, the heating portion including a portion of the recess portion and a portion of the wall surface, and the area of the cross-sectional area being set smaller than that of the other portion in which the current flows.
The heating tip of the third aspect is a plate-shaped heating tip for thermocompression bonding a terminal wire to a terminal member, characterized in that,
the heating tip has:
a soldering iron part which is provided with a soldering iron front end part abutting against the terminal lead wire on the soldering iron body; and
a pair of connection arm portions extending upward from left and right end portions of the soldering iron body in a state of being separated from each other, and causing a current from a power source to flow through the soldering iron body to heat the soldering iron portion,
a groove is formed in at least one of the soldering iron body and the connection arm, and the groove has wall surfaces on both sides that descend in a direction intersecting the surface direction of the surface.
A heating tip according to a fourth aspect is the heating tip according to the third aspect, wherein a heating portion having a cross-sectional area in a direction orthogonal to a direction in which the current flows is formed in a range from the connection arm portion to the soldering iron portion, the heating portion including a part of the groove portion and a part of the wall surface, and the area of the cross-sectional area being set smaller than that of the other portion in which the current flows.
A fifth aspect of the heating tip according to the second or fourth aspect is characterized in that an oxidation-resistant coating layer is formed on at least the surface of the heat generating portion.
A heater nozzle unit according to a sixth aspect is the heater nozzle unit according to any one of the first to fifth aspects, wherein an oxidation-resistant coating layer is formed on a surface of the temperature sensor.
Effects of the invention
The present invention has the following excellent effects.
According to the first aspect of the invention, the recess portion is formed in at least one of the soldering iron body and the connection arm portion, and the recess portion has the wall surface that descends in the direction intersecting the surface direction of the surface at the edge portion, so that the portion outside the wall surface of the recess portion functions as the rib portion, whereby rigidity can be ensured. In addition, the surface area of the heating tip can be increased by forming the recessed portion to generate the wall surface around the recessed portion, and the area of the heating tip contacting the air can be increased to improve the heat radiation function. Therefore, the cooling time can be shortened to shorten the takt time, and the productivity can be improved.
According to the second aspect of the invention, the heat generating portion having the cross-sectional area in the direction orthogonal to the direction in which the current flows is set smaller than the cross-sectional area of the other portion in which the current flows is formed in the range from the connection arm portion to the soldering iron portion, and the heat generating portion includes a part of the recess portion and a part of the wall surface, so that the reduction of the cooling time of the heat generating portion can be facilitated, and the production efficiency can be improved.
According to the third aspect of the invention, the groove portion is formed in at least one of the soldering iron body and the connection arm portion, and the groove portion has the wall surface on both sides thereof which is lowered in the direction intersecting the surface direction of the surface, so that the outer portion of the wall surface of the groove portion functions as the rib portion, whereby rigidity can be ensured. In addition, the wall surfaces are generated on both sides of the groove portion with the formation of the groove portion, and the surface area of the heating tip can be increased accordingly, whereby the area contacting the air can be increased, and the heat radiation function can be improved. Therefore, the cooling time can be shortened to shorten the tact time, and the production efficiency can be improved.
According to the fourth aspect of the invention, the heat generating portion having the cross-sectional area in the direction orthogonal to the direction in which the current flows is set smaller than the cross-sectional area of the other portion in which the current flows is formed in the range from the connection arm portion to the soldering iron portion, and the heat generating portion includes a part of the groove portion and a part of the wall surface, so that the reduction of the cooling time of the heat generating portion can be facilitated, and the production efficiency can be improved.
According to the fifth aspect of the invention, since the oxidation-resistant coating layer is formed at least on the surface of the heat generating portion, the oxidation resistance can be suppressed, and the durability can be improved.
According to the sixth aspect of the invention, the temperature sensor is provided in the heating nozzle, and the oxidation-resistant coating layer is formed on the surface of the temperature sensor, so that the easy oxidation can be suppressed even when the heating and the cooling are repeated, and the durability of the heating nozzle unit can be improved.
Drawings
Fig. 1 is a perspective view of a heating tip unit in which a linear concave portion is formed in a lower half portion of a joint arm portion.
Fig. 2 is a perspective view of the heating tip with a recess formed from the lower half of the connection arm portion up to the soldering iron body.
Fig. 3 is a front view of a heating tip formed with a concave portion from a soldering iron portion to a lower end portion of a connection arm portion.
Fig. 4 is a front view of a heating tip unit equipped with a thermocouple.
Fig. 5 is a cross-sectional view of another embodiment of the groove ((a) to (c) are conventional examples, and (d) to (r) are examples).
Fig. 6 is a perspective view of a heating tip in which a concave portion is also formed in the middle of a connecting arm portion.
Fig. 7 is a perspective view of a heating tip having a groove formed in the middle of a connecting arm.
Detailed Description
The manner in which the present invention can be practiced is described below with reference to the accompanying drawings.
The heating nozzle unit 1 is configured to include: a plate-shaped heating tip 2 for thermocompression bonding a terminal wire to a terminal member; and a thermocouple 3 mounted as a temperature sensor.
The heater nozzle 2 is a nozzle formed by processing a plate material of a conductive material (tungsten, molybdenum, super hard material, or the like) by wire electric discharge machining, and is configured to have: a soldering iron portion 4 which is a lower portion (a front end portion located on a workpiece (terminal wire or terminal member) side) of the heating tip 2; and a pair of left and right connecting arm portions 5 which are upper portions (base portions). When the electric current is supplied to the soldering iron portion 4 via the connection arm portion 5, the electric resistance, particularly, the area between the lower portion of the connection arm portion 5 having a smaller cross-sectional area than the other portion and the soldering iron portion 4 functions as a heat generating portion, and the soldering iron portion 4 can be heated efficiently, and the temperature of the soldering iron portion 4 can be measured by the thermocouple 3 by adopting the above-described configuration.
The soldering iron portion 4 includes a horizontally long soldering iron body 6 connecting lower portions of the connection arm portions 5, and a box-shaped soldering iron tip portion 7 is provided to protrude downward at a bottom portion of the soldering iron body 6 protruding slightly downward, and a bottom surface (tip end surface) of the soldering iron tip portion 7 is made to be a soldering iron tip surface 8 so as to be capable of being brought into contact with a terminal lead wire. Further, a substantially V-shaped or substantially U-shaped solder concave portion 9 is formed in an upper portion (a connection arm portion 5 side) located on the opposite side of the solder tip portion 7 of the solder body 6, and a temperature measurement junction (temperature measurement portion) of the thermocouple 3 is fixed in the solder concave portion 9 in a state of being in contact with and supported at two points on the surface of the solder concave portion 9.
The connection arm portions 5 are elongated constituent portions extending upward from the left and right end portions of the soldering iron body 6, and are provided in a state in which the connection arm portions 5 are separated from each other. Further, the mounting hole 11 for mounting to the nozzle holder (not shown) of the thermocompression bonding device is formed in the upper portion (extending end portion) of the connection arm portion 5 so as to penetrate in the plate thickness direction of the heating tip 2, and a mounting bolt (not shown) passing through the mounting hole 11 is screwed to the nozzle holder, whereby the heating tip unit 1 is mounted to the nozzle holder in a state in which the soldering iron tip portion 7 is directed downward (toward the bonding stage).
In the heating tip unit 1 attached to the tip holder, one of the connection arm portions 5 is electrically connected to one end of a heater power supply (not shown) of the thermal compression bonding apparatus, and the other connection arm portion 5 is electrically connected to the other end of the heater power supply. When a current is supplied from a power source (heater power source) to the heater nozzle 2, the current flows through the connection arm portions 5 and 5 into the soldering iron body 6, and the soldering iron body 6 generates heat due to a resistor from the lower end of the connection arm portion 5 into the soldering iron body 6, and the soldering iron tip portion 7 is heated by the heat. Further, although the current in the soldering iron body 6 flows from one of the connection arm portions 5 side toward the other connection arm portion 5 side, in the path of the current flow, the cross-sectional area of the reduced diameter portion located on both sides of the soldering iron concave portion 9 is narrower than the cross-sectional area of the other portion, and thus the current density becomes highest at the reduced diameter portion, and joule heat due to resistance is liable to occur around the portion.
As shown in fig. 1 and 2, the heating tip 2 has a long and thin concave portion 13 formed on the front and rear surfaces of the heating tip 2, specifically, in the lower half portion from the vicinity of the center of the long side of the connection arm portion 5 to the time before reaching the soldering iron portion 4 in fig. 1, and in fig. 2, a concave portion 13 is formed in a range penetrating the soldering iron body 6 in the left-right direction from the wide portion in the vicinity of the center of the long side of the connection arm portion 5 through the lower half portion of the connection arm portion 5. The recess 13 is a recess recessed in the plate thickness direction in any of the drawings, and has a wall surface 14 at its edge portion that descends in a direction intersecting the surface direction of the front and rear surfaces. The illustrated concave portion 13 has a wall surface 14 at its edge portion that descends in a direction (plate thickness direction) substantially orthogonal to the surface direction of the heating tip 2, and is surrounded by the wall surface 14. When the recess 13 is formed in this manner, the outer portion of the wall surface 14 functions as a rib, and therefore, even if the cross-sectional area of the heat generating portion is set to be small, the rigidity can be improved by the portion serving as a rib, and the required strength can be ensured. Further, when the wall surface 14 is formed simultaneously by forming the recessed portion 13, the surface area increases in accordance with the area of the wall surface 14 as compared with the conventional type without the recessed portion 13, and therefore, the cooling efficiency after the energization is interrupted can be improved. This shortens the time required for the crimping process, and the work efficiency can be shortened particularly in terms of automation, thereby contributing to improvement of the work efficiency.
The shape of the concave portion 13 is not limited to a linear shape, and the range to be formed is preferably a portion included in the heat generating portion from the connection arm portion 5 to the soldering iron portion 4, but is not limited thereto, and the range to be lowered with respect to the surface is not limited thereto. For example, in the conventional case where the cross-sectional shape of the heat generating portion is square as shown in fig. 5 (a), when the cross-sectional area of the portion is set to be small, the cross-section is narrowed in the width direction as shown in fig. 5 (b) or in the thickness direction as shown in fig. 5 (c), but in the present invention, the wall surface 14 may be formed in a direction intersecting the narrowed direction.
That is, when the thickness direction of the concave portions 13 is narrowed as shown in fig. 5 (d), the wall surfaces 14 may be formed on both sides of each concave portion 13 (embodiment 1), the wall surfaces 14 may be formed on one edge of the same side of the front and back of each concave portion 13 as shown in fig. 5 (e) (embodiment 2), the wall surfaces 14 may be formed on one edge of the different sides of the front and back of each concave portion 13 as shown in fig. 5 (f) (embodiment 3), the wall surfaces 14 may be formed on the front and back center of each concave portion as shown in fig. 5 (g) (embodiment 4), the wall surfaces 14 may be formed on both sides of one surface as shown in fig. 5 (h) (embodiment 5), the wall surfaces 14 may be formed on one side of one surface as shown in fig. 5 (i) (embodiment 6), and the wall surfaces 14 may be connected to the bottom surfaces as shown in fig. 5 (j) (k) (i) (embodiments 7, 8, 9). In addition, as shown in fig. 5 (m) (n) (o), the shape may be any shape as long as the depressed wall surface 14 (examples 10, 11, 12) is formed at the edge of the depressed portion 13, for example, the shape of fig. 5 (p) (q) or the like. The region in which the concave portion 13 is formed is not limited to the region formed in the lower half of the connection arm portion 5 or the front and rear surfaces of the soldering iron portion 4 along the longitudinal direction, and as shown in fig. 6, the concave portion 13 may be formed in a plurality of stages in parallel in a wide portion in the upper half of the connection arm portion 5. In this way, when a plurality of the concave portions 13 are formed in an aligned manner in the wide portion, the wall surface 14 of the concave portion can be effectively increased, and the heat radiation effect per unit area can be reasonably and greatly increased.
In order to increase the cooling area of the heating tip 2, a groove 15 may be formed in at least one of the front and rear surfaces. For example, as shown in fig. 7, a horizontally long groove 15 may be formed in a plurality of stages in parallel in a wide portion of the upper half of the connection arm 5. The groove 15 has wall surfaces 14 on both sides thereof, which descend in a direction intersecting the surface direction of the front and rear surfaces, on at least one of the surfaces of the soldering iron body 6 and the connection arm 5. The difference is that the end in the longitudinal direction is open, unlike the recess 13.
In this way, when a plurality of grooves are formed in a row in the wide portion, the wall surface 14 of the groove 15 can be effectively increased, and the heat radiation effect per unit area can be reasonably and greatly increased. Further, the gas discharge is improved by opening both ends. The portion where the groove 15 is formed is not limited as in the case of the recess 13, and the width and depth are not limited.
Next, the thermocouple 3 attached to the heating tip 2 and the structure of the heating tip 2 to which the thermocouple 3 is attached will be described.
As shown in fig. 4, the thermocouple 3 is configured such that the distal ends of the two cores are welded to each other to form a spherical temperature measurement joint (temperature measurement portion), each core is covered with a core coating material having electrical insulation, and the cores are further bundled into one wire by the covering of an outer coating material.
In the heating tip 2, a receiving portion for the wire is provided in a gap between the connection arm portions 5, and a fixing portion for the temperature measurement contact is provided in the soldering iron portion 4. Specifically, as shown in fig. 4, the wire is housed in the wire housing space 20 in a state where the wire does not protrude outward from the front and rear surfaces of the heating tip 2, and the wire is extended from the opening of the upper end portion of the wire housing space 20, and the lower end of the wire housing space 20 is widened to communicate with the soldering iron recess 9.
Further, in each of the connection arm portions 5, a notch is formed in a part of a side surface facing the wire receiving space portion 20 and a stopper recess portion 21 is formed so as to communicate with the wire receiving space portion 20, and a wire stopper portion is provided in a part of each of the stopper recess portion 21 and the wire receiving space portion 20 (a portion located between the stopper recess portions 21) by hardening a resin such as an ultraviolet curing resin or a thermosetting resin after injection, and a wire is prevented from being deviated from the wire receiving space portion 20 by the wire stopper portion so as to protrude from the heating tip 2.
In the above embodiment, the thermocouple 3 is exemplified as the temperature sensor of the present invention, but a temperature sensor having an arbitrary structure may be used and attached to the heater nozzle 2.
The oxidation-resistant coating layer will be described below.
In the heating tip 2, since the temperature rise and the cooling are repeated every time the thermal bonding is performed, the surface is liable to oxidize, and particularly, oxidation is remarkable in the vicinity of the soldering iron portion 4 (heat generating portion) and the portion where the thermocouple 3 is soldered. Accordingly, the oxidized portion in the vicinity of the heat generating portion is peeled off to reduce the strength, and the thermocouple 3 is broken when pressurized, and the welded portion of the thermocouple 3 is corroded to reduce the strength, resulting in defects such as detachment of the thermocouple 3 and failure in use.
Therefore, in the present embodiment, the oxidation resistance is improved by forming the oxidation resistance coating layer on the surface of the heating tip 2. The following will specifically explain the steps including the production steps.
First, as for the metal plate to be a material (base material), specifically, it is preferable to use a so-called super hard material (hardness HV900 to 2400) (formal name: super hard alloy, an alloy obtained by sintering a powder of a hard metal carbide) which has been generally used in the past, such as tungsten (hardness HV430 or the like), and which has more excellent abrasion resistance than tungsten alloy (hardness HV200 to 400 or the like), and cut a plate of the super hard material into a predetermined shape by wire cutting. In the case of forming the recessed portion 13, machining such as electric discharge machining (die use) and end mill machining can be performed. In addition, in the case of the groove portion 15, the angle of 90 degrees can be changed as compared with the case of processing the metal plate as the material, that is, the processing can be performed by wire cutting by setting the plane direction of the metal plate to be parallel to the direction of the wire.
Next, the cut pieces were subjected to a pretreatment for plating, then immersed in a dissolution tank, and energized, whereby an oxidation-resistant coating layer formed of nickel was formed on the surfaces of the cut pieces, that is, nickel plating was performed. Then, the solution is pulled up from the dissolution tank to perform post-treatment such as washing.
Then, the temperature measuring junction of the thermocouple 3 is laser welded to a V-shaped or U-shaped temperature measuring fixing portion formed at the upper portion of the soldering iron portion 4. In this welding, since a coating film of a nickel layer is formed on the surface (fixing contact surface) of the temperature measurement fixing portion, wettability is improved, and thereby welding reliability and welding strength are improved. In addition, if wettability at the time of welding is improved, it is possible to suppress laser output more than before, suppress damage to the base material, and achieve improvement in quality and saving in energy consumption.
When the welding of the thermocouple 3 is completed, a further pre-plating treatment is performed, the heating tip unit 1 provided with the thermocouple 3 is immersed in an electrolyte, and nickel plating is performed on the entire surface including the temperature measurement junction of the thermocouple 3.
When the heating tip unit 1 manufactured in this manner is used, the oxidation resistance is improved, and therefore peeling or strength decrease due to oxidation of the soldering iron portion 4 and the attachment portion of the thermocouple 3 can be suppressed, and durability can be improved. In particular, when the base material is made of a superhard material and nickel plating is performed, wettability and weldability can be improved, and durability can be reliably improved. Further, since the thermocouple 3 is mainly composed of nickel, the affinity of nickel plating is good. The oxidation-resistant coating is not limited to nickel plating, and may be gold plating, for example.
The embodiments described are examples in all respects and should not be construed as limiting the invention. The present invention is not limited to the above description, but is intended to be defined by the claims and include all modifications within the meaning and scope equivalent to the claims. For example, as shown in fig. 5 (r), when forming the recess 13 by press working, a punch (punch) may be inserted to bulge the edge of the recess 13, so that the edge is formed to be high and large and the height of the wall surface 14 exceeds the plate thickness (example 15).
Description of the reference numerals
1 heating a nozzle unit; 2 heating the mouth; 3, thermocouple; 4 soldering iron parts; 5 connecting arm parts; 6, soldering iron body; 7 front end part of soldering iron; 8, the front end face of the soldering iron; 9, a concave part of the soldering iron; 11 mounting holes; 13 a concave part; 14 wall surfaces; 15 groove parts; 20 wire receiving voids.
Claims (6)
1. A heating nozzle for thermocompression bonding a terminal wire to a terminal member, characterized in that,
the heating tip has:
a soldering iron part which is provided with a soldering iron front end part abutting against the terminal lead wire on the soldering iron body; and
a pair of connection arm portions extending upward from left and right end portions of the soldering iron body in a state of being separated from each other, and causing a current from a power source to flow through the soldering iron body to heat the soldering iron portion,
a recess is formed in at least one of the soldering iron body and the connection arm, and the recess has a wall surface that descends in a direction intersecting a surface direction of the surface at an edge.
2. A heating tip according to claim 1, wherein,
and a heat generating portion having a cross-sectional area in a direction orthogonal to a direction in which the current flows, the heat generating portion being formed in a range from the connection arm portion to the soldering iron portion, the heat generating portion having an area smaller than that of a cross-sectional area of the other portion in which the current flows, and the heat generating portion including a portion of the recess portion and a portion of the wall surface.
3. A heating nozzle for thermocompression bonding a terminal wire to a terminal member, characterized in that,
the heating tip has:
a soldering iron part which is provided with a soldering iron front end part abutting against the terminal lead wire on the soldering iron body; and
a pair of connection arm portions extending upward from left and right end portions of the soldering iron body in a state of being separated from each other, and causing a current from a power source to flow through the soldering iron body to heat the soldering iron portion,
a groove is formed in at least one of the soldering iron body and the connection arm, and the groove has wall surfaces on both sides that descend in a direction intersecting the surface direction of the surface.
4. A heating tip according to claim 3 wherein,
and a heat generating portion having a cross-sectional area in a direction orthogonal to a direction in which the current flows, the heat generating portion being formed in a range from the connection arm portion to the soldering iron portion, the heat generating portion having an area smaller than that of a cross-sectional area of the other portion in which the current flows, and the heat generating portion including a part of the groove portion and a part of the wall surface.
5. A heating tip according to claim 2 or 4, wherein,
an oxidation-resistant coating layer is formed on at least the surface of the heat-generating portion.
6. A heating tip unit provided with a temperature sensor in the vicinity of a soldering iron portion of the heating tip according to any one of claims 1 to 5, characterized in that,
an oxidation-resistant coating layer is formed on the surface of the temperature sensor.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020-185095 | 2020-11-05 | ||
| JP2020185095A JP7370075B2 (en) | 2020-11-05 | 2020-11-05 | heater chip unit |
| PCT/JP2021/039630 WO2022097546A1 (en) | 2020-11-05 | 2021-10-27 | Heater tip and heater tip unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116076161A true CN116076161A (en) | 2023-05-05 |
Family
ID=81457787
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202180062069.5A Pending CN116076161A (en) | 2020-11-05 | 2021-10-27 | Heating nozzle and heating nozzle unit |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7370075B2 (en) |
| KR (1) | KR20230037625A (en) |
| CN (1) | CN116076161A (en) |
| TW (1) | TW202228168A (en) |
| WO (1) | WO2022097546A1 (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010253503A (en) * | 2009-04-23 | 2010-11-11 | Miyachi Technos Corp | Heater chip and joining apparatus |
| JP2011000639A (en) * | 2009-05-19 | 2011-01-06 | Miyachi Technos Corp | Heater chip and welding device |
| CN102095517A (en) * | 2010-11-26 | 2011-06-15 | 中国航空工业集团公司北京长城计量测试技术研究所 | High-temperature temperature sensor based on surface-modified tungsten-rhenium thermocouple |
| CN107848063A (en) * | 2015-08-28 | 2018-03-27 | 株式会社工房Pda | Heat chip, coupling apparatus and associated methods |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3968205B2 (en) | 2000-03-30 | 2007-08-29 | 太陽誘電株式会社 | Heater chip for thermocompression bonding and manufacturing method thereof |
| JP2012222316A (en) | 2011-04-14 | 2012-11-12 | Apollo Giken:Kk | Thermal compression bonding heater chip, and thermal compression bonding method |
| JP2014082004A (en) | 2012-10-12 | 2014-05-08 | Murata Mfg Co Ltd | Heater chip for thermocompression bonding and manufacturing method of winding electronic component |
-
2020
- 2020-11-05 JP JP2020185095A patent/JP7370075B2/en active Active
-
2021
- 2021-10-27 WO PCT/JP2021/039630 patent/WO2022097546A1/en active Application Filing
- 2021-10-27 CN CN202180062069.5A patent/CN116076161A/en active Pending
- 2021-10-27 KR KR1020237004857A patent/KR20230037625A/en unknown
- 2021-11-02 TW TW110140770A patent/TW202228168A/en unknown
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010253503A (en) * | 2009-04-23 | 2010-11-11 | Miyachi Technos Corp | Heater chip and joining apparatus |
| JP2011000639A (en) * | 2009-05-19 | 2011-01-06 | Miyachi Technos Corp | Heater chip and welding device |
| CN102095517A (en) * | 2010-11-26 | 2011-06-15 | 中国航空工业集团公司北京长城计量测试技术研究所 | High-temperature temperature sensor based on surface-modified tungsten-rhenium thermocouple |
| CN107848063A (en) * | 2015-08-28 | 2018-03-27 | 株式会社工房Pda | Heat chip, coupling apparatus and associated methods |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20230037625A (en) | 2023-03-16 |
| JP7370075B2 (en) | 2023-10-27 |
| WO2022097546A1 (en) | 2022-05-12 |
| TW202228168A (en) | 2022-07-16 |
| JP2022074764A (en) | 2022-05-18 |
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